• The KIPS Transactions:PartA
• /
• v.18A no.2
• /
• pp.61-68
• /
• 2011

Memory error debugging is one of the most critical processes in improving software quality. However, due to the extensive time consumed to debug, the enhancement often leads to a huge bottle neck in the development process of mobile devices. Most of the existing memory error detection tools are based on static error detection; however, the tools cannot be used in mobile devices due to their use of large working memory. Therefore, it is challenging for mobile device vendors to deliver high quality mobile devices to the market in time. In this paper, we introduce "PinMemcheck", a pin-based memory error detection tool, which detects all potential memory errors within $1.5{\times}$ execution time overhead compared with that of a baseline configuration by applying the Pin's binary instrumentation process and a simple data structure.

• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2408-2413
• /
• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Journal of Ocean Engineering and Technology
• /
• v.14 no.4
• /
• pp.79-85
• /
• 2000

Press-fit pin connection is the solderless interference-fit between pins and plated through holes(PTH) in the printed curcuit board(PCB). Because of not only its simple assembly and absence of problems associated with soldering, but also its good mechanical and electrical characteristics, the press-fit pin connection technology has quickly gained wide acceptance in the telecommunications and computer industries. In this paper, the contact stress characteristics of the domestic CPF pin when inserted into the friction coefficients were compared and the stress variations of the compliant part of the pin, which have an influence on the performance, were displayed with the time and arc length after complete connected. It is supposed that the results will provide useful data to improve the performance of the pin-PCB interconnection mechanism.

• Journal of the korean Society of Automotive Engineers
• /
• v.15 no.1
• /
• pp.89-99
• /
• 1993

In this research, important mechanical characteristics of Compliant Press-Fit Pin and PHT are studied through the analysis of deformation mechanisms of Press-Fit Pin and by elastic-plastic finite element method. The direct data for the optimal design of pin was obtained without interfere with the criterion on insertion force and retention force. Also, the insertion force and retention force of new type pin were measured by precision type tensile testing machine and it revealed good agreement with analytical results. In conclusion, it is believed that above results will contribute satisfactorily to the practical design of Press-Fit Pin.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.18 no.8
• /
• pp.854-861
• /
• 2007

In this paper, a compact L-shaped shorted pin patch to be used at local oscillator port in radar detector is proposed. Shorted pin patch operates as short-open cavity while conventional patch operates as open-open cavity. Shorted pins are L-shaped to obtain quarter wave length and three-quarter wave length resonance for the fundamental(X-band) and $2^{nd}(3^{rd})$(K- and Ka-band) mode resonance frequency, respectively. Thus, the proposed patch can be compact. It is also possible to operate at triple band(X-, K-, Ka-band) with small return loss in radar detector, It is expected that shorted pin patch could improve radar detector sensitivity.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1995.10a
• /
• pp.807-810
• /
• 1995

The effects of weae particles on the friiction and wear behavior of metals in dry sliding conditions are presented. The tribological test were performed using pure metal specimens which were selected based on their degrees of compatibility and hardness ratio. Friction and wear experiments were conducted using both pin-on-disk and reciprocating pin-on-plate type tribotesters to investigate the effect of motion history. Experimental results show that in the case of dry sliding the frictional behavior observed during pin-on-disk test differed form that of pin-on-reciprocator test for the given set of material pairs. The friction coefficient and wear rate were found to be higher for the pin-on-disk tests. It is suspected that the sliding motion of the pin affects the wear particle dynamics, which in turn influences the frictional behavior. The effect of material pair properties seemed to be relatively smaller than that of wear particles. The results of this paper is expected to aid in the design of mechanical systems for best tribological performance.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2003.10a
• /
• pp.163-166
• /
• 2003

Since the track pin is subjected to large transverse track tension from the track link, conventional track pins for high mobility vehicles are usually made of high strength steel, which increases the weight of tracked vehicles due to the high density of steel. In this paper, several composite materials were employed for track pin design to reduce weight of track pin as well as to enhance the fatigue life of rubber bushings. Especially the effects of shear stiffness of the composites on the life of rubber bushing were investigated.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.22 no.8
• /
• pp.736-741
• /
• 2012

Squeak noise is studied by using the pin-on-disk system with aluminum pin and steel disk. Noise induced by friction is measured with respect to the normal loads and sliding speeds. The negative slope of friction-velocity curve is seen when the squeak noise occurs. It is found that the normal load influences on the sound level of squeak noise. From the hammering test, the major frequency of the squeak noise is shown to correspond to one of system modes, which implies that squeak phenomenon arises from the unstable system modes. The result of FE analysis shows that the major squeak mode is the bending mode of the pin.

• Transactions of Materials Processing
• /
• v.10 no.2
• /
• pp.151-159
• /
• 2001

Flow defect of a piston-pin for automobile parts is investigated in this study. In combined cold extrusion of piston-pin, lapping defect, which is a kind of flow defect, appears by the dead metal zone. This appearance evidently happens in products with a thin thickness to be pierced for the dimensional accuracy and the decrease of material loss. The flow defect that occurs in piston-pin has bad effects on the strength and the fatigue life of piston-pin. Therefore, it is important to predict and prevent defects in the early stage of process design. The best method that can prevent flow defect is removing or reducing dead metal zone through material flow control. The finite element simulations are applied to analyze the flow defect. This study proposes processes for preventing flow defect by removing dead metal zone. Then the results are compared with the experimental ones for verification. These FE simulation results are in good agreement with the experimental ones.

• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.31-36
• /
• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.