• Title/Summary/Keyword: Photoinitiator

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Analysis of ITX from Commercial Carton Packs in Korean Market (국내 유통 종이팩 포장재 중 Isopropylthioxanthone(ITX) 분석)

  • Eom, Mi-Ok;Yoon, Hae-Jung;Choi, Hyun-Cheol;Jeon, Dae-Hoon;Kim, Hyung-Il;Sung, Jun-Hyun;Park, Na-Young;Lee, Eun-Joon;Sung, Duk-Hwa;Lee, Young-Ja
    • Journal of Food Hygiene and Safety
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    • v.22 no.2
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    • pp.88-92
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    • 2007
  • Isopropylthioxanthone(ITX) is used as a photoinitiator In UV-cured inks, triggering the radical polymerization of the acrylic component of such inks and thus causing the liquid ink film to cure. Recently ITX was detected in carton packed food in Italy. In order to cope with risk issues of overseas and acquire monitoring data on ITX, we have established the method using HPLC/FLD for ITX analysis after reviewing parameters of the analytical methods. Limit of detection (LOD) and limit of quantification (LOQ) were 0.02 ppb and 0.1 ppb, and linearity and RSD (%) were 0.9991 and 1.09, respectively. We have investigated ITX levels migrated to food on 87 commercial products packed in carton and ITX was not detected any food. Therefore it is supposed that UV-cured ink containing ITX as photoinitiator is not currently used in printing of carton pack in Korea.

Optimal combination of 3-component photoinitiation system to increase the degree of conversion of resin monomers (레진 모노머의 중합전환률 증가를 위한 3종 중합개시 시스템의 적정 비율)

  • Kim, Chang-Gyu;Moon, Ho-Jin;Shin, Dong-Hoon
    • Restorative Dentistry and Endodontics
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    • v.36 no.4
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    • pp.313-323
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    • 2011
  • Objectives: This study investigated the optimal combination of 3-component photoinitiation system, consisting of CQ, p-octyloxy-phenyl-phenyl iodonium hexafluoroantimonate (OPPI), and 2-dimethylaminoethyl methacrylate (DMAEMA) to increase the degree of conversion of resin monomers, and analyze the effect of the ratio of the photoinitiator to the co-initiator. Materials and Methods: Each photoinitiators (CQ and OPP) and co-initiator (DMAEMA) were mixed in three levels with 0.2 wt.% (low concentration, L), 1.0 wt.% (medium concentration, M), and 2.0 wt.% (high concentration, H). A total of nine groups using the Taguchi method were tested according to the following proportion of components in the photoinitiator system: LLL, LMM, LHH, MLM, MMH, MHL, HLH, HML, HHM. Each monomer was polymerized using a quartz-tungsten-halogen curing unit (Demetron 400, USA) for 5, 20, 40, 60, 300 sec and the degree of conversion (DC) was determined at each exposure time using FTIR. Results: Significant differences were found for DC values in groups. MMH group and HHM group exhibited greater initial DC than the others. No significant difference was found with the ratio of the photoinitiators (CQ, OPPI) to the co-initiator (DMAEMA). The concentrations of CQ didn't affect the DC values, but those of OPPI did strongly. Conclusions: MMH and HHM groups seem to be best ones to get increased DC. MMH group is indicated for bright, translucent color and HHM group is good for dark, opaque colored-resin.

Investigating the Effect of Photoinitiator Types and Contents on the Photocuring Behavior of Photocurable Inks and Their Applications for Etching Resist Inks (광개시제 종류 및 함량에 따른 광경화형 잉크의 광경화 특성과 인쇄회로기판용 에칭 레지스트 소재로의 적용성 연구)

  • Bo-Young Kim;Subin Jo;Gwajeong Jeong;Seong Dae Park;Jihoon Kim;Eui-Keun Choi;Myong Jae Yoo;Hyunseung Yang
    • Applied Chemistry for Engineering
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    • v.34 no.4
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    • pp.444-449
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    • 2023
  • As electronic devices become smaller and more integrated, the demand for manufacturing thin, flexible printed circuit boards (FPCBs) has increased. Although FPCBs are conventionally manufactured by a photolithography method using dry film resist, this process is complicated, and the mask is specifically designed to obtain the precision of the desired circuit line width. In this regard, manufacturing FPCBs with fine patterns through the direct printing method of photocurable inks has gained growing attention. Since the manufacturing process of FPCBs is based on the direct printing method that includes etching and stripping processes utilizing acid and basic chemicals, controlling the adhesion strength, the etching resistance, and the strippability of photocured inks has drawn a lot of attention for the fabrication of fine patterns through photocurable inks. In this study, acrylic ink with various types and contents of the photoinitiator was prepared, and the curing behavior was analyzed. Also, the adhesion strength, etching resistance, and strippability were analyzed to evaluate the applicability of developed photocurable etching resist inks.

Synthesis of Imide Monomers for Application to Organic Photosensitive Interdielectric Layer

  • Kwon, Hyeok-Yong;Vu, Quang Hung;Lee, Yun-Soo;Park, Lee-Soon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.816-819
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    • 2008
  • A negative photoresist formulation was developed utilizing synthesized UV monomers containing imide linkage, photoinitiator, UV oligomer, and alkali developable polymer matrix. It was found that via-holes with good resolution, high transmittance and thermal resistance could be obtained by photolithographic process utilizing the negative-type photoresist formulations.

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가교방법이 PVA 필름의 겔 특성에 미치는 영향

  • Gu, Gwang-Hoe;Jang, Jin-Ho
    • Proceedings of the Korean Society of Dyers and Finishers Conference
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    • 2009.11a
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    • pp.15-16
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    • 2009
  • Poly(vinyl alcohol) was crosslinked by UV irradiation in the presence of water soluble photoinitiators. The crosslinking of PVA films with 1,2,3,4-Butanetetracarboxylic acid(BTCA) and sodium phosphinate monohydrate(SPM) was also achieved via thermal curing. Different factors in the crosslinking including thermal and radiation methods were studied. Gel fraction of PVA films increased with increasing photoinitiator concentration. The maximum gel fraction on the crosslinking method was reached about 81%. The glass transition and maximum decomposition temperature improved by both thermal and radiation crosslinking.

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Effect of Photopolymerization on the Rate of Photocrosslink in Chalcone-based Oligomeric Compounds

  • Choe, Dong Hun;O, Sang Jun;Ban, Si Yeong;O, Gwang Yong
    • Bulletin of the Korean Chemical Society
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    • v.22 no.11
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    • pp.1207-1212
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    • 2001
  • A new photochemically bifunctional epoxy and dimethacrylate compounds were synthesized for investigating the photosensitivity under UV irradiation. Photosensitivity of the synthesized chalcone-based compounds was investigated by using UV-visible absorption and Fourier transformed infrared (FT-IR) spectroscopies. The result of spectroscopic analysis substantiated that the two chalcone-based compounds have functions of both photocrosslinking and photopolymerization by UV exposure in the presence of photoinitiator. Two kinds of photochemical reactions proceeded competitively during UV exposure. Particularly, we studied the effect of photopolymerization on the rate of photocrosslink due to cycloaddition in the two oligomeric compounds.

Analysis of Chemical and Mechanical Properties of UV Curing Resin (UV 경화 수지의 화학적 기계적 경화특성 분석)

  • Jang, Yong-Soo;Kim, Jeong-Keun;Go, Sun-Ho;Kwac, Lee-Ku
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.6
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    • pp.88-95
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    • 2020
  • Currently, Fiber-Reinforced Plastic (FRP) composite materials are used in many industrial fields, owing to their superior stiffness and specific strength compared to metals. However, there are issues with FRP inefficiency, due to low productivity of such materials, environmental problems they pose and long curing times needed. Trying to address these issues, research was conducted towards the development of a FRP composite material with excellent properties and short production time, introducing a curing method using a UV lamp. Four types of composite materials were prepared, cured with catalyst or UV (CZ: Catalyst + ZNT 6345, CR: Catalyst + RF 1001 MV, UVZ: Photoinitiator + ZNT 6345, and UVR: Photoinitiator + RF 1001 MV). Examination of the chemical and mechanical properties of these composites showed that UV-cured materials performed better than the catalyst-cured ones. These results indicate that the production process of FRP composite materials can be simplified by using a UV lamp for curing, resulting in composite materials with the same quality, but reduced production time by about 70% compared to currently used practices. This advancement will contribute greatly to the composite material industry.

Photolithographic Properties of Photosensitive Ag Paste for Low Temperature Cofiring (저온동시소성용 감광성 은(Ag)페이스트의 광식각 특성)

  • Park, Seong-Dae;Kang, Na-Min;Lim, Jin-Kyu;Kim, Dong-Kook;Kang, Nam-Kee;Park, Jong-Chul
    • Journal of the Korean Ceramic Society
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    • v.41 no.4
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    • pp.313-322
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    • 2004
  • Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$\mu\textrm{m}$ width could be obtained after cofiring.

Synthesis and Characterization of Photosensitive Polyimides Containing Alicyclic Structure (지방족고리 구조를 함유하는 감광성 폴리이미드 수지의 합성 및 특성 평가)

  • 심종천;최성묵;심현보;권수한;이미혜
    • Polymer(Korea)
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    • v.28 no.6
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    • pp.494-501
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    • 2004
  • A new alkali developable photosensitive poly(amic acid) (PAA-0) with transmittance at 400 nm was synthesized from cyclobutane-1,2,3,4-tetracarboxylic dianhydride, 2-(methacryloyloxy)ethyl-3,5-diamino-benzoate and 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyl disiloxane in N-methyl-2-pyrrolidinone. Photosensitivity of the PAA-0 was investigated at 365-400 nm in the presence of a photoinitiator using a high pressure mercury lamp. The photo-cured poly(amic acid) was insoluble toward aqueous 2.38 wt% tetramethylammonium hydroxide solution. Negative pattern of the PAA-0 with 25 ${\mu}{\textrm}{m}$ resolution was obtained by developing with 2.38 wt% tetramethylammonium hydroxide solution after exposure of 600 mJ/$\textrm{cm}^2$ in the presence of 2,2-dimethoxy-2-phenyl-acetophenone as a photoinitiator. The patterned poly(amic acid) was converted to polyimide by thermal curing at 25$0^{\circ}C$ for 50 min, which showed chemical resistance against photoresist stripper as well as good transmittance at 400 nm.

Effect of Liquid Isoprene Rubber on the Adhesion Property of UV Curable Acrylic Pressure-Sensitive Adhesive (액상 이소프렌 고무가 자외선 경화형 아크릴 점착제의 점착 특성에 미치는 영향)

  • Lee, Jiye;Chung, Kyungho
    • Elastomers and Composites
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    • v.49 no.3
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    • pp.210-219
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    • 2014
  • In this study, the acrylic pressure sensitive adhesive (PSA) for the optical functionality sheet was prepared by blending liquid isoprene rubber. The acrylic PSA was synthesized with butyl acrylate, acrylic acid, 2-ethylhexyl acrylate and 2-hydroxyethyl methacrylate. Toluene was used to a solvent for polymerization. Liquid isoprene rubber (LIR-50) was blended with the acrylic PSA and blend ratio was 0 ~ 50 wt%. According to the results, the adhesive transfer, which was the big problem of acrylic adhesive, was reduced with the addition of LIR-50. The secondary bonding of LIR-50 with substrate did not occurred due to absence of polar group in LIR-50. The peel strength and adhesive transfer were decreased by UV curing and the degreed of decrease depended on the amounts of photoinitiator and UV irradiation time. On the other hand holding power increased drastically by increasing amounts of photoinitiator and UV irradiation time.