• 제목/요약/키워드: Physical Vapor Deposition

검색결과 325건 처리시간 0.031초

표면처리된 흑연 보트를 이용한 알루미늄의 증발 특성 (Evaporation Characteristics of Aluminum by Using Surface-treated Graphite Boat)

  • 정재인;양지훈
    • 한국표면공학회지
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    • 제42권1호
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    • pp.1-7
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    • 2009
  • Resistive heating sources are widely used to prepare thin films by vapor deposition because they are cheap, and easy to install and handle in vacuum system. Graphite is one of materials used to make the resistive heating source, but until now only limited applications have been possible as it reacts easily with evaporating materials at high temperature. In this study, evaporation characteristics of aluminum have been investigated by using graphite boat thermally treated with BN powder. The employed graphite boat has been prepared by spray-coating BN power onto the cavity surface of the boat and thermal treatment with aluminum in vacuum at the temperature of more than $1400^{\circ}C$. The voltage-current characteristics as well as resistivity changes of the graphite boat have been investigated during aluminum evaporation according to the applied voltage and time. The evaporation aspect has been picturized during flash evaporation for 40 seconds based on the characterization results. The evaporation rate of the graphite boat has been compared with that of BN boat. The graphite boat showed some different characteristics compared with BN boat, in that the evaporation occurred at the last stage of flash evaporation. The film appearance according to the applied voltage has been compared, and also the reflectance of the resulting film has been investigated according to the film thickness. It has been found that the graphite boat thermally treated with BN powder can be used for aluminum evaporation without problem.

진공증착법을 이용한 압전 유기 박막의 제조와 센서 특성에 관한 연구 (A Study on the Fabrication of Piezoelectric Organic Thin Films by using Physical Vapor Deposition Method and Sensor Characteristics)

  • 박수홍;임응춘;박종찬;이덕출
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 학술대회 논문집 전문대학교육위원
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    • pp.35-39
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    • 2001
  • The purpose of this paper is improvement the piezoelectric of Polyvinylidene fluoride(PVDF) organic thin films is fabricated by vapor deposition method. The piezoelectric of PVDF organic thin films attributed to dipole orientation in crystalline region. Also, the piezoelectric characteristic reduced that dipole moments orientation in crystalline region interfered with impurity carriers. Therefore, PVDF organic thin films fabricated with high substrate temperature condition for crystallinity improvement. The crystallinity of PVDF organic thin films fabricated by this condition increase from 47 to 67.8%. The ion density of PVDF organic thin films fabricated by substrate temperature variation from $30^{\circ}C$ to $105^{\circ}C$ decreased from $1.62{\times}10^{16}cm^3$ to $6.75{\times}10^{11}cm^3$ when temperature and frequency were $100^{\circ}C$, 10Hz, respectively. The $d_{33}$ and piezo-voltage coefficient of PVDF organic thin films increased from 20pPC/N to 33pC/N and $162.9{\times}10^{-3}V{\cdot}m/N$ to $283.2{\times}10^{-3}V{\cdot}m/N$, respectively. For the sake of the applications of piezoelectric sensor, we analyzed the output voltage characteristic as a function of the distance between an oscillator of 28kHz and PVDF organic thin film transducer. From this, we found that the output voltage is inversely proportional to the distance. At this time, the period was about $35.798{\mu}s$ and equal the oscillator frequency.

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Simple and Clean Transfer Method for Intrinsic Property of Graphene

  • 최순형;이재현;장야무진;김병성;최윤정;황종승;황성우;황동목
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.659-659
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    • 2013
  • Recently, graphene has been intensively studied due to the fascinating physical, chemical and electrical properties. It shows high carrier mobility, high current density, and high thermal conductivity compare with conventional semiconductor materials even it has single atomic thickness. Especially, since graphene has fantastic electrical properties many researchers are believed that graphene will be replacing Si based technology. In order to realize it, we need to prepare the large and uniform graphene. Chemical vapor deposition (CVD) method is the most promising technique for synthesizing large and uniform graphene. Unfortunately, CVD method requires transfer process from metal catalyst. In transfer process, supporting polymer film (Such as poly (methyl methacrylate)) is widely used for protecting graphene. After transfer process, polymer layer is removed by organic solvents. However, it is impossible to remove it completely. These organic residues on graphene surface induce quality degradation of graphene since it disturbs movement of electrons. Thus, in order to get an intrinsic property of graphene completely remove of the organic residues is the most important. Here, we introduce modified wet graphene transfer method without PMMA. First of all, we grow the graphene from Cu foil using CVD method. And then, we deposited several metal films on graphene for transfer layer instead of PMMA. Finally, we fabricate graphene FET devices. Our approaches show low defect density and non-organic residues in comparison with PMMA coated graphene through Raman spectroscopy, SEM and AFM. In addition, clean graphene FET shows intrinsic electrical characteristic and high carrier mobility.

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화학기상증착법을 이용하여 합성한 그래핀과 금속의 접촉저항 특성 연구 (A Study on Contact Resistance Properties of Metal/CVD Graphene)

  • 김동영;정하늘;이상현
    • 마이크로전자및패키징학회지
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    • 제30권2호
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    • pp.60-64
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    • 2023
  • 본 연구에서는 그래핀 기반 소자의 성능에 영향을 미치는 그래핀과 금속 사이의 전기적 접촉저항 특성을 비교 분석하였다. 화학기상증착법을 이용하여 고품질의 그래핀을 합성하였으며, 전극 물질로 Al, Cu, Ni 및 Ti를 동일한 두께로 그래핀 표면 위에 증착하였다. TLM (transfer length method) 방법을 통해 SiO2/Si 기판에 전사된 그래핀과 금속의 접촉저항을 측정한 결과, Al, Cu, Ni, Ti의 평균 접촉저항은 각각 345 Ω, 553 Ω, 110 Ω, 174 Ω으로 측정되었다. 그래핀과 물리적 흡착 특성을 갖는 Al와 Cu에 비해 화학적 결합을 형성하는 Ni과 Ti의 경우, 상대적으로 더 낮은 접촉저항을 갖는 것을 확인하였다. 본 연구의 그래핀과 금속의 전기적 특성에 대한 연구 결과는 전극과의 낮은 접촉저항 형성을 통해 고성능 그래핀 기반 전자, 광전자소자 및 센서 등의 구현에 기여할 수 있을 것으로 기대한다.

Fabrication of branched Ga2O3 nanowires by post annealing with Au seeds

  • 이미선;서창수;강현철
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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    • pp.203-203
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    • 2015
  • Gallium Oxide (Ga2O3) has been widely investigated for the optoelectronic applications due to its wide bandgap and the optical transparency. Recently, with the development of fabrication techniques in nanometer scale semiconductor materials, there have been an increasing number of extensive reports on the synthesis and characterization of Ga2O3 nano-structures such as nano-wires, nano-belts, and nano-dots. In contrast to typical vapor-liquid-solid growth mode with metal catalysts to synthesis 1-dimensional nano-wires, there are several difficulties in fabricating the nano-structures by using sputtering techniques. This is attributed to the fact that relatively low growth temperatures and higher growth rate compared with chemical vapor deposition method. In this study, Ga2O3 nanowires (NWs) were synthesized by using radio-frequency magnetron sputtering method. The NWs were then coated by Au thin films and annealed under Ar or N2 gas enviroment with no supply of Gallium and Oxygen source. Several samples were prepared with varying the post annealing parameters such as gas environment annealing time, annealing temperature. Samples were characterized by using XRD, SEM, and PL measurements. In this presentation, the details of fabrication process and physical properties of branched Ga2O3 NWs will be reported.

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Experimental and numerical research on ballistic performance of carbon steels and cold worked tool steels with and without Titanium Nitride (TiN) coating

  • Ergul, Erdi;Doruk, Emre;Pakdil, Murat
    • Steel and Composite Structures
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    • 제23권2호
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    • pp.153-160
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    • 2017
  • It is extremely important to be aware of the ballistic performances of engineering materials in order to be able to choose the lightest armor providing full ballistic protection in civil and military applications. Therefore, ballistic tests are an important part of armor design process. In this study, ballistic performance of plates made of carbon steel and cold worked tool steel against 7.62 mm AP (armor-piercing) bullets was examined experimentally and numerically in accordance with NIJ standards. Samples in different sizes were prepared to demonstrate the effect of target thickness on ballistic performance. Some of these samples were coated with titanium nitride using physical vapor deposition (PVD) method. After examining all successful and unsuccessful samples at macro and micro levels, factors affecting ballistic performance were determined. Explicit non-linear analyses were made using Ls-Dyna software in order to confirm physical ballistic test results. It was observed that the ballistic features of steel plates used in simulations comply with actual physical test results.

Bonding And Anti-bonding Nature of Magnetic Semiconductor Thin Film of Fe(TCNQ:tetracyanoquinodimethane)

  • Jo, Junhyeon;Jin, Mi-jin;Park, Jungmin;Modepalli, Vijayakumar;Yoo, Jung-Woo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.294-294
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    • 2014
  • Developing magnetic thin films with desirable physical properties is a key step to promote research in spintronics. Organic-based magnetic material is a relatively new kind of materials which has magnetic properties in a molecular and microscopic level. These materials have been constructed by the coordination between 3d transition metal and organic materials producing long-range magnetic orders with a relatively high transition temperature. However, these materials were mostly synthesized as a form of powder, which is difficult to study for their physical properties as well as apply for electronic/spintronic devices. In this study, we have employed physical vapor deposition (PVD) to develop a new organic-based hybrid magnetic film that is achieved by the coordination of Fe and tetracyanoquinodimethane (TCNQ). The IR spectra of the grown film show modified CN vibration modes in TCNQ, which suggest a strong bonding between Fe and TCNQ. The thin film has both ferromagnetic and semiconducting behaviors, which is suitable for molecular spintronic applications. The high resolution photoemission (HRPES) spectra also show shift of 1s peak point of nitrogen and the carbon 1s peaks display traces of charge transfer from Fe to TCNQ as well as shake-up features, which suggest strong bonding and anti-bonding nature of coordination between Fe and TCNQ.

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스퍼터링 증확 CdTe 박막의 두께 불균일 현상 개선을 위한 화학적기계적연마 공정 적용 및 광특성 향상 (Application of CMP Process to Improving Thickness-Uniformity of Sputtering-deposited CdTe Thin Film for Improvement of Optical Properties)

  • 박주선;임채현;류승한;명국도;김남훈;이우선
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.375-375
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    • 2010
  • CdTe as an absorber material is widely used in thin film solar cells with the heterostructure due to its almost ideal band gap energy of 1.45 eV, high photovoltaic conversion efficiency, low cost and stable performance. The deposition methods and preparation conditions for the fabrication of CdTe are very important for the achievement of high solar cell conversion efficiency. There are some rearranged reports about the deposition methods available for the preparation of CdTe thin films such as close spaced sublimation (CSS), physical vapor deposition (PVD), vacuum evaporation, vapor transport deposition (VTD), closed space vapor transport, electrodeposition, screen printing, spray pyrolysis, metalorganic chemical vapor deposition (MOCVD), and RF sputtering. The RF sputtering method for the preparation of CdTe thin films has important advantages in that the thin films can be prepared at low growth temperatures with large-area deposition suitable for mass-production. The authors reported that the optical and electrical properties of CdTe thin film were closely connected by the thickness-uniformity of the film in the previous study [1], which means that the better optical absorbance and the higher carrier concentration could be obtained in the better condition of thickness-uniformity for CdTe thin film. The thickness-uniformity could be controlled and improved by the some process parameters such as vacuum level and RF power in the sputtering process of CdTe thin films. However, there is a limitation to improve the thickness-uniformity only in the preparation process [1]. So it is necessary to introduce the external or additional method for improving the thickness-uniformity of CdTe thin film because the cell size of thin film solar cell will be enlarged. Therefore, the authors firstly applied the chemical mechanical polishing (CMP) process to improving the thickness-uniformity of CdTe thin films with a G&P POLI-450 CMP polisher [2]. CMP process is the most important process in semiconductor manufacturing processes in order to planarize the surface of the wafer even over 300 mm and to form the copper interconnects with damascene process. Some important CMP characteristics for CdTe were obtained including removal rate (RR), WIWNU%, RMS roughness, and peak-to-valley roughness [2]. With these important results, the CMP process for CdTe thin films was performed to improve the thickness-uniformity of the sputtering-deposited CdTe thin film which had the worst two thickness-uniformities of them. Some optical properties including optical transmittance and absorbance of the CdTe thin films were measured by using a UV-Visible spectrophotometer (Varian Techtron, Cary500scan) in the range of 400 - 800 nm. After CMP process, the thickness-uniformities became better than that of the best condition in the previous sputtering process of CdTe thin films. Consequently, the optical properties were directly affected by the thickness-uniformity of CdTe thin film. The absorbance of CdTe thin films was improved although the thickness of CdTe thin film was not changed.

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$SiH_2Cl_2와 NH_3$를 이용하여 원자층 증착법으로 형성된 실리콘 질화막의 특성 (The Characteristics of silicon nitride thin films prepared by atomic layer deposition method using $SiH_2Cl_2 and NH_3$)

  • 김운중;한창희;나사균;이연승;이원준
    • 한국진공학회지
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    • 제13권3호
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    • pp.114-119
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    • 2004
  • Si 원료물질로 $SiH_2Cl_2$, N 원료물질로 $NH_3$를 사용하여 증착온도 $550^{\circ}C$에서 P-type Si (100) 기판위에 실리콘 질화막을 원자층 증착 방법으로 형성하고 물리적, 전기적 특성을 평가하였다. 증착된 박막의 두께는 증착 주기의 횟수에 대해 선형적으로 증가하였고, Si와 N 원료물질의 공급량이 $3.0\times10^{9}$ L 일 때 0.13 nm/cycle의 박막 성장속도를 얻을 수 있었다. 원자층 증착된 박막의 물리적 특성을 기존의 저압화학증착 방법에 의해 증착된 박막과 비교한 결과, 원자층 증착 방법을 사용함으로써 기존의 방법보다 증착온도를 $200 ^{\circ}C$이상 낮추면서도 굴절률 및 습식에칭 속도 측면에서 유사한 물성을 가진 실리콘 질화막을 형성할 수 있었다. 특히, 원자층 증착된 박막의 누설 전류밀도는 3 MV/cm의 전기장에서 0.79 nA/$\textrm{cm}^2$로서 저압화학증착 방법에 의해 증착된 질화막의 6.95 nA/$\textrm{cm}^2$보다 우수하였다.

마그네트론 스퍼터로 코팅된 알루미늄 박막의 미세구조 분석

  • 양지훈;박혜선;정재훈;송민아;정재인
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.159-159
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    • 2012
  • 알루미늄 박막을 코팅하기 위해서 비대칭 마그네트론 스퍼터 소스를 이용하였으며 빗각 증착과 외부 자기장에 의한 플라즈마 밀도 제어가 알루미늄 박막의 미세구조에 미치는 영향을 확인하였다. 빗각 증착은 타겟과 기판이 서로 평행하지 않고 빗각을 이루도록 기판을 기울여 코팅하는 방법으로 박막의 미세구조를 제어할 수 있다. 마그네트론 스퍼터 소스 외부에 원형의 전자석을 위치시키고 직류의 전류를 인가하여 타겟 표면에서 발생하는 플라즈마 밀도를 제어할 수 있도록 하였다. 알루미늄을 물리기상증착으로 코팅하면 일반적으로 주상정 구조를 갖는다. 알루미늄 박막이 주상정 구조로 이루어지면 박막의 표면 거칠기가 증가하고 밀도가 감소하는 현상을 보인다. 알루미늄을 빗각 증착으로 코팅하면 주상정 형성이 억제되어 박막의 밀도가 높아지고 표면 거칠기는 감소하는 현상을 보였다. 알루미늄의 빗각 증착 시 전자석에 인가하는 전류의 세기와 방향을 제어하여 타겟 표면의 플라즈마 밀도를 증가시키면 알루미늄 박막의 밀도가 빗각 증착만 적용했을 때보다 증가하고 비정질과 같은 박막 구조를 보이는 현상을 관찰할 수 있었다. 전자석에 인가하는 전류의 방향을 기판 표면의 플라즈마 밀도가 증가하도록 바꾸면 알루미늄 주상정의 크기가 증가하고 기공의 크기도 증가하는 현상을 관찰하였다. 마그네트론 스퍼터 공정 시 자기장과 빗각 증착을 적절하게 이용하여 밀도가 높고 표면 거칠기가 낮은 알루미늄 박막을 코팅할 수 있었으며, 이러한 알루미늄 박막은 기능성 향상을 위한 표면처리 소재로 활용 가능성이 높을 것으로 판단된다.

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