• Journal of the Institute of Electronics and Information Engineers
• /
• v.52 no.8
• /
• pp.159-165
• /
• 2015

In this paper, we designed and tested of the passive millimeter-wave imaging system in near range. The proposed passive millimeter-wave imaging system consists two parts. The first part is a 94 GHz band millimeter imaging sensor which is coupled to an antenna, two LNAs, and a diode detector. The second part is a control unit. The control unit is consists of the 2-axes Cartesian robot, the data acquisition (DAQ), and imaging program. The 2-axes Cartesian robot should be able to scan a 2-D image of the metalic tools, IC card and plastic objects, with a raster scanning method. The passive millimeter-wave image of $20{\times}20$ pixels is acquired within less than 60s, and is immediately displayed and stored for post processing.In order to improve the image quality, interpolation methods are applied.

• Journal of the Korean Institute of Gas
• /
• v.15 no.4
• /
• pp.21-26
• /
• 2011

Type-3 cylinder liner has a limitation of machining the standard specimen for fracture toughness test because it has approximately 5 mm in thickness as well as a curvature. Hence, it needs to be employed a miniature specimen test technique to evaluate fracture toughness of the cylinder liner. In this study, small punch (SP) test method was employed to evaluate fracture toughness of the cylinder liner. Load-displacement curve result measured from the SP test showed that the liner material was failed during membrane stretching in the general SP load-displacement curve. Additionally, it was shown that liner material was isotropic although the amount of plastic deformation was different depending on the direction due to manufacturing process characteristics. Fracture toughness, $J_{Ic}$, was evaluated using the SP test data. The value of fracture toughness obtained was $13.0kJ/m^2$. This value was similar to that of the same kind of materials. Therefore, the fracture toughness evaluated using the SP test data was reasonable.

• Journal of Welding and Joining
• /
• v.17 no.1
• /
• pp.124-132
• /
• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Journal of Mechanical Science and Technology
• /
• v.16 no.7
• /
• pp.902-910
• /
• 2002

Cast stainless steel may experience embrittlement when it is exposed approximately to 300$\^{C}$ for a long period. In the present investigation, the three classes of the thermally-aged CF8M specimen were prepared using an artificially-accelerated aging method. After the specimens were held for 300, 1800 and 3600hrs. at 430$\^{C}$, respectively, the specimens were quenched in water which is at room temperature. Load versus load line displacement curves and J-R curves were obtained using the unloading compliance method. talc values were obtained using the ASTM E813-87 and ASTM E 813-81 methods. In addition to these methods, talc values were obtained using the SZW (stretch zone width) method described in JSME S 001-1981. The results of the unloading compliance method are J$\_$Q/=543.9kJ/㎡ for virgin materials. The values of J$\_$IC/ for the degraded materials at 300, 1800 and 3600hrs. are obtained 369.25kJ/㎡, 311.02kJ/㎡, 276.7kJ/㎡, respectively. The results obtained by the SZW method are compared with those obtained by the unloading compliance method. Both results are quite similar. Through the elastic-plastic fracture toughness test, it is found that the value of loc is decreased with an increase of the aging time.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.352.1-352.1
• /
• 2014

Indium Tin Oxide (ITO) films are the most extensively studied and commonly used as ones of TCO films. The ITO films having a high electric conductivity and high transparency are easily fabricated on glass substrate at a substrate temperature over $250^{\circ}C$. However, glass substrates are somewhat heavy and brittle, whereas plastic substrates are lightweight, unbreakable, and so on. For these reasons, it has been recently suggested to use plastic substrates for flexible display application instead of glass. Many reaearchers have tried to produce high quality thin films at rood temperatures by using several methods. Therefore, amorphous ITO films excluding thermal process exhibit a decrease in electrical conductivity and optical transparency with time and a very poor chemical stability. However the amorphous Indium Gallium Zinc Oxide (IGZO) offers several advantages. For typical instance, unlike either crystalline or amorphous ITO, same and higher than a-IGZO resistivity is found when no reactive oxygen is added to the sputter chamber, this greatly simplifies the deposition. We reported on the characteristics of a-IGZO thin films were fabricated by RF-magnetron sputtering method on the PEN substrate at room temperature using 3inch sputtering targets different rate of Zn. The homogeneous and stable targets were prepared by calcine and sintering process. Furthermore, two types of IGZO TFT design, a- IGZO source/drain material in TFT and the other a- ITO source/drain material, have been fabricated for comparison with each other. The experimental results reveal that the a- IGZO source/drain electrode in IGZO TFT is shown to be superior TFT performances, compared with a- ITO source/drain electrode in IGZO TFT.

• Journal of Ocean Engineering and Technology
• /
• v.15 no.3
• /
• pp.75-80
• /
• 2001

The elastic plastic fracture toughness of this material is evaluated by the an unloading compliance method according to the ASTM E813-97 and E1152-97 method on the smooth and side groove 1CT specimens. The effect of smooth and side groove is studied on the material tearing modulus and characterizes the crack tip field under the plane stress and strain. SG-365 steel is observed that J-R curve and Tmat value decrease as 0%, 20%, 30%, and 40%. The 40% side grooved specimen is very useful in estimation of the $J_IC$. Because it is much easier than the smooth specimen to the onset of the ductile tearing by the R curve method. Besides. it improves the accuracy of toughness values, decreases the scattering the them and tunneling and shear lip by the side groove. Applicability of tearing modulus($T_J$ proposed by paris et al as instability panameter for this material is investigated.

• Computers and Concrete
• /
• v.4 no.3
• /
• pp.221-241
• /
• 2007

Based on the experiment results, the damage and fracture behavior of concrete at the ages of 1d, 2d, 7d and 28d, in three-point bending and uniaxial tensile tests, were simulated with a finite element program, ABAQUS. The critical stress intensity factor $K_{IC}^s$ and the critical crack tip opening displacement ($CTOD_C$) of concrete were calculated with effective-elastic crack approach for the three-point bending test of grade C30 concrete. Based on the crack band model, a bilinear strain-softening curve was derived to simulate the LOAD-CMOD curves and LOAD-Displacement curves. In numerical analysis of the uniaxial tension test of concrete of grade C40, the damage and fracture mechanics were combined. The smeared cracking model coupling with damaged variable was adopted to evaluate the onset and development of microcracking of uniaxial tensile specimen. The uniaxial tension test was simulated by invoking the damage plastic model which took both damage and plasticity as inner variables with user subroutines. All the numerical simulated results show good agreement with the experimental results.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.11a
• /
• pp.33-42
• /
• 2015

오늘날 연성회로기판(FCCL : Flexible Copper Clad Laminate)은 디스플레이, 스마트폰, 자동차, 항공, 의료 기기, 산업용 컨트롤 기기 등 거의 모든 고급 전자 제품들에 사용되고 있다. 특히 디스플레이 분야에서는 뛰어난 연성과 내구성을 바탕으로 경박단소화에 유리할 뿐만 아니라 구동부에 적용이 가능한 장점 등으로 그 적용처가 점점 늘어나고 있는 추세이다. 이 가운데서도 LCD와 OLED의 구동소자(Display Driver IC)를 장착하는 COF(Chip on Film)는 대표적인 연성회로기판(FCCL) 적용 부품으로서, 최근 인기를 끌고 있는 디스플레이의 제로-베젤(Zero-bezel)을 가능케 하는 핵심 부품이다. COF용 연성회로기판(FCCL) 소재로는 우수한 평탄도, 파인피치(Fine-pitch)구현성, 내굴곡성, 광투과성 등을 보유하고 있는 Sputtering Type FCCL이 사용되고 있다. 특히 최근 Display 분야의 화두가 되고 있는 POLED(Plastic-OLED) 패널을 장착한 Flexible Mobile 디스플레이의 경우, 기존의 COG(Chip on Glass) 접합방식이 아닌 COF 접합방식을 채택하고 있으며, 기존의 단면 COF보다 3배의 고해상도 구현이 가능한 양면 COF를 채택하기에 이르렀다. 기존의 COF 제작공정과 달리 Semi Additive 공정으로 제작되는 양면 COF 시장의 태동으로 양면 연성회로기판(FCCL)의 수요 증가가 예상되는 등 최근 디스플레이 기술 발전은 소재 분야에도 큰 변화를 잉태하고 있다. 이러한 최근 디스플레이 업계의 고해상도, 고속 신호 전송, 슬림화, Flexible 추세에 대응 가능한 최적의 특성을 보유하고 있는 Sputtering Type FCCL을 중심으로 디스플레이의 발전에 대응하는 소재의 기술 개발 동향을 살펴보고자 한다.

• Proceedings of the KSR Conference
• /
• 2008.06a
• /
• pp.535-544
• /
• 2008

Unlike MS(Magnetic Stripe), SMART CARD is equipped with COS(Chip Operating System) consisting of the Microprocessor and Memory where information can be stored and processed, and there are two types of cards according to the contact mode; the contact type that passes through a gold plated area and the contactless one that goes through the radio-frequency using an antenna embedded in the plastic card. the contactless IC card used for the transportation card was first introduced into local area buses in Seoul, and expanded throughout the country so that it has removed the inconvenience such as possession of cash, fare payment and collection. Focusing on the Seoul metropolitan area in 2004, prepaid and pay later cards were adopted and have been used interchangeably between a bus and subway. The card terminal compatible between a bus and subway is Proximity Integrated Circuit Card(PICC) as international standards(1443 Type A,B), communicates in the 13.56MHz dynamic frequency modulation-demodulation system, and adopts the Multi Secure Application Module(SAM). In the second half of 2009, the system avaliable nationwide will be built when the payment SAM standard is implemented.

• Advanced Composite Materials
• /
• v.16 no.2
• /
• pp.95-113
• /
• 2007

Experimental investigations of interlaminar mechanical properties for carbon fiber reinforced plastic (CFRP) laminates were carried out using aramid fiber ($Kevlar^{(R)}$-29 1000d) and carbon fiber (TR40-1K 612d, Mitsubishi Rayon) stitching. Various carbon fiber (CF) stitch densities were used to prepare a number of CF stitched CFRP laminates for double cantilever beam (DCB) tests. An insert tongue-type loading fixture, developed by the Japan Aerospace Exploration Agency (formerly the National Aerospace Laboratory of Japan), was also employed in the DCB test. Interlaminar tension tests were carried out under an out-of-plane directional loading using a single CF stitch thread in the CFRP laminates. The DCB test results clarified that the relationship between the volume fractions of the CF stitch thread ($V_{ft}$) and mode I critical energy release rate ($G_{Ic}$) showed a mostly linear function with a higher gradient than that of the $Kevlar^{(R)}$ stitched CFRP laminates. The CF stitched CFRP tension test results indicated that the consumption energy per unit area ($E_i$) was larger than that of $Kevlar^{(R)}$ stitched CFRP laminates.