• 설비공학논문집
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• 제15권8호
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• 설비공학논문집
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• 제19권5호
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Journal of Advanced Marine Engineering and Technology
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• 제35권2호
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• pp.224-231
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• 2011

핀-휜 구조물이 삽입된 채널은 열전달이 향상되는 것으로 알려져 있다. 복잡한 핀-휜 구조물은 다공성 매체로 모사할 수 있을 만큼 매우 불규칙적인 유동을 보여준다. 본 연구는 수치해석을 통하여 핀-휜 구조물이 삽입된 채널의 열전달과 압력강하의 특성을 분석하였다. 유효유동공간비가 높고 직경이 큰 경우 실험데이터를 잘 예측 하였지만, 유효유동공간비가 낮은 경우 비교적 오차가 큰 편이었다. 유효유동 공간비가 낮을수록 유동교란이 강해져서 열전달이 증가하지만 압력강하도 증가하여 팬의 동력이 증가하기 때문에 최적점을 찾아서 설계하여야 한다. 본 연구에서는 전면유속이 5m/s 일 때, D25 모델에서는 유효유동공간비가 0.5인 지점에서, D05 모델에서는 0.9에서 압력강하가 급격하게 늘어나기 때문에 이보다 더 작은 유효유동공간비에서의 작동은 바람직하지 않다.

• 대한기계학회논문집B
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• 제41권6호
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• pp.381-387
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• 2017

수소화붕소나트륨은 안정적으로 수소가 저장된 물질이며, 촉매반응으로 수소를 용이하게 분리할 수 있다. 본 연구에서는 탈수소 반응률을 높이기 위해 비표면적이 큰 마이크로 pin fin 화학반응기를 제작하여 수소화붕소나트륨 수용액의 압력강하 및 탈수소 화학반응 실험을 수행하였다. 나노공정을 이용하여 실리콘웨이퍼에 높이 $300{\mu}m$, 직경 $50{\mu}m$의 pin fin을 축간격 1.3, 횡간격 1.5으로 엇갈림 배열하였다. 수소화붕소나트륨 수용액은 5~20 wt.% 농도로 Re수 1~60으로 공급되었으며, 초고속카메라를 이용하여 탈수소반응 유동양상을 관찰하였다. 실험 결과 마이크로 pin fin 화학반응기는 동일 수력학적직경을 가지는 직관 마이크로채널 화학반응기보다 화학반응 성능이 2.45배 우수한 반면, 압력강하는 1.5배 증가하였다.

• 설비공학논문집
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• 제18권6호
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• 설비공학논문집
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• 제22권7호
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• pp.448-453
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• 2010

Porous media containing complex fluid passage have especially large surface area per unit volume. This study is aimed to identify the heat transfer characteristics of high-porosity metal foams in a horizontal channel. Experiment is performed under various heat flux, velocity and pore density. Nusselt number decreases with higher pore density. Metal foams shows higher heat transfer coefficients than pin-fin structure with the same porosity. This is due to the more complex flow passage and larger heat transfer area based on the structure of the metal foams. The analysis on the pin-fin structure may not be suitable to the metal foam structure but should be identified extensively through further study.

• 한국산학기술학회논문지
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• 제15권9호
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• pp.5467-5473
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• 2014

최근 전자 및 기계부품 기술의 발전으로 전자 장비는 더욱 고성능화, 소형화, 다기능화 되면서 시스템 내부에 발생하는 발열부의 온도를 제어하기 위해 히트싱크가 사용된다. 본 연구에서는 내부 터널 구조의 2가지 형상의 히트싱크의 열 성능평가를 유한요소 프로그램인 ANSYS를 이용하여 수치해석 하였다. 수치해석은 자연대류 상태에서의 열 성능을 수치해석으로 비교 분석하여 냉각핀 형상에 따른 열 성능을 평가하였다. 또한 시간에 따른 열전달 특성과 온도분표의 해석결과를 기초로 하여 히트싱크의 성능평가를 예측하였다. 수치해석의 결과, 형상 A 히트싱크가 형상 B의 히트싱크보다 열 전달율이 자연대류에서 약 70% 향상되었다.

• 한국자동차공학회논문집
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• 제22권2호
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• pp.1-6
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• 2014

In-wheel driving inverter inside engine room sometimes operates in the harsh environment like high temperature of about $105^{\circ}C$. Especially, the size and power density of the inverter has become smaller and more increased. Thus, it is essential to manage the temperature of the inverter with IGBT (Insulated Gate Bipolar Transistor) switching devices for performance and endurance, because the temperature can be getting increase. In this paper, we performed the thermal flow analysis of inverter models with wave type and pin fin type cooling channels, and investigated the heat transfer characteristics of the inverter models using cooling water on channels at 8 L/min and $65^{\circ}C$. Also, we compared the thermal performance under various conditions such as coolant flow rate and layered power module structure. Therefore, we determined the feasibility of the initial inverter models and the thermal performance enhancement.