• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.50-60
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• 2023

Ball Grid Array (BGA) is a widely used package type due to its high pin density and good heat dissipation. In BGA, solder balls play an important role in electrically connecting the package to the PCB. Therefore, understanding the inelastic deformation of solder balls under various mechanical loads is essential for the robust design of semiconductor packages. In this study, the geometrical effect on the inelastic deformation and fracture of solder balls were analyzed by finite element analysis. The results showed that fracture occurred in both tilted and hourglass shapes under shear loading, and no fracture occurred in all cases under compressive loading. However, when bending was applied, only the tilted shape failed. When shear and bending loads were combined with compression, the stress triaxiality was maintained at a value less than zero and failure was suppressed. Furthermore, a comparison using the Lagrangian-Green strain tensor of the critical element showed that even under the same loading conditions, there was a significant difference in deformation depending on the shape of the solder ball.

• Journal of the Korean Wood Science and Technology
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• v.44 no.1
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• pp.40-47
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• 2016

Instead of metal connector generally used on the structural glued laminated timber rahmen joints, the GFRP reinforced laminated plates combining veneer and GFRP (Glass Fiber Reinforced Plastic) and bonded type GFRP rod were used as the connectors. As a result of moment resistance performance evaluation on the joint part applied with these connectors, the yield moment of specimen using the GFRP reinforced laminated plates and GFRP rod pin was measured 4 % lower in comparison to the specimen (Type-1) using the metal connectors, but the initial rotational stiffness was measured 29% higher. Also, the yield moment and rotational stiffness of the specimen using the GFRP-reinforced laminated plates and wood (Eucalyptus marginata) pin showed were measured 11% and 56% higher in comparison to the Type-1 specimen, showing the best performance. It was also confirmed through the failure shape and perfect elasto-plasticity analysis that it showed ductility behavior, not brittle fracture, from the shear resisting force by the pin and the bonding strength increased and the unification of member was carried out. On the other hand, in case of the specimen bonded with GFRP rod, it was impossible to measure the bonding performance or it was measured very low due to poor bonding.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.10
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• pp.1031-1041
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• 2009

A small microstrip monopole antenna for macro-micro frequency tuning over multiple bands is presented. The meander-shape antenna is fabricated on a conventional printed circuit board(FR-4, $\varepsilon_r=4.4$ and tan $\delta=0.02$). The antenna operates over WiBro(2.3~2.4 GHz) and WLAN a/b(2.4~2.5 GHz/5.15~5.35 GHz) service bands with an essentially constant antenna gain within each service band. Two diodes, a PIN diode and a varactor, are embedded into the antenna for frequency reconfiguration. The PIN diode is used for frequency switching(macro-tuning) between 2 GHz and 5 GHz bands while the varactor is used for frequency tuning(micro-tuning) within the service bands, 2.3~2.5 GHz and 5.15~5.35 GHz. Unwanted resonances between the two frequency bands(2 GHz and 5 GHz) are suppressed by filling up the gaps between the meander lines. The antenna gain is essentially constant and higher than 2 dBi within each service band. The measured performance of the proposed antenna system suggests the macro-micro frequency tuning techniques be useful in reconfigurable wireless communication systems.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.29 no.1
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• pp.39-55
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• 1993

Modal Analysis is the process of characterizing the dynamic properties of an elastic structure by identifying its modes of vibration. A mode of vibration is a global property of an elastic structure. That is, a mode has a specific natural frequency and damping factor which can be identified from response data at practically any point on a structure, and it has a characteristic mode shape which identifies the mode spatially over the entire structure. Modal testing is able to be performed on structural and mechanical structure in an effort to learn more about their elastic behavior. Once the dynamic properties of a structure are known its behavior can be predicted and therefore controlled or corrected. Resonant frequencies, damping factors and mode shape data can be used directly by a mechanical designer to pin point weak spots in a structure design, or this data can also be used to confirm or synthesize equations of motion for the elastic structure. These differential equations can be used to simulate structural response to know input forces and to examine the effects of pertubations in the distributed mass, stiffness and damping properties of the structure in more detail. In this paper the measurement of transfer functions in digital form, and the application of digital parameter identification techniques to identify modal parameters from the measured transfer function data are discussed. It is first shown that the transfer matrix, which is a complete dynamic model of an elastic plate structure can be written in terms of the structural modes of vibration. This special mathematical form allows one to identify the complete dynamics of the structure from a much reduced set of test data, and is the essence of the modal approach to identifying the dynamics of a structure. Finally, the application of transfer function models and identification techniques for obtaining modal parameters from the transfer function data are discussed. Characteristics on vibration response of elastic plate structure obtained from the dynamic analysis by Finite Element Method are compared with results of modal analysis.

• Design & Manufacturing
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• v.10 no.1
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• pp.36-40
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• 2016

Connectors transmit electric signals to different parts in compact mobile display products. As products that apply this have become lightweight and smaller in size, there are growing demands for smaller and more integrated connectors, which are internal parts of the products. As a measure to address these demands, there is the planar array connector that minimizes the part by arranging the single-direction BTB connectors to two directions. As connectors become smaller in size and more highly integrated, maintaining intensity to prevent defects during impact and maintaining adhesive force to smoothly transmit electric signals are growing in importance. Thus, in order to identify the impact of concave shaping on improving adhesive power in connector terminal pins as a method to increase the connecting power of planar array connector terminal pins, this study predicted and examined the concave shaping method, number of concave shapes, and the adhesive power according to the size of the concave shape through CAE. For concave shaping, the model that added concave shaping towards the lower part of the connector terminal pin and added spokes for the area pressed down by the concave shaping was 0.74 N, showing increased adhesive force compared to existing models. Furthermore, when applying two concave shaping, rather than just one, there was a tendency for adhesive force to increase. In the case of adhesive power trends according to the size of the concave shaping, adhesive power increased and the width of the concave shape decreased, and the biggest adhesive force trends were shown when the concave shaping depth was 0.01mm.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.122-127
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• 2009

The injection mold with multi-cavity is essential for mass production of plastic products. Multi-cavity molds are designed to geometrically balanced runner system to uniformly fill to each cavity. However, despite geometrical balanced runner system, filling imbalances between cavity to cavity have always been observed in injection molding. To solve these problems, many studies such as Melt Flipper, RC Pin, and others have been presented. The results of these studies have been an effect on filling balances in multi-cavity molds. But, those have had a limitation that additional insert parts must have existed in the mold. In this study, a new runner system is suggested for filling balance between cavity to cavity using "Melt-Buffer" with simple change of runner shape. A series of simulation to confirm feasibility of Melt-Buffer's effects was conducted using injection molding CAE program. Also, a series of injection molding experiment was conducted using plastic materials such as ABS and PP. As results of this study, feasibilities of filling balances by Melt-Buffer were confirmed.

• Journal of radiological science and technology
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• v.16 no.1
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• pp.101-106
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• 1993

In order to assure safety of both patient and operator, and to provide uniform quality radiographs, it is necessary to perform periodic calibration of diagnostic X-ray equipment. A basic parameter of diagnostic equipment's and its image sharpness is the size(and shape the energy distribution) of the focal spot as viewed along the central X-ray beam. This size determines the resolution possible with the equipment and also determines the heat characteristics of an anode. A fine focus tube gives high resolution but causes high local heating of target. In past, the pin-hole and star pattern image measurement for evaluation of resolution have been widely used, but it produced blurring and inaccuracy of image. So newly inverted Ug-meter has advantage in more convenient measurement method and less out-put bias than other image measurement. The authors intended to compare measured focal size between Ug-meter and focal spot test tool, changed state from setting to now of units.

• Journal of Korean Association for Spatial Structures
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• v.19 no.4
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• pp.69-76
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• 2019

A stadium roof that uses the pin-jointed spatial truss system has to be designed by taking into account the unstable phenomenon due to the geometrical non-linearity of the long span. This phenomenon is mainly studied in the single-free-node model (SFN) or double-free-node model (DFN). Unlike the simple SFN model, the more complex DFN model has a higher order of characteristic equations, making analysis of the system's stability complicated. However, various symmetric conditions can allow limited analysis of these problems. Thus, this research looks at the stability of the DFN model which is assumed to be symmetric in shape, and its load and equilibrium state. Its governing system is expressed by nonlinear differential equations to show the double Duffing effect. To investigate the dynamic behavior and characteristics, we normalize the system of the model in terms of space and time. The equilibrium points of the system unloaded or symmetrically loaded are calculated exactly. Furthermore, the stability of these points via the roots of the characteristic equation of a Jacobian matrix are classified.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.383-387
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• 2004

The Fuel Test Loop (FTL) consists of In-Pile Test Section (IPS) and Out-of-Pile System (OPS). The test condition in IPS such as pressure, temperature and quality of the main cooling water, can be controlled by the OPS. The FTL has been developed to be able to irradiate three pins to the core irradiation hole (IR1 hole) by considering for its utility and user's irradiation requirement. The IPS vessel assembly (IVA) consists of IPS head, outer pressure vessel, inner pressure vessel, inner assembly and test fuel carrier. The IVA is approximately 5.6 m long and fits within a 74 mm in diameter envelope over the full height of the chimney. Above the top of the chimney, the head of the IPS is enlarged to allow the closure flanges and pipe work connections. IVA was designed to test the CANDU and PWR nuclear fuel pin together. Specially, wished to minimize interference by nuclear fuel change in design and synthesize these items and shape design for IVA.

• Journal of KSNVE
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• v.11 no.2
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• pp.257-264
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• 2001

In this research, piezoelectric smart structures are applied for SEA(Statistical Energy Analysis), which is well known approach for high frequency analysis. A new input power measurement based on piezoelectric electrical power measurement is proposed and compared with the conventional method in SEA. As an example, a simple aluminum beam on which piezoelectric actuator is attached is considered. By measuring the electrical impedance and electrical current of the piezoelectric actuator, the electrical power given on the actuator is found and this is In turn converted into the mechanical energy. From the measured value of the stored energy of the beam, the Internal loss factor is calculated and this value shows a good agreement with that given by the conventional method as well as the theoretical value. To compare the coupling loss factor, L-shape beam system which consists of a aluminum beam subsystem and a steel beam subsystem coupled by three pin is taken as second example. The input power and stored energy of each subsystem are found by the proposed approach. The coupling loss factor found by the electrical input power obtained from the piezoelectric actuator exhibits similar trend to the value found by the conventional method as well as the theoretical value. In conclusion, the use of SEA for high frequency application of piezoelectric smart structures is Possible. Especially, the input power that is essential for SEA can be found accurately by measuring the electrical input power of the piezoelectric actuator.