• Title/Summary/Keyword: Phenol resin

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Ethylene Gas Adsorption of Clay-Woodceramics from 3 layers-clay-woodparticleboard

  • Lee, Hwa Hyoung;Kang, Seog-Goo
    • Journal of the Korean Wood Science and Technology
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    • v.31 no.6
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    • pp.83-88
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    • 2003
  • The woodceramics are porous amorphous carbon and glassy carbon composite materials. Woodceramics attracted a lot of attention in recent years because they are environmentally friendly and because of their unique functional characteristics such as catalysis, moisture absorption, deodorization, purification, carrier for microbial activity, specific stiffness, corrosion and friction resistance, and their electromagnetic shielding capacity. In this paper, we made new products of clay-woodceramics to investigate the industrial analysis and ethylene gas adsorption for basic data of building- and packging- materials keeping fruit fresh for a long time. Clay-woodceramics were carbonized for 3 h of heating in a special furnace under a gas flow of nitrogen(15 ml/min.) from 3 layers-clay-woodparticleboard made from pallet waste wood, phenol- formaldehyde resin(hereafter PF, Non volatile content:52%, resin content 30%), and clay(10%, 20% and 30%). Carbonization temperature was 400℃, 600℃ and 800℃. Experimental results shows that the higher the carbonization temperature, the higher the fixed carbon and the lower the volatile contents. The higher the clay content, the more the ash content. The higher the carbonization temperature, the more the ethylene gas adsorption. Carbonization temperature of 800℃ gave the best reslts as same as that of white charcoal and activated carbon.(800℃-clay-woodceramic: 5.36 ppm, white charcoal: 5.66 ppm, activated carbon: 5.79 ppm) The clay contents did not make difference of ethylene gas adsoption.

Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials (FO-WLP (Fan Out-Wafer Level Package) 차세대 반도체 Packaging용 Isocyanurate Type Epoxy Resin System의 경화특성연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.65-69
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    • 2019
  • The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

Kinetics of Pyrolysis Degradation of Cured Phenol Resin (SC-1008) (I). (경화된 페놀 수지 (SC-1008)의 열분해 반응에 관한 연구(I).)

  • 김연철;강희철;예병한;배주찬
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 1996.11a
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    • pp.137-144
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    • 1996
  • The kinetic coefficients far decomposition of the cured phenol resin (SC-1008) using a modified Arrhenius relationship have been determined from thermogavimetric analyses (TGA). The kinetic parameters were determined by multiple heating rate technique developed by Freideman and Henderson. Weight loss (decomposition) and weight loss rate (decomposition rate)were measured and recorded for three heating rates; $5^{\circ}C$/min ,$10^{\circ}C$/min, and $20^{\circ}C$/min. Relatively good agreement was obtained between measured and calculated decomposition as a function of temperature. By separating the reaction, the reaction order and pre exponential factor become empirical parameters which provide a "best fit" of the data. However, this method yields an extremely accurate reproduction of the thermograms over a wide range of heating rates. This is the desired result for kinetic parameters used in thermal models.al models.

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Manufacturing Characteristics of Wood ceramics from Thinned Small Logs (I) - Resin Impregnation Rate and Bending Strength -

  • Oh, Seung-Won;Hirose, Takashi;Okabe, Toshihiro
    • Journal of the Korean Wood Science and Technology
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    • v.28 no.4
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    • pp.51-55
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    • 2000
  • The woodceramics which are new porous carbon materials were obtained by carbonizing from thinned small log of Aomori HIBA (Thujopsis dolabrata S. et. Z. var. hondae M.) impregnated with phenol resin in a vacuum furnace. During the carbonization process, the resin changes into glassy carbon, which has superior property. The resin impregnation rate and bending strength depend on the types of board and density. In this paper, the manufacturing method of woodceramics made from thinned small logs of Aomori HIBA was introduced and some properties were examined.

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Thermal Curing Behavior and Tensile Properties of Resole Phenol-Formaldehyde Resin/Clay/Cellulose Nanocomposite

  • Park, Byung-Dae;Kadla, John F.
    • Journal of the Korean Wood Science and Technology
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    • v.40 no.2
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    • pp.110-122
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    • 2012
  • This study investigated the effects of layered clay on the thermal curing behavior and tensile properties of resole phenol-formaldehyde (PF) resin/clay/cellulose nanocomposites. The thermal curing behavior of the nanocomposite was characterized using conventional differential scanning calorimetry (DSC) and temperature modulated (TMDSC). The addition of clay was found to accelerate resin curing, as measured by peak temperature ($T_p$) and heat of reaction (${\Delta}H$) of the nanocomposite’ curing reaction increasing clay addition decreased $T_p$ with a minimum at 3~5% clay. However, the reversing heat flow and heat capacity showed that the clay addition up to 3% delayed the vitrification process of the resole PF resin in the nanocomposite, indicating an inhibition effect of the clay on curing in the later stages of the reaction. Three different methods were employed to determineactivation energies for the curing reaction of the nanocomposite. Both the Ozawa and Kissinger methods showed the lowest activation energy (E) at 3% clay content. Using the isoconversional method, the activation energy ($E_{\alpha}$) as a function of the degree of conversion was measured and showed that as the degree of cure increased, the $E_{\alpha}$ showed a gradual decrease, and gave the lowest value at 3% nanoclay. The addition of clay improved the tensile strengths of the nanocomposites, although a slight decrease in the elongation at break was observed as the clay content increased. These results demonstrated that the addition of clay to resole PF resins accelerate the curing behavior of the nanocomposites with an optimum level of 3% clay based on the balance between the cure kinetics and tensile properties.

Manufacture of Wood Veneer-Bamboo Zephyr Composite Board: II. Effect of Manufacturing Conditions on Properties of Composite Board (목재 단판-대나무 제퍼 복합보드 제조: II. 복합보드의 성능에 미치는 제조조건의 영향)

  • Roh, Jeang Kwan
    • Journal of the Korean Wood Science and Technology
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    • v.35 no.6
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    • pp.108-117
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    • 2007
  • This research was performed to investigate the feasibility of bamboo as a raw material for the manufacture of plywood. Wood veneer-bamboo zephyr composite boards (WBCB) were manufactured using keruing (Dipterocarpus sp.) veneers and hachiku bamboo (Phyllostacbys nigra var. henonis Stapf) using various adhesives, and the effect of the method and amount of resin spread on the mechanical properties of the composites were investigated. The WBCB manufactured using polymeric isocyanate (PMDI) showed the best mechanical properties, followed by phenol-formaldehyde resin (PF), phenol-melamine-formaldehyde resin, urea-melamine-formaldehyde resin, and urea-formaldehyde resin. However, considering the operation feasibility as well as mechanical properties, PF resin proved to be the appropriate adhesive for the practical purpose. As the amount of resin spread increased, the mechanical properties of 5-ply WBCB with 12 mm thicknesses manufactured using PF resin tended to increase, and more failure occurred at the interface between veneer and bamboo zephyr than at the interface among bamboo zephyrs. This result suggests that penetration of resin into bamboo zephyr could be the important factor. In this research, the appropriate amount of resin amount was $320g/m^2$. 5-ply WBCBs were manufactured using various methods of resin spread but the effect of the methods on the mechanical properties showed no little difference, which meant that the method of resin spread could be chosen considering the manufacturing conditions and operation feasibility.

Synthesis and performance assessment of modified epoxy resins containing fatty acid (지방산 변성 에폭시수지 합성과 성능평가)

  • Lee, Dong-Chan;Kim, Jin-Wook;Choi, Joong-So
    • Journal of the Korean Applied Science and Technology
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    • v.33 no.4
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    • pp.634-646
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    • 2016
  • In this work, modified epoxy resins which were well melted in mild solvent were synthesized and solubility assessment was carried out for synthesized epoxy resins. Bisphenol-A type, phenol novolac type and ortho-cresol novolac type epoxy resins were used and fatty acid, dodecyl phenol (DP) and toluene diisocyanate (TDI) were added for synthesis of modified epoxy resins containing fatty acid (MEFA). Composition was epoxy resin/fatty acid = 1.0/0.5 and fatty acid/DP = 0.25/0.25 by equivalent weight and twelve MEFAs were synthesized according to epoxy resins. Viscosity and solubility were measured for twelve MEFAs. As a result, solubility of MEFA was excellent for mild solvent according to increasement of contents of benzene ring, glycidyl group and carbon number of alkyl group. And physical properties were measured for each coating of paints after preparing transparent paints of MEFA to melt well in mild solvent among twelve MEFAs. As a result, they showed an optimal performance on conditions of equivalent ratio of bisphenol-A type epoxy resin/fatty acid/DP/TDI; 1.0/0.25/0.25/0.5 and equivalent ratio of phenol novolac type epoxy resin/fatty acid/DP; 1.0/0.25/0.25 for drying time, adhesion, hardness, impact resistance and alkali resistance.

A Study on the Extension of Urea, Urea-Melamine Copolymer and Water Soluble Phenol Resin Adhesives of Plywood (합판용(合板用) 요소(尿素), 요소(尿素) 메라민 공축합(共縮合) 및 수용성(水溶性) 석탄산수지(石炭酸樹脂) 접착(接着)의 증량(増量)에 관(関)한 연구(硏究))

  • Lee, Phil Woo;Kwon, Jin Heon
    • Journal of Korean Society of Forest Science
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    • v.48 no.1
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    • pp.40-50
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    • 1980
  • This research was carried out to examine the substitutional feasibility of low-priced materials produced in waste of forest instead of wheat flour which is extended for plywood adhesives. Wheat, pine bark, wood flour and pine foliage of coniferous trees or poplar foliage of hardwood species were selected and pulverized into 60-100 mesh minute powder after they were dried at $100-105^{\circ}C$ during 24 hours in the drying oven. The prepared particles as above were added to urea formaldehyde resin, urea-melamine copolymer resin and water soluble phenol formaldehyde resin in the ratio of 10, 20, 30 and 50%. After plywoods were processed by the above extending ratios, shear strength of extended plywoods were analyzed and discussed. The results obtained at this study were summarised as follows; 1. In the case of urea formaldehyde resin, both dry and wet shear strength of plywoods extended by wheat flour were shown the highest value. 2. Dry shear strength of urea-melamine copolymer resin was better than that of urea formaldehyde resin on the whole, while plywoods extended by wheat flour were shown excellent results. 3. Among 10% and 20% extensions of urea-melamine copolymer resin, the best results were shown by poplar leaves powder, wheat powder and wood flour. They had no significant difference statistically. 4. In the case of water soluble phenol formaldehyde resin, although dry shear strength of pine leaves powder was higher than that of wheat flour in the ratio of 10%, there was no significant difference between them in the ratio of 10 and 20%. 5. Among 20, 30 and 50% extensions of water soluble phenol formaldehyde resin, wet shear strength of wood flour and bark powder was higher than that of wheat flour. Wet shear strength of wood flour in the ratio of 10% was shown the same tendency as above.

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난연.기능성 복합성형체 제조 및 특성

  • 현병민;강영구
    • Proceedings of the Korean Institute of Industrial Safety Conference
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    • 2002.05a
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    • pp.457-460
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    • 2002
  • 현재 건축단열재, 흡음재, 바닥재로 사용되는 panel 성형, 제작하기 위해 다종의 유기고분자 matrix가 사용되고 있으며 polyurethane, vinyl acetate, urea-formaldehyde resin 또는 melamine-formaldehyde, phenol-form aldehyde resin 등을 사용하고 있으나 이러한 고분자 matrix를 사용한 건축용 panel의 경우 화재시 유독 gas와 더불어 급격한 화재전파의 매개체로 사용될 수 있어 난연제 첨가로 이러한 현상을 억제하고 있다.(중략)

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Smoke Density Characteristics of the FRP to the variance of test method, resin type and specimen shape (FRP 복합재의 시험조건 변화에 따른 연기 위해성 평가)

  • 이덕희;정우성;김용기;김선옥
    • Proceedings of the KSR Conference
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    • 2002.05a
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    • pp.567-571
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    • 2002
  • In this study we reported the Smoke Density test method of interior panel of railroad passenger car and investigated the specific smoke density(Ds) by NBS smoke chamber to the variance of some test conditions. First we compared the result of Ds from ISO 5659-2 with that from ASTM E662 for same phenol FRP Secondary studied the Ds value to the variance of resin type and to the variance of specimen shape.

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