• 동굴
• /
• 제77호
• /
• pp.21-30
• /
• 2007

Photo-lithography lies in the middle of the wafer fabrication process. It is often considered as the most critical step in the IC process. We use a mask in exposure steps of the photo-lithography. Typically, 20 to 25 different levels of masks are required to complete an IC device. That means, if a photo process can be developed with the use of only one photo mask, we can reduce more process cost. To satisfy this, we plan to develop an alternative photo mask. For this reason, we chose to use a LCD. We expect to develop a LCD panel that can be changed by electrical control. This is the main idea about the adjustive photo mask. The Photo mask made of LCD panel will replace the former one.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
• /
• pp.850-853
• /
• 2005

This paper presents issues of display hardware architecture, relating to memory, display driver IC architecture, and chip-to-chip interface. To achieve a low power and low cost mobile phone, not only the display architecture must be carefully selected, but also the driver-ICs optimized to accommodate the different modes of operation found in typical handheld devices. The technique of forming a photo sensor in each pixel using TFT and display module architecture are developed to add multi functions in display such as fingerprint recognition, image scanning, and integrated touch screen. Detailed architectures of IC partitioning, high-speed serial interface, D/A converter, and multi functions such as fingerprint recognition and image scanning using photo sensors are important to a power optimized system.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2008년도 춘계종합학술대회 A
• /
• pp.713-716
• /
• 2008

본 논문은 모바일 디스플레이를 위한 자동 백라이트 밝기 조정 시스템을 제안한다. 모바일 디스플레이에서 가장 중요한 요소들 중의 하나가 이동시 제한된 전력 원으로 인한 전력 소모를 들 수 있다. LCD 디스플레이에서 공급 전력의 80% 이상이 LED 백라이트 (BL박에서 소비된다. 또한 디스플레이 밝기는 동영상과 고해상도 영상 적용 시 더 높아야 하기 때문에 과도한 전력이 소비될 뿐만 아니라 어두운 환경에서는 지나친 눈부심을 줄 수 있다. 이러한 경우 밝기를 자동으로 줄여주고, 소비전력 또한 줄이기 위해 본 논문은 모바일 디스플레이 분야에서 자동 밝기 조절 (ABC) 기술을 제안한다. 개발된 시스템은 내장형 광센서를 가진 패널, 광센서를 조절할 수 있는 구동 IC 및 BLU로 구성되어 있다. 패널에 내장된 광센서 어레이가 외부의 광을 자동으로 검지하기 때문에 어두운 환경에서 BLU의 소비전력은 감소된다. 개발된 ABC 시스템은 어두운 환경에서 50%의 감소된 소비전력 특성을 보였다. 이러한 시스템은 모바일 TFT-LCD의 전력을 조절하는데 상당히 유용하다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.1175-1178
• /
• 2005

Brittle materials, especially single-crystal silicon wafer, are widely used for sensors, IC industry, and MEMS applications. e general machining process of crack easy materials is by chemical agents, but it is hazardous and time consuming. Also, it is difficult to get high aspect ratio micro structure. As an alternative tool, an AJM(Abrasive jet machining) is promising method in terms of high aspect ratio and production cost. In this study, to get more precise detail compared to general AJM, photo polymer mask, SU-8, used in photolithography was applied in AJM. Process parameters such as abrasive diameter, air pressure, nozzle diameter, flow rate of abrasive in AJM and a variety of conditions in spin coating were decided. Finally, micro channel and mixer was fabricated to see the efficiency of the AJM with photo polymer mask.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2004년도 학술대회지
• /
• pp.717-722
• /
• 2004

A design was done, and all characteristic of photodetectr of the web pattern type which a standard process of the Bipolar which Si PIN structure was used in this paper, and was used for the current amplifier design was used, and high-speed, was used as receiving optcal area of high altitude, and the module which had a low dark current characteristic was implemented with one chip with a base. Important area decreases an area of Ie at the time of this in order to consider an electrical characteristic and economy than the existing receiving IC, and performance of a product and confidence are got done in incense. First of all, the receiving IC which a spec, pattern of a wafer to he satisfied with the following electrical optical characteristic that produced receiving IC of 5V and structure are determined, and did one-chip is made. On the other hand, the time when AR layer of double is $Si_{3}N_{4}/SiO_{2}=1500/1800$ has an optical reflectivity of less than $10{\%}$ on an incidence optical wavelength of 660 ,and, in case of photo detector which reverse voltage made with 1.8V runs in 1.65V, an error about a change of thickness is very the thickness that can be improved surely. And, as for the optical current characteristic, about 5 times increases had the optical current with 274nA in 55nA when Pc was -27dBm. A BJT process is used, and receiving IC running electricity suitable for low voltage and an optical characteristic in minimum 1.8V with a base with two phases is made with one chip. IC of low voltage operates in 1.8V and 3.0V at the same time, and optical link receiving IC is going to be implemented

• 한국식품과학회지
• /
• 제26권3호
• /
• pp.195-198
• /
• 1994

Yeast 발효공정에서 발생되는 가스량을 전자적으로 monitoring 할 수 있는 새로운 기포수 계측 쎈서를 설계, 제작하였다. 본 기포쎈서는 기체를 발생하는 발효공정에 적용할 수 있으며 공정의 상태와 환경에 아무런 변화를 주지 않도록 설계하였다. 그 구조는 가스포집부, 기포형성부, 전자식 기포감지부와 컴퓨터 접속장치로 구성하였다. 기포 계측부는 photo-interrupter카 counter IC 등을 사용하였다. 제작된 쎈서와 컴퓨터 시스템은 효모 배양공정에 활용하여 발효진행과정을 자동적으로 monitoring 하는데 성공하였으며 발효공정에서 발생된 기포수의 값으로 작성된 가스발생량 곡선은 효모의 생육곡선의 양상과 매우 유사한 모양을 보였으며 배양액의 기질영양원이 달리한 발효공정을 monitering한 결과 기질이용 특성도 정확하게 표현할 수 있었다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2012년도 추계학술대회 논문집
• /
• pp.173-174
• /
• 2012

• 전자공학회논문지A
• /
• 제29A권4호
• /
• pp.58-63
• /
• 1992

Photolithography techniques were applied for immobilization of GOD membrane on the pH-ISFET with photo-sensitive polymers to realize ISEFT glucose sensor. This IC technology-compatible glucose sensor showed good sensing characteristics in the wide range of 10-1000 mg/dl glucose concentrations.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
• /
• pp.509-512
• /
• 2004

This paper proposed a new solid State Relay(SSR) structure that can replace the conventional SSR as a power IC. The photodiode arrays, the main part of this structure, were designed and integrated in the same power It chip with the output parts, LDMOSFET and BJT, on a SOI substrate. The fabrication of this input part shared the same output LDMOSFET fabrication processs, except the additional deposition of Silicon nitride($Si_3N_4$) for the photo-detection part. According to LED illumination intensites and photo detecting areas, we could obtain voltage of 0.49V ${\~}$0.52V and current of 5.5uA ${\~}$ 108uA respectively from the fabricated unit photodiode. The maximum value of the voltage and the current we could obtain from the photodiode array were 3.58V and 24.4uA respectively, and the voltage was enough to operate the output LDMOSFET

• 대한안전경영과학회지
• /
• 제6권4호
• /
• pp.155-170
• /
• 2004

Among the semiconductor If-chips, unlike memory chips, a majority of Application Specific IC(ASIC) products are produced by customer orders, and meeting the customer specified due date is a critical issue for the case. However, to the one who understands the nature of semiconductor manufacturing, it does not take much effort to realize the difficulty of meeting the given specific production due dates. Due to its multi-layered feature of products, to be completed, a semiconductor product(called device) enters into the fabrication manufacturing process(FAB) repeatedly as many times as the number of the product specified layers, and fabrication processes of individual layers are composed with similar but not identical unit processes. The unit process called photo-lithography is the only process where every layer must pass through. This re-entrant feature of FAB makes predicting and planning of due date of an ordered batch of devices difficult. Parallel machines problem in the photo process, which is bottleneck process, is solved with restricted roll out algorithm. Roll out algorithm is a method of solving the problem by embedding it within a dynamic programming framework. Restricted roll out algorithm Is roll out algorithm that restricted alternative states to decrease the solving time and improve the result. Results of simulation test in condition as same as real FAB facilities show the effectiveness of the developed algorithm.