• Applied Chemistry for Engineering
• /
• v.21 no.5
• /
• pp.527-531
• /
• 2010

The optimized sheet for EMI shielding was prepared by metal power with Fe series. Then various metal powders were deposited on the sheet by PVD method. Moreover, the PVdF nanofiber membrane was used to compare the characteristic of EMI shielding efficiency of various metal powders. The electrical property was measured by the 4-point probe method. The result from EDS confirmed that the metal powder existed on the sheet. EMI shielding efficiency was analysed by EMI shielding measurement apparatus. The lowest electrical resistance, $641.95{\Omega}{wcdot}cm$, was obtained with $1000\;{\AA}$ deposition of Cu on the sheet. It was revealed that the EMI shielding efficiency increased with increase of the metal deposition thickness. The sheet deposited by Cu with $1000\;{\AA}$ showed the highest EMI shielding efficiency, 32.5 dB.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.76.2-76.2
• /
• 2013

Advanced electronic application areas have strongly required new materials due to the continuous shrinking dimensions of their devices. Specially, the development and use of metal precursors for atomic layer deposition has been extensively focused on application to electronic devices. Thus the systematic design and synthesis of metal compounds with relevant chemical and physical properties, such as stability, volatility, and resistance to air and moisture are very important in the vacuum deposition fields. In many case, organic ligands for metal precursors are especially focused in the related research areas because the large scale synthesis of the metal complexes with excellent properties exclusively depends on the potential usefulness of the ligands. It is recommended for metal complexes to be in monomeric forms because mononuclear complexes generally show high vapor pressures comparing with their oligomeric structure such as dimer and trimer. Simple metal alkoxides complexes are involatile except several examples such as Ti(OiPr)4, Si(OEt)4, and Hf(OtBu)4. Thus the coordinated atom of alkoxide ligands should be crowded in its own environment with some substituents by prohibiting the coordinated atoms from bonding to another metal through oxygen-bridging configuration. Alkoxide ligands containing donor-functionalized group such as amino and alkoxy which can induce the increasing of the coordinative saturation of the metal complexes and the decreasing of the intermolecular interaction between or among the metal compounds. In this presentation, we will discuss the development of metal compounds which adopted donor-functionalized alkoxide ligands derived from their alcohols for electronic application. Some recent results on ALD using metal precursors such as tin, nickel, ruthenium, and tungsten developed in our group will be disclosed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.327-328
• /
• 2012

의료분야의 진단 방사선 장비는 초기의 필름방식 및 카세트에서 진보되어 현재는 디지털방식의 DR (Digital Radiography)이 널리 사용되며 이에 관한 연구개발이 활발히 진행 되고 있다. DR은 일반적으로 직접방식과 간접방식으로 나눌 수 있다. 직접방식의 원리는 X선을 흡수하면 전기적 신호를 발생 시키는 광도전체(Photoconductor)를 사용하여 광도전체 양단 전극에 전압을 인가하여 전기장을 유도한 가운데, X선을 조사하면 광도전체 내부에서 전자-전공쌍(Electron-hole pair)이 생성된다. 이것은 양단에 유도된 전기장의 영향으로 전자는 +극으로, 전공은 -극으로 이동하여 아래에 위치한 하부기판을 통하여 이미지로 변조된다. 간접방식은 X선을 흡수하면 가시광선으로 전환하는 형광체(Scintillator)를 사용하여 조사된 X선을 형광체에서 가시광선으로 전환하고, 이를 Photodiode와 같은 광변환소자로 전기적 신호로 변환하여 방사선을 검출하는 방식을 말한다. 본 연구에서는 직접방식에서 이용되는 광도전체 중 흡수효율이 높고 Mobility가 뛰어난 CdTe를 선정하여 PVD (Physical vapor deposition)방식으로 300 m의 두께를 목표로 하여 증착을 진행하였다. Chamber의 진공도가 $2.5{\times}10^{-2}$ Torr로 도달 시점부터, Substrate와 Boat에 열을 가하였다. Substrate온도는 $350^{\circ}C$, Boat온도는 $300^{\circ}C$도로 설정하여 11시간 동안 진행하였다. Substrate온도는 $303^{\circ}C$, Boat온도는 $297^{\circ}C$도부터 증착이 시작되어 선형적인 증가세 추이를 나타내어 Substrate 및 Boat온도가 설정 값에 도달 하였을 때, $25{\sim}34.4{\AA}/s$ 증착율을 나타내었다. 하부전극의 물질에 따른 CdTe증착 효율성 평가를 진행한 후, 그에 따른 전기적 특성을 알아보았다. 하부전극의 물질로는 ITO (Indium Tin Oxide), Parylene이 코팅 된 ITO, Au, Ag를 사용하였다. 하부전극의 물질 상단에 Thermal Evaporation System을 사용하여 CdTe를 증착한 후, Cdte 상단에 Au를 증착 시켜 민감도(Sensitivity)와 암전류(Dark current)를 측정하였다. 증착 결과 ITO와 Ag상단에 증착시킨 CdTe박막은 박리가 되었고, Au와 Parylene이 코팅 된 ITO에는 CdTe박막이 안정적이게 형성이 되었다. 이 두 샘플에 대하여 동일한 조건으로 민감도와 암전류를 측정 시, Parylene이 코팅된 ITO를 하부전극으로 사용한 CdTe박막은 0.1021 pA/$cm^2$의 암전류와 1.027 pC/$cm^2$의 민감도를 나타낸 반면, Au를 하부전극으로 사용한 CdTe박막은 0.0381 pA/$cm^2$의 암전류와 1.214 pC/$cm^2$의 민감도를 나타내어 Parylene이 코팅된 ITO보다 우수한 전기적 특성을 나타내었다. 따라서 Au는 CdTe박막 증착 시, 하부전극 기판으로서 뛰어난 특성을 나타내는 것을 알 수 있었다.

• Journal of the Korean Society of Radiology
• /
• v.3 no.2
• /
• pp.11-16
• /
• 2009

Mercury Iodide as good sensitivity at radiation and has an easy peculiarity that operates at low voltage for other photoconductors(a-Se, a-Si, Ge, etc) Based on this characteristic, we studied about an efficiency of the digital x-ray detector in acccordance with the thickness of photoconductor. To solve the problem that is difficult to make a large area film using PVD(Physical Vapor Deposition)method, we used a PIB(Particle In Binder)method. To make a binder paste, we used a PVB(Polyvinylbutyral) as a binder and a DGME(Diethylene Glycol Monobutyl Ether), DGMEA(Diethylene Glycol Monobutyl Ether Acetate) as a solvent. Using this binder paste, we made a polycrystal mercury iodide film that has an each thickness. To evaluate the electrical properties of this films, we measured a darkcurrent, sensitivity and SNR(Signal to Noise Ratio). Mercury iodide film of the 200um thickness has good electrical properties as a result of the measurement. From this result there is a good chance that replace the existing a-Se(Amnorphous seleinum; a-se) with the mercury iodide.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.210.2-210.2
• /
• 2013

현재 국내의 상용화된 디지털 방식 X-선 영상장치에서 간접변환방식은 대부분 CsI를 사용하고 있으며, X-선 흡수에 의해 전기적 신호를 발생시키는 직접변환방식은 Amorphous Selenium(a-Se)을 사용한다. a-Se은 진공 중에 녹는점이 낮아 증착시 substrate의 온도에 따라 민감한 변화를 보인다. 본 연구에서는 간접변환방식에 비해 높은 영상의 질을 획득할 수 있는 직접변환방식의 a-Se기반 X-선 검출기 제작 시 substrate에 인가된 온도에 따른 특성을 연구하여 최적화 된 substrate의 온도를 알고자 한다. 본 실험에서는 glass에 투명한 전극물질인 Indium Tin Oxide (ITO)가 electrode로 형성된 substrate를 사용하였으며 그 상단에 a-Se을 Physical Vapor Deposition (PVD)방식을 거쳐 X-선 검출기 샘플을 제작하였다. PVD 공정 시 네 개의 보트에 a-Se 시료를 각각 100g씩 총 400g을 넣고, $5{\times}10-5Torr$까지 진공도를 낮추었다. 보트의 온도는 $270^{\circ}C$에서 40분 $290^{\circ}C$에서 90분으로 온도를 인가하여 a-Se을 기화시켜 증착하였다. 증착 시 substrate 온도를 각각 $20^{\circ}C$, $40^{\circ}C$, $60^{\circ}C$, $70^{\circ}C$ 네 종류로 나누어 실험을 진행하였다. 끝으로 증착된 a-Se 상단에 Au를 PVD방식으로 electrode를 형성시켜 a-Se기반의 X-선 검출기 샘플 제작을 완료하였다. 제작된 a-Se기반의 X-선 검출기 샘플의 두께는 80에서 $85{\mu}m$로 온도에 따른 차이가 없었다. 이후에 전기적 특성을 평가하기위해 electrometer와 oscilloscope를 이용하여 Dark current와 Sensitivity를 측정하여 Signal to Noise Ratio(SNR)로 도출하였으며 Scanning Electron Microscope(SEM) 표면 uniformity를 관찰하였다. 또한 제작된 a-Se기반 X-선 검출기 샘플의 hole collection 성능을 확인하고자 mobility를 측정하였다. 측정결과 a-Se의 work function을 고려한 $10V/{\mu}m$기준에서 70kV, 100mA, 0.03sec의 조건의 X-선을 조사 하였을 때 Sensitivity는 세 종류의 검출기 샘플이 15nC/mR-cm2에서 18nC/mR-cm2으로 비슷한 양상을 나타내었지만, substrate온도가 $70^{\circ}C$때의 샘플은 10nC/mR-cm2이하로 저감됨을 알 수 있었다. 그리고 substrate온도 $60^{\circ}C$에서 제작된 검출기 샘플의 전기적 특성이 SNR로 환산 시, 15.812로 가장 우수한 전기적 특성을 나타내어 최적화 된 온도임을 알 수 있었다. SEM촬영 시 온도상승에 따라 표면 uniformity가 우수하였으며, Mobility lifetime에서는 $60^{\circ}C$에서 제작된 검출기 샘플이 deep trap 수치가 높아 hole이 $0.04584cm2/V{\cdot}sec$로 $0.00174cm2/V{\cdot}sec$의 electron보다 26.34배가량 빠른 것을 확인하였다. 본 연구를 통해 a-Se증착 시, substrate에 인가된 온도는 균일한 박막의 형성 및 표면구조에 영향을 미치며 온도가 증가할수록 안정적인 전기적 특성을 나타내지만 $70^{\circ}C$이상일 시, a-Se층의 결정화가 생겨 deep trap을 발생시켜 전기적 특성이 저하됨을 확인 할 수 있었다. 따라서 증착 시의 substrate의 온도 최적화는 a-Se기반 X-선 검출기의 안전성 및 성능향상을 위해 불가피한 요소가 된다고 사료된다.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2004.11a
• /
• pp.90-98
• /
• 2004

Nano/micro-scale studies on friction properties were conducted on Si (100) and three self-assembled monolayers (SAMs) (PFOTC, DMDM, DPDM) coated on Si-wafer by chemical vapor deposition technique. Experiments were conducted at ambient temperature $(24{\pm}1^{\circ}C)$ and humidity $(45{\pm}5\%)$. Nano-friction was evaluated using Atomic Force Microscopy (AFM) in the range of 0-40nN normal loads. In both Si-wafer and SAMs, friction increased linearly as a function of applied normal load. Results showed that friction was affected by the inherent adhesion in Si-wafer, and in the case of SAMs the physical/chemical structures had a major influence. Coefficient of friction of these test samples was also evaluated at the micro-scale using a micro-tribotester. It was observed that SAMs had superior frictional property due to their low interfacial energies. In order to study of the effect of contact area on friction coefficient at the micro-scale, friction was measured for Si-wafer and DPDM against Soda Lime balls (Duke Scientific Corporation) of different radii 0.25 mm, 0.5 mm and 1 mm at different applied normal loads $(1500,\;3000\;and\;4800{\mu}N)$. Results showed that Si-wafer had higher friction coefficient than DPDM. Furthermore, unlike that in the case of DPDM, friction was severely influenced by wear in the case of Si-wafer. SEM evidences showed that solid-solid adhesion to be the wear mechanism in Si-wafer.

• KSTLE International Journal
• /
• v.5 no.2
• /
• pp.37-43
• /
• 2004

Abstract : Nano/micro-scale friction properties were investigated on Si (100) and three self-assembled monolayers (SAMs) (PFOTC, DMDM, DPDM) coated on Si-wafer by chemical vapor deposition technique. Experiments were conducted at ambient temperature(24$pm$1$circ$C) and humidity(45$pm$5%). Friction at nano-scale was measured using Atomic Force Microscopy (AFM) in the range of 0-40nN normal loads. In both Si-wafer and SAMs, friction increased linearly as a function of applied normal load. Results showed that friction was affected by the inherent adhesion in Ssi-wafer, and in the case of SAMs the physical/chemical structures had a major influence. Coefficient of friction of these test samples at the micro-scale was also energies. In order to study the effect of contact area on coefficient of friction at the micro-scale, friction was measured for Si-wafer and DPDM against Soda Lime balls (Duke Scientiffic Corporation) of different radii (0.25 mm, 0.5 mm and 1 mm) at different applied normal loads (1500, 3000 and 4800 mN). Results showed that Si-wafer had higher coefficient of friction than DPDM. Further, unlike that in the case of DPDM, friction in Si-wafer was severely influenced by its wear. SEM evidences showed that solid-solid adhesion was the wear mechanism in Si-wafer.

• Korean Chemical Engineering Research
• /
• v.46 no.4
• /
• pp.701-706
• /
• 2008

Nano-sized nickel powders were prepared by evaporating the bulk nickel metarial using transferred arc thermal plasma. Nitrogen gases are easily dissociated to atomic nitrogen in thermal plasma and they are quickly dissolved in molten nickel. Super-saturated atomic nitrogen in molten nickel is recombined to nitrogen gas because of the relatively low temperature of nickel surface. Generally, the recombine reaction of atomic nitrogen is exothermic, so bulk nickel is quickly evaporated to nickel vapor due to the thermal energy of recombine reaction. The particle size of nickel powder was controlled by $N_2$ used as the diluting gas. It was observed that as the diluting gas flow rate was increase, the particle size was decreased and the particle size distribution was narrowed. The average particle size at 250 l/min of the diluting gas was 202 nm analyzed by means of the particle size analyzer (PSA).

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.388-388
• /
• 2011

Graphene, with its unique physical and structural properties, has recently become a proving ground for various physical phenomena, and is a promising candidate for a variety of electronic device and flexible display applications. The physical properties of graphene depend directly on the thickness. These properties lead to the possibility of its application in high-performance transparent conducting films (TCFs). Compared to indium tin oxide (ITO) electrodes, which have a typical sheet resistance of ~60 ${\Omega}/sq$ and ~85% transmittance in the visible range, the chemical vapor deposition (CVD) synthesized graphene electrodes have a higher transmittance in the visible to IR region and are more robust under bending. Nevertheless, the lowest sheet resistance of the currently available CVD graphene electrodes is higher than that of ITO. Here, we report an ingenious strategy, irradiation of MeV electron beam (e-beam) at room temperature under ambient condition,for obtaining size-homogeneous gold nanoparticle decorated on graphene. The nano-particlization promoted by MeV e-beam irradiation was investigated by transmission electron microscopy, electron energy loss spectroscopy elemental mapping, and energy dispersive X-ray spectroscopy. These results clearly revealed that gold nanoparticle with 10~15 nm in mean size were decorated along the surface of the graphene after 1.0 MeV-e-beam irradiation. The fabrication high-performance TCF with optimized doping condition showed a sheet resistance of ~150 ${\Omega}/sq$ at 94% transmittance. A chemical transformation and charge transfer for the metal gold nanoparticle were systematically explored by X-ray photoelectron spectroscopy and Raman spectroscopy. This approach advances the numerous applications of graphene films as transparent conducting electrodes.

• New Physics: Sae Mulli
• /
• v.68 no.11
• /
• pp.1203-1207
• /
• 2018

In this study, silica nanowires were formed using silicon oxide films with different oxygen contents, and their microstructure and physical properties were compared with those of silica nanowires formed using Si wafers. The silicon oxide films were fabricated by using a plasma-enhanced chemical vapor deposition method. Silica nanowires were formed by thermally annealing silicon oxide films coated with nickel films as a catalyst. In the case of silicon oxide films having an oxygen content of approximately 50 at.% or less, the formation mechanism, microstructure, and physical properties of the nanowires were not substantially different from those of the silicon wafer. In particular, the uniformity of the thickness showed better behavior in the silicon oxide films. These results imply that silicon oxide films can be used as an alternative for fabricating high-quality silica nanowires at low cost.