• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.3
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• pp.107-110
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• 2006

We fabricated the monolayers onto QCM by self-assembly using viologen, which has been widely used as electron acceptor. A gold electrode of the QCM was cleaned by piranha solution and prepared the ethanol-acetonitrile(1:1) solution with 2 m mol/l viololgen compounding of pure hi gas. We determined the time dependence to resonant frequency shift during self-assembly process and the electrochemical behavior of the self-assembled viologen monolayers by cyclic voltammetry. With increasing scan rate, the redox peak current of the viologen increased linearly. This was signified that the redox reaction was reversible. The EQCM measurements revealed the anions transfer during redox reactions, respectively. From the EQCM data, the well-defined shape peaks were nearly equal charges by cyclic voltammetry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.7
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• pp.622-627
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• 2005

In this study, electrical properties of self-assembled dipyridinium dithioacetate molecule onto the Au(111) substrate is observed using Scanning Tunneling Microscopy(STM) by vortical structure of STM probe. At first, the Au(111) substrate is cleaned by piranha solution$(H_2SO_4:H_2O_2\;=\;3:1)$. Subsequently, 1 mM/ml of dipyridinium dithioacetate molecule is self-assembled onto the Au(111) surface. Using STM, the images of dipyridinium dithioacetate molecule which is self-assembled onto the Au(111) substrate, can be observed. In addition, the electrical properties(I-V) of dipyridinium dithioacetate can also be examined by using Scanning Tunneling Spectroscopy(STS). From the results of the measurement of the current-voltage(I-V), the property of Negative Differential Resistance(NDR) that shows the decreases of current according to the increases of voltage is observed. We found the NDR voltage of the dipyridinium dithioacetate is -1.42 V(negative region) and 1.30 V(positive region), respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.485-488
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• 2004

본 연구에서는 dipyridinium dithioacetate 분자를 Au(111) 표면에 자기조립하여 STM 탐침-유기 단분자막-Au(111)기판의 수직구조로 STM 측정시스템을 이용하여, 전기적 특성을 관찰하였다. 먼저 Au(111)기판을 Piranha용액$(H_2SO_4:H_2O_2=3:1)$으로 Au 표면을 전처리 하였다. 전처리한 Au(111) 기판을 dipyridinium dithioacetate 1mol/ml 농도로 자기조립 하였으며, 자기조립막의 표면 구조를 STM으로 관찰하였다. dipyridinium dithioacetate의 전기적 특성은 STM 탐침-유기단분자막-Au(111) 기판의 수직구조로 STS를 이용하여 조사하였다. 전압과 전류 측정에서 전압이 증가함에 따라 전류가 감소하는 부성 미분저항(NDR)의 특성이 관찰 되었다. NDR 수치가 $-545\;[m\Omega/cm^2]$였고, PVCR은 1.64:1 이었다.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.326-328
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• 1995

SiC buffer layers were grown on Si(100) substrates by ultra-high-vacuum electron cryclotron resonance plasma (UHV ECR plasma) from $CH_4/H_2$ mixture at 700$^{\circ}C$. The electron densities and temperature were measured by single probe. The axial plasma potentials measured by emissive probe had the double layer structure at positive substrate bias. Piranha cleaning was carried out as ex-situ wet cleaning. Clean and smooth silicon surface were prepared by in-situ hydrogen plasma cleaning at 540$^{\circ}C$. A short exposure to hydrogen plasma transforms the Si surface from 1$\times$1 to 2$\times$1 reconstruction. It was monitored by reflection high energy electron diffraction (RHEED). The defect densities were analysed by the dilute Schimmel etching. The results showed that the substrate bias is important factor in hydrogen plasma cleaning. The low base pressure ($5\times10^{-10}$ torr) restrains the $SiO_2$ growth on silicon surface. The grown layers showed different characteristics at various substrate bias. RHEED and K-ray Photoelectron spectroscopy study showed that grown layer was SiC.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1390-1391
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• 2006

본 연구에서는 전도성 분자로 잘 알려진 4,4-Di(ethynyl phenyl) -2'-nitro-1-(thioacetyl)-benzene(nitro - benzene) 분자를 Au (111) 표면에 자기조립하고, ultra high vacuum scanning tunneling microscopy (UHV-STM)을 사용하여 STM tip과 sample 사이의 거리를 변화시키면서 전기전도 특성을 측정하였다. Au 기판제작은 연증착시스템 (Thermal Evaporation System)으로 제작하였으며, piranha 용액 ($H_{2}SO_{4}\;:\;H_{2}O_{2}$=3:1)을 사용하여 전치리한 후, 자기조립 단분자막 (SAMs)을 형성하였다. 먼저 1-octanethiol을 ethanol solution용액 1 mM/L 농도에서 24시간 동안 자기조립한 후에, ethanol를 solution 용액으로 이용하여 nitro-benzene를 0.1 nM/L 농도로 암실에서 30분간 자기조립 하였다. 자기조림 후 solution을 제거하기 위해 에탄올로 세척하여 $N_2$로 건조시켰다. 이 조건하에서 UHV-STM을 사용하여 nitro-benzene SAMs의 실시간 모폴로지의 변화에 따른 nitro-benzene의 전기전도 특성을 STM tip - SAMs - Au 기판의 수직구조로 STM tip과 nitro-benzene의 거리를 변화시키면서, tunneling current을 조사하였다. 측정 결과 Z-position 변화에 대한 tunneling current와 resistance의 변화를 확인할 수 있었다.

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.50-53
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• 2004

본 논문에서는 Si wafer와 Cu사이의 밀착력을 증가시키기 위해 Si wafer전처리 후 plasma와 SAMs처리 방법에 의한 Cu도금의 형성에 관한 방법을 설명하였다. Si wafer를 Piranha solution과 $0.5\%$ HF처리 후 유기박막인 SAMs과 plasma를 이용하는 방법으로 wafer와 Cu층 사이의 밀착력을 증가시켰다. 도금층의 밀착력은 scratch test 로 측정하였으며, AEM을 이용해 시편에 형성된 패턴의 형태를 관찰하고 SEM과 EDS를 이용해 시편의 조직을 관찰하였다. 그 결과 Si wafer를 O2, He, SAMs를 혼합처리 했을 때 밀착성이 가장 우수하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.458-461
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• 2004

In order to improve the adhesion properties of copper, MPS(3-mercaptopropyltrimethoxysilane) organic film were employed. The plasma pretreatment in pure He or $He/O_{2}$ mixed gas environment greatly increased adhesion force. Adhesion force was measured by scratch test with nano indenter. Microstructures and surface roughness were observed with scanning electron microscope(SEM). The characteristics of MPS layer for pretreatment were studied with flourier transform infrared spectroscope(FT-IR) and contact angle tester. The heighest adhesion was achieved in the specimen pretreated with mixed plasma and NPS coating, which was 56mN. Other specimen showed lower value by $20{\%}$ to $30{\%}$. The roughness of substrate was not affected by the bonding strength of copper plating.

• Journal of the Korea Safety Management & Science
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• v.13 no.2
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• pp.91-96
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• 2011

The purpose of this study was to minimize of entrance surface dose (ESD) at the eye using high kVp technique in the computed radiography. We used REX-650R (Listem, Korea) general X-ray unit, and external detector with ESD dosimeter of Piranha 657 (RTI Electronics, Sweden). We used head of the whole body phantom. The total 64 images of X-ray anterior-posterior of skull were acquired using the film/screen (F/S) method and the digital of computed radiography method. The three radiology professor of more 10 years of clinical career evaluated a X-rays images in the same space by 5-point scale. The external detector was performed measurement of ESD of three times by same condition on the eye of the head phantom. The good image quality in the F/S method (90 kVp, 2.5 mAs) showed at the minimized ESD of 0.310 ${\pm}$ 0.001 mGy. the good image quality in the computed radiography method (90 kVp, 2.0 mAs) showed at the minimized ESD of 0.180 ${\pm}$ 0.002 mGy (P = 0.002). Finally the radiation dose could reduced about 50% in the computed radiography method more than the F/S method. In addition the eye entrance surface dose using high kVp technique with the computed radiography was reduced 92% more than conventional technique (F/S method).

• Clean Technology
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• v.10 no.1
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• pp.47-51
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• 2004

현재 반도체 공정에서 사용되는 세정기술은 대부분이 1970년대 개발된 RCA 세정법인 과산화수소를 근간으로 하는 습식 세정으로, 표면의 입자를 제거하기 위한 SC-1 세정액은 강력한 산화제인 과산화수소에 의한 표면과 입자의 산화와 암모니아에 의한 표면의 에칭이 동시에 일어나 입자를 표면으로부터 분리시킨다. 금속 불순물을 제거하기 위한 SC-2 세정액은 염산과 과산화수소 혼합액을 사용하며 금속 불순물을 용해시켜 알칼리나 금속 이온을 형성하거나 용해 가능한 화합물을 형성시켜 제거한다. 또한 황산과 과산화수소를 혼합한 Piranha 세정액은 효과적인 유기물 제거제로서 웨이퍼에 오염된 유기물을 용해 가능한 화합물로 만들거나 과산화수소에 의해 형성되는 산화막내에 오염물을 포함시켜 불산 용액으로 산화막을 제거할 때 함께 제거된다. 최근 금속과 산화막을 동시에 제거하기 위해 희석시킨 불산에 과산화수소를 첨가한 세정공정이 사용되고 있으며 불산에 의해 표면의 산화막이 제거될 때 산화막내에 포함된 금속 불순물을 동시에 제거시킬 수 있다. 그러나 이와 같이 습식세정액 내에 공통적으로 포함되어 있는 과산화수소의 분해는 그만큼 가속화되어 사용되는 화학 약품의 양이 그만큼 증가하게 되고 조작하기 어려운 단점도 있다. 이를 해결하기 위해 환경친화적인 관점으로 화학약품의 사용을 최소화하는 등 RCA세정을 보완하는 연구가 계속 진행되고 있다. 본 연구에서는 RCA세정법을 환경적으로 대체할 수 있는 세정에 사용되는 전리수의 pH변화에 따른 전리수 분석을 하였다. 전리수의 제조를 위하여 전해질로는 NH4CI (HCI:H2O:NH4OH=1:1:1)를 사용하였다. pH 11 이상, ORP -700mV~-850mV인 환원수와 pH 3 이하, ORP 1000mV~1200mV인 산화수를 제조하였으며, 초순수를 첨가하여 pH 7.2와 ORP 351.1mV상태까지 조절하였다. 이렇게 만들어진 산화수와 환원수를 시간 변화와 pH 변화에 따라 Clean Room 안에서 FT-IR과 접촉각 측정기로 실험하였다. FT-IR분석에서 산화수는 pH가 높아질수록, 환원수는 낮아질수록 흡수율이 낮아졌다. 접촉각 실험에서는 산화수의 pH가 높아질수록 환원수의 pH가 낮아질수록 접촉각이 커짐을 확인하였다. 결론적으로 전리수를 이용하여 세정을 하면, 접촉성을 조절할 수 있어 반도체 세정을 가능하게 할 수 있으며, 환경친화적인 결과를 도출할 것으로 전망된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.454-454
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• 2014

Silicon microwire array is one of the promising platforms as a means for developing highly efficient solar cells thanks to the enhanced light trapping efficiency. Among the various fabrication methods of microstructures, deep reactive ion etching (DRIE) process has been extensively used in fabrication of high aspect ratio microwire arrays. In this presentation, we show precisely controlled Si microwire arrays by tuning the DRIE process conditions. A periodic microdisk arrays were patterned on 4-inch Si wafer (p-type, $1{\sim}10{\Omega}cm$) using photolithography. After developing the pattern, 150-nm-thick Al was deposited and lifted-off to leave Al microdisk arrays on the starting Si wafer. Periodic Al microdisk arrays (diameter of $2{\mu}m$ and periodic distance of $2{\mu}m$) were used as an etch mask. A DRIE process (Tegal 200) is used for anisotropic deep silicon etching at room temperature. During the process, $SF_6$ and $C_4F_8$ gases were used for the etching and surface passivation, respectively. The length and shape of microwire arrays were controlled by etching time and $SF_6/C_4F_8$ ratio. By adjusting $SF_6/C_4F_8$ gas ratio, the shape of Si microwire can be controlled, resulting in the formation of tapered or vertical microwires. After DRIE process, the residual polymer and etching damage on the surface of the microwires were removed using piranha solution ($H_2SO_4:H_2O_2=4:1$) followed by thermal oxidation ($900^{\circ}C$, 40 min). The oxide layer formed through the thermal oxidation was etched by diluted hydrofluoric acid (1 wt% HF). The surface morphology of a Si microwire arrays was characterized by field-emission scanning electron microscopy (FE-SEM, Hitachi S-4800). Optical reflection measurements were performed over 300~1100 nm wavelengths using a UV-Vis/NIR spectrophotometer (Cary 5000, Agilent) in which a 60 mm integrating sphere (Labsphere) is equipped to account for total light (diffuse and specular) reflected from the samples. The total reflection by the microwire arrays sample was reduced from 20 % to 10 % of the incident light over the visible region when the length of the microwire was increased from $10{\mu}m$ to $30{\mu}m$.