• Journal of the Korean Wood Science and Technology
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• v.15 no.3
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• pp.44-55
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• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.374-374
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• 2012

Nowadays, Active Matrix Organic Light-Emitting Diodes (AM-OLEDs) are the superior display device due to their vivid full color, perfect video capability, light weight, low driving power, and potential flexibility. One of the advantages of AM-OLED over Liquid Crystal Display (LCD) lies in its flexibility. The potential flexibility of AM-OLED is not fully explored due to its sensitivity to moisture and oxygen which are readily present in atmosphere, and there are no flexible encapsulation layers available to protect these. Therefore, we come up with a new concept of Inorganic-Organic hybrid thin film as the encapsulation layer. Our Inorganic layer is Al2O3 and Organic layer is F-Alucone. We deposited these layers in vacuum state using Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) techniques. We found the results are comparable to commercial requirement of 10-6 g/m2 day for Water Vapor Transmission Rate (WVTR). Using ALD and MLD, we can control the exact thin film thickness and fabricate more dense films than chemical or physical vapor deposition methods. Moreover, this hybrid encapsulation layer potentially has both the flexibility of organic layers and superior protection properties of inorganic layer.

• Korean Journal of Computational Design and Engineering
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• v.7 no.3
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• pp.148-156
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• 2002

Most Rapid Prototyping (RP) processes adopt a solid Computer Aided Design (CAD) model, which will be sliced into thin layers of constant thickness in the building direction. Each cross-sectional layer is successively deposited and, simultaneously, bonded onto the previous layer; and eventually the stacked layers from a physical part of the model. A new RP process, the transfer-type Variable Lamination Manufacturing process using expandable polystyrene foam sheet (VLM-ST), has been developed to reduce building time and to improve the surface finish of parts with the thick layers and a sloping surface. This paper describes the generation of Unit Shape Layer (USL), the cutting path data of the linen. hotwire cutter for the VLM-ST process. USL is a three-dimensional layer with a thickness of more than 1 mm and a side slope, and it is the basic unit of cutting and building in the VLM-ST process. USL includes data such as layer thickness, positional coordinates, side angles of each layer, hotwire cutting speed, the heat input to the hotwire, and reference shape. The procedure of generating USL is as follows: (1)Generation of the mid-slice from the CAD model, (2)Conversion of the mid-slice into a simply connected domain, (3)Generation to the reference shape for the mid-slice, (4)Calculation of the rotation angle of the hotwire of the cutting system.

• Current Photovoltaic Research
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• v.4 no.2
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• pp.48-53
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• 2016

We report the effect of physical load on the stability of organic solar cells under physical loads. The active layers in organic solar cells were fabricated with bulk heterojunction films (BHJ) films of poly (3-hexylthiophene) and phenyl-$C_{61}$-butyric methyl ester. The loading time was varied up to 60 s by keeping the physical load constant. Results showed that the open circuit voltage was not influenced by the physical load but other solar cell parameters were sensitive to the loading time. The fill factor was very slightly increased at 15 s, while short circuit current density was well kept for 30 s. The power conversion efficiency was reasonably maintained for 45 s but became significantly decreased by the continuous loading for 60 s.

• Journal of the Korean Wood Science and Technology
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• v.50 no.2
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• pp.134-147
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• 2022

The objective of this study is to determine the effect of fiber direction arrangement and layer composition of hybrid bamboo laminate boards on the physical and mechanical properties. The raw material used was tali bamboo (Gigantochloa apus (J.A. & J.H. Schultes) Kurs) rope in the form of flat sheets (zephyr) and falcata veneer (Paraserianthes falcataria (L) Nielsen). Zephyr bamboo was arranged in three layers using water-based isocyanate polymer (WBPI) with a glue spread rate of 300 g/m². There were variations in the substitution of the core layer with falcata veneers (hybrid) as much as two layers and using a glue spread rate of 170 g/m². The laminated bamboo board was cold-pressed at a pressure of 22.2 kgf/cm² for 1 h, and the physical and mechanical properties were evaluated. The results showed that the arrangement of the fiber direction significantly affected the dimensional stability, modulus of rupture, modulus of elasticity, shear strength, and screw withdrawal strength. However, the composition of the layers had no significant effect on the physical and mechanical properties. The bonding quality of bamboo laminate boards with WBPI was considered to be quite good, as shown by the absence of delamination in all test samples. The bamboo hybrid laminate board can be an alternative based on the physical and mechanical properties that can meet laminated board standards.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.209.2-209.2
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• 2015

Two dimensional layered materials, such as transition metal dichalcogenides (TMDs) family have been attracted significant attention due to novel physical and chemical properties. Among them, molybdenum disulfide ($MoS_2$) has novel physical phenomena such as absence of dangling bonds, lack of inversion symmetry, valley degrees of freedom. Previous studies have shown that the interface of metal/$MoS_2$ contacts significantly affects device performance due to presence of a scalable Schottky barrier height at their interface, resulting voltage drops and restricting carrier injection. In this study, we report a new device structure by using few-layer graphene as the bottom interconnections, in order to offer Schottky barrier free contact to bi-layer $MoS_2$. The fabrication of process start with mechanically exfoliates bulk graphite that served as the source/drain electrodes. The semiconducting $MoS_2$ flake was deposited onto a $SiO_2$ (280 nm-thick)/Si substrate in which graphene electrodes were pre-deposited. To evaluate the barrier height of contact, we employed thermionic-emission theory to describe our experimental findings. We demonstrate that, the Schottky barrier height dramatically decreases from 300 to 0 meV as function of gate voltages, and further becomes negative values. Our findings suggested that, few-layer graphene could be able to realize ohmic contact and to provide new opportunities in ohmic formations.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.497-498
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• 2008

모바일 폰에서 IrDA를 통하여 개인정보 (전화번호부, 동영상, 사진등) 송수신시 IrMC, IrOBEX 그리고 HDLC 프로토콜 기반위의 IrLAP등의 프로토콜 스택을 사용하고 있다. Primary, secondary 두 mobile phone 간에 IrLAP layer의 payload data 송수신시 이용되는 3가지 physical layer schemes 중 전송속도 1l5.2kbps data rate의 제안된 표준인 Asynchronous(Async) frame 방식을 이용한다. [1] 현재의 모바일 폰에서는 Async frame scheme을 구현하기 위한 인터페이스 방식 중 UART 인터페이스를 이용하여 구현하고 있다. 현 모바일 폰에 이미 구현 되어 있는 기존 UART의 FIFO 제어 방법과 Interrupt service routine의 제어 알고리즘을 개선하여 기존 제어 방식과 비교하고 향상된 성능의 결과는 Throughput로 도출한다. 현 모바일 폰에서 사용자가 개인 정보 data등을 저장할 수 메모리 공간이 점점 늘어나고 있는 추세이다. Camera의 해상도 현 5Mega pixel까시 지원되고 동영상 파일 등도 근거리 무선통신인 IrDA로 송수신할 수 있으므로 본 성능비교 file의 size는 100Mega 이상도 비교할 수 있도록 하였다.

• Magazine of the Korean Society of Agricultural Engineers
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• v.35 no.3
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• pp.36-46
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• 1993

The purposes of this study are to develop three-layered Green-Ampt infiltration model considering temporal variation of physical properties of soil and to evaluate the model with field experiment on bare-tilled and soybean-growing soil plots under natural rainfalls. Infiltration tests were conducted on a sandy loam soil. The model has three-layered soil profile including a surface crust, a tilled layer, a subsoil and considers temporal variation of porosity, hydraulic conductivity, capillary pressure head on a tilled layer by natural rainfalls and canopy density variation of crop. Field measurement of porosity, average hydraulic conductivity and average capillary presure head on a tilled layer were conducted by soil sampler and air-entry permeameter at regular intervals-after tillage. It was found that temporal variation of porosity and average hydraulic conductivity might be expressed as a function of cumulative rainfall energy and average capillary pressure head might be expressed as a function of porosity of a tilled soil. The model was calibrated by an optimization technique, Hooke and Jeeves method using hourly surface runoff data. With the calibrated parameters, the model was verified satisfactorily.

• 보존과학연구
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• s.29
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• pp.255-278
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• 2008

Considering the physical quality of the wall body in this study we tried to select a replenishing that is proper for filling the cracked part of the painting wall layer and apply the natural adhesives that have traditionally been used, investigating whether it is possible to substitute those for the chemical adhesive which is used at present time. The result of this study showed the red algae adhesive was, in a weathering environment, as safe as the synthetic resin originated from the polyvinyl acetate which is used generally on the present spot, and it was concluded that although the starch adhesive displayed its superiority in enhancing the strength of the earth mortar and its work disposition, it seemed proper for it to be used as a filling adhesive for the first or midterm layer because it showed a surface hardening phenomenon. And also the glue and fish glue were judged they were not qualified as a filling adhesive due to mold occurring in a environment of high moisture that is a biological problem, showing at same time a weak physical feature in a weathering environment. Therefore it would be possible to use the red algae adhesive or starch one substituting them for the original one sold on the present market, if among natural adhesives the weak points of the them were to be corrected.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.10
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• pp.615-624
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• 2017

This study investigated the various physical and electrical effects of silicon direct bonding. Direct bonding means the joining of two wafers together without an intermediate layer. If the surfaces are flat, and made clean and smooth using HF treatment to remove the native oxide layer, they can stick together when brought into contact and form a weak bond depending on the physical forces at room temperature. An IR camera and acoustic systems were used to analyze the voids and bonding conditions in an interface layer during bonding experiments. The I-V and C-V characteristics are also reported herein. The capacitance values for a range of frequencies were measured using a LCR meter. Direct wafer bonding of silicon is a simple method to fuse two wafers together; however, it is difficult to achieve perfect bonding of the two wafers. The direct bonding technology can be used for MEMS and other applications in three-dimensional integrated circuits and special devices.