• 한국재료학회지
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• 제16권2호
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• pp.80-84
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• 2006

The removal efficiency of Cu and Fe contaminants on the silicon wafer surface was examined to investigate the effect of cleaning solutions on the behavior of metallic impurities. Silicon wafers were intentionally contaminated with Cu and Fe solutions by spin coating and cleaned in different types of cleaning solutions based on $NH_4OH/H_2O_2/H_2O\;(SC1),\;H_2O_2/HCl/H_2O$ (SC2), and/or HCl/$H_2O$ (m-SC2) mixtures. The concentration of metallic contaminants on the silicon wafer surface before and after cleaning was analyzed by vapor phase decomposition/inductively coupled plasma-mass spectrometry (VPD/ICP-MS). Cu ions were effectively removed both in alkali (SC1) and in acid (SC2) based solutions. When $H_2O_2$ was not added to SC2 solution like m-SC2, the removal efficiency of Cu impurities was decreased drastically. The efficiency of Cu ions in SC1 was not changed by increasing cleaning temperature. Fe ions were soluble only in acid solution like SC2 or m-SC2 solution. The removal efficiencies of Fe ions in acid solutions were enhanced by increasing cleaning temperature. It is found that the behavior of metallic contaminants as Cu and Fe from silicon surfaces in cleaning solutions could be explained in terms of Pourbaix diagram.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.256-257
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• 2015

마그네슘 합금은 낮은 비중, 높은 비강도, 주조성 및 절삭가공성, 치수안정성, 내흠집성이 우수한 특성을 지니고 있는 경량금속으로써 우수한 주조성과 상온강도, 연신율을 나타낸다. 최근에는 마그네슘 합금을 사용한 IT 기기의 케이스 및 자동차 내, 외장 부품 등의 제품이 다양하게 출시되어지며 금속 질감의 감성 기능까지 적용시킨 전자 기기 제품에 대한 수요가 급증하고 있는 추세이다. 하지만 마그네슘 합금의 낮은 부식 저항성은 마그네슘 합금을 적용시킨 제품에 큰 단점으로 작용되고 있으며 이를 해결하기 위한 연구가 활발히 진행 중이다. 본 연구에서는 플라즈마 전해산화법과 실리카 졸-겔 코팅법을 이용하여 마그네슘 합금의 내부식성을 향상시킴과 동시에 금속질감의 감성 기능을 구현하고자 하였다. 플라즈마 전해산화 공정으로 형성된 산화피막층과 $SiO_2$ 코팅으로 형성된 코팅층의 표면과 단면에 대해서는 FE-SEM(Field emission Scanning Electron Microscope)과 FE-TEM(Field emission Transmission Electron Microscope)으로써 확인하였고 전기화학적 특성 분석을 통한 동전위(Potentiodynamic polarization)와 EIS(Eletrochemical Impedance Spectroscopy) 그리고 Salt spray등을 분석하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.63-63
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• 2018

본 연구는 플라즈마 전해 산화 (PEO) 및 RF (Radio Frequency) 스퍼터링을 이용한 2 단계 접근법에 의해 처리 된 MgO / Ni-Cr의 고내식성 이중층 코팅을 제조하기 위해 수행되었다. 이를 위해 $100mA/cm^2$ 교류 조건에서 180 s PEO를 한 후 150W 에서 900s RF 스퍼터링을 수행 하였다. 코팅의 형태는 주사전자현미경(SEM)을 사용하여 관찰되었으며 코팅의 상조성은 X-선 회절(XRD) 및 X-선 광전자 분광법(XPS)을 사용하여 분석하였다. SEM 이미지는 스퍼터링 된 Ni-Cr이 크랙의 대부분과 미세한 미세 공극을 덮어 코팅 결함이 감소함을 보여 주었다. 따라서, 코팅 된 샘플의 거칠기 값은 스퍼터링 공정 후에 감소되었다. 단면 이미지로부터, 스퍼터링된 코팅층은 낮은 두께 때문에 거의 검출되지 않았다. EDS, XRD 및 XPS를 사용한 조성 분석은 금속 상태의 형태로 Ni 및 Cr 존재를 나타내었고 XPS에서 NiCr2O4 부동태 피막이 검출되었다. MgO / Ni-Cr 이중층 코팅의 내부식성은 MgO / Ni-Cr 이중층을 가진 샘플의 금속 원소와 비교하여 우수한 부식 특성을 나타내는 전위 역학적 분극 시험 및 전기 화학적 임피던스 분광법으로 평가 하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 E
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• pp.1758-1760
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• 1998

MgO Protecting layer in AC PDP prevents ion bombardment in discharge plasma. The MgO layer also has the additional importance in lowering the firing voltage due to a large secondary electron emission coefficient. Until now, the MgO protecting layer is mainly prepared by E-beam Evaporation. However, the optimum activation manufacturing process of MgO thin film wasn't well known. Therefore in this study, after MgO protecting layer is prepared on dielectric layer by E-beam evaporation and liquid MgO spin coating, we carried out activation process of MgO thin film as a parameter of Temperature, Operating time and Operating pressure. In addition, discharge characteristics are also studied as a parameter of activation conditions.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.103.1-103.1
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• 2016

플라즈마 코팅은 진공 및 진공에서 발생된 플라즈마 대기압 플라즈마를 이용하여 기판에 코팅하는 기술을 의미하는 것으로 최근 다양한 코팅 소스 및 물질계가 개발되면서 그 응용을 넓혀가고 있다. 플라즈마 코팅은 물리증착 및 화학증착에서 주로 이용하고 있는데 플라즈마를 이용하는 대표적인 기술로 스퍼터링과 음극아크증착, 플라즈마 화학증착 등이 있다. 스퍼터링은 기존의 마그네트론 스퍼터링에 비해 이온화율이 대폭 향상된 HIPIMS(High Power Impulse Magnetron Sputtering) 기술이 개발되면서 경질피막 제조의 신기술로 자리 잡고 있고 음극아크증착의 경우는 다양한 Filtered 아크소스가 개발되면서 후막 고경도 DLC(Diamond-like Carbon) 등 기존의 방법으로 달성할 수 없었던 코팅층의 제조가 가능하게 되었다. 최근 수명 및 물성이 크게 향상된 소재들이 다양하게 개발되었는데 이들 소재는 가공이 잘 되지 않는 난삭재가 대부분이어서 기존의 가공 Tool이 한계를 드러내고 있다. 이에 따라 난삭재 가공용 새로운 Tool에 대한 수요가 크게 증가하고 있는데 이에 대응하는 유력한 방법 중의 하나가 플라즈마를 이용한 경질코팅이다. 이렇듯 플라즈마 코팅은 난삭재가공용 Tool을 비롯하여 기계나 자동차 부품의 고경도, 저마찰 코팅, 기능성 코팅 등 다양한 분야에 응용을 확대하고 있다. 본 논문에서는 플라즈마 코팅의 최신 기술개발 동향과 그 응용에 대해 고찰하고자 한다.

• 반도체디스플레이기술학회지
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• 제13권1호
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• pp.7-12
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• 2014

In this study, we investigate the effects of corona-discharge pre-treatment on the properties of carbon nanotubes (CNTs) which are used as flexible transparent electrodes. The CNTs are deposited on PET (polyethylene terephthalate) substrates using a spray coating method. Prior to the deposition of CNTs, the PET substrates are corona-treated by varying the feeding directions of the PET substrate and the numbers of treatments. The variations in the surface morphologies and roughnesses of the PET substrates due to corona-treatment are characterized via atomic force microscopy (AFM). Dynamic contact angles (DCAs) of the corona-treated PET substrates are measured and analyzed as functions of the treatment conditions. Also, the sheet resistances and visible-range transmittances of the CNTs deposited on PET substrates are measured before and after bending test. The experimental results obtained in this study provide strong evidences that the adhesive forces between CNTs and PET substrates can be substantially enhanced by corona-discharge pretreatment.

• 한국재료학회지
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• 제30권11호
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• pp.573-580
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• 2020

YAG (Yttrium Aluminum Garnet, Y₃Al₅O₁₂) has excellent plasma resistance and recently has been used as an alternative to Y₂O₃ as a chamber coating material in the semiconductor process. However, due to the presence of an impurity phase and difficulties in synthesis and densification, many studies on YAG are being conducted. In this study, YAG powder is synthesized by an organic-inorganic complex solution synthesis method using PVA polymer. The PVA solution is added to the sol in which the metal nitrate salts are dissolved, and the precursor is calcined into a porous and soft YAG powder. By controlling the molecular weight and the amount of PVA polymer, the effect on the particle size and particle shape of the synthesized YAG powder is evaluated. The sintering behavior of the YAG powder compact according to PVA type and grinding time is studied through an examination of its microstructure. Single phase YAG is synthesized at relatively low temperature of 1,000 ℃ and can be pulverized to sub-micron size by ball milling. In addition, sintered YAG with a relative density of about 98 % is obtained by sintering at 1,650 ℃.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권12호
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• pp.565-569
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• 2006

Plasma enhanced chemical vapor deposition(PECVD) is a well established technique for the deposition of hydrogenated film of silicon nitride (SiNx:H), which is commonly used as an antireflection coating as well as passivating layer in crystalline silicon solar cell. PECVD-SiNx:H films were investigated by varying the deposition and annealing conditions to optimize for the application in silicon solar cells. By varying the gas ratio (ammonia to silane), the silicon nitride films of refractive indices 1.85 - 2.45 were obtained. The film deposited at $450^{\circ}C$ showed the best carrier lifetime through the film deposition rate was not encouraging. The film deposited with the gas ratio of 0.57 showed the best carrier lifetime after annealing at a temperature of $800^{\circ}C$. The single crystalline silicon solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrate of size $125mm{\times}125mm$ (pseudo square) was found to have the conversion efficiencies as high as 17.05 %. Low cost and high efficiency silicon solar cells fabrication sequence has also been explained in this paper.

• 한국세라믹학회지
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• 제37권1호
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• pp.96-101
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• 2000

Comparative studies on microstructure, and mechanical and anti-oxidation properties between TiN and Ti-Si-N films were performed. The Ti-Si-N films were deposited on high-speed steel and silicon wafer substrates by plasma-assisted chemcial vapor deposition(PACVD) technique. The Si addition to TiN film caused to change the microstructure such as grain size refinement, randomly multi-oriented microstructure, and nano-sized codeposition of silicon nitride in the TiN matrix. The Ti-Si-N film, contains Si content of ∼7 at.%, showed the micro-hardness value of ∼3400 HK, which was higher than the pure TiN film whose hardness was ∼1500HK. The Ti-Si(7 at.%)-N film also showed much improved anti-oxidation properties compared with those of the pure TiN film. These properties were also related to the microstructure of Ti-Si(7 at.%)-N film was formed and retarded further oxidation of the nitridelayer. These properties were also related to the microstructure of Ti-Si(7 at.%)-N film which was characterized by nano-sized precipitates of silicon nitride phase in the TiN matrix and randomly oriented grains.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 추계학술발표회 초록집
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• pp.4-5
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• 2006

This paper represents modeling and optimization techniques for solar cell process on single-crystalline float zone (FZ) wafers with high efficiency; There were the four significant processes : i)emitter formation by diffusion, anti-reflection-coating (ARC) with silicon nitride using plasma-enhanced chemical vapor deposition (PECVD); iii)screen-printing for front and back metallization; and iv)contact formation by firing. In order to increase the performance of solar cells, the contact formation process is modeled and optimized. This paper utilizes the design of experiments (DOE) in contact formation to reduce process time, fabrication costs. The experiments were designed by using central composite design which is composed of $2^4$ factorial design augmented by 8 axial points with three center points. After contact formation process, the efficiency of the solar cell is modeled using neural networks. This model is used to analyse the characteristics of the process, and to optimize the process condition using genetic algorithms (GA). Finally, find optimal recipe for solar cell efficiency.