• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.8
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.5
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.2
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• pp.224-231
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• 2011

Heating and/or cooling of the channel with pin-fin structure is a promising choice for the efficient heat transfer. Complex pin-fin structure shows highly irregular behavior like porous media. This study shows the numerical analysis on the characteristic of heat transfer and pressure drop of a channel with pin-fin structure. It predicts the experimental data quite well at the high porosity region with large diameter. Low porosity activates the rigorous flow disturbance and, consequently, the enhanced heat transfer. However, the concept of optimum design should be carefully reviewed because the pressure drop is also increased with decreasing porosity at low porosity region.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.381-387
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• 2017

Dehydrogenation from the hydrolysis of a sodium borohydride ($NaBH_4$) solution has been of interest owing to its high theoretical hydrogen storage capacity (10.8 wt.％) and potentially safe operation. An experimental study has been performed on the catalytic reaction rate and pressure drop of a $NaBH_4$ solution over both a single microchannel with a hydraulic diameter of $300{\mu}m$ and a staggered array of micro pin fins in the microchannel with hydraulic diameter of $50{\mu}m$. The catalytic reaction rates and pressure drops were obtained under Reynolds numbers from 1 to 60 and solution concentrations from 5 to 20 wt.％. Moreover, reacting flows were visualized using a high-speed camera with a macro zoom lens. As a result, both the amount of hydrogenation and pressure drop are 2.45 times and 1.5 times larger in a pin fin microchannel array than in a single microchannel, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.6
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.7
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• pp.448-453
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• 2010

Porous media containing complex fluid passage have especially large surface area per unit volume. This study is aimed to identify the heat transfer characteristics of high-porosity metal foams in a horizontal channel. Experiment is performed under various heat flux, velocity and pore density. Nusselt number decreases with higher pore density. Metal foams shows higher heat transfer coefficients than pin-fin structure with the same porosity. This is due to the more complex flow passage and larger heat transfer area based on the structure of the metal foams. The analysis on the pin-fin structure may not be suitable to the metal foam structure but should be identified extensively through further study.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.9
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• pp.5467-5473
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• 2014

This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.2
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• pp.1-6
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• 2014

In-wheel driving inverter inside engine room sometimes operates in the harsh environment like high temperature of about $105^{\circ}C$. Especially, the size and power density of the inverter has become smaller and more increased. Thus, it is essential to manage the temperature of the inverter with IGBT (Insulated Gate Bipolar Transistor) switching devices for performance and endurance, because the temperature can be getting increase. In this paper, we performed the thermal flow analysis of inverter models with wave type and pin fin type cooling channels, and investigated the heat transfer characteristics of the inverter models using cooling water on channels at 8 L/min and $65^{\circ}C$. Also, we compared the thermal performance under various conditions such as coolant flow rate and layered power module structure. Therefore, we determined the feasibility of the initial inverter models and the thermal performance enhancement.