• 제목/요약/키워드: Peltier device

검색결과 41건 처리시간 0.024초

Control of Junction Temperature in LEDs with Peltier Effect

  • 김윤중;김정현;한상호;정종윤;김현철;강한림;조광섭
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.268-268
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    • 2011
  • 열전소자를 사용하여 발광다이오드의 발열을 개선한다. 열전소자(Thermoelectric device: TED)의 펠티에효과(Peltier effect)를 이용하여 발광다이오드(Light Emitting Diodes: LED)의 접합온도 (Junction Temperature)를 제어한다. 열전소자의 구동 전력을 제어하여, 발광다이오드의 사용 전류에 대한 접합온도의 특성을 조사한다. 열전소자의 입력 전력 0.2W에 대하여, 일반 조명용 또는 표시 장치로 사용되는 1W급 고전력 LED를 정격전류(350 mA)로 구동할 때 접합온도를 최저 $69^{\circ}C$로 유지할 수 있다. 열전소자의 구동 전력이 0.2W일 때, 발광다이오드의 접합온도 $110^{\circ}C$에 대하여 최대 사용 가능 전류는 560 mA로 예측된다.

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복합재료에 의한 열전변환 냉각소자의 개발에 관한 연구 (Experimental fabrication and analysis of thermoelectric devices)

  • 성만영;송대식;배원일
    • E2M - 전기 전자와 첨단 소재
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    • 제9권1호
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    • pp.67-75
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    • 1996
  • This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

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유전알고리즘을 이용한 열전소지 기반 히팅 시스템의 최적 온도 제어기 구현 (Implementation of Optimal Temperature Controller for Thermoelectric Device-based Heating System Using Genetic Algorithm)

  • 공정식
    • Design & Manufacturing
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    • 제17권3호
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    • pp.41-47
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    • 2023
  • This paper presents the development of a controller that can control the temperature of an heating system based on a thermoelectric module. Temperature controller using Peltier has various external factors such as external temperature, characteristics of an aluminum plate, installation location of temperature sensors, and combination method between the aluminum plate and heating element. Therefore, it is difficult to apply the simulation and simulation results of heating system using Peltier at control algorithm. In general, almost temperature controller is using PID algorithm that finds control gain value heuristically. In this paper, it is proposed mathematical model that explain correlate between the temperature of the heating system and input voltage. And then, optimal parameter of estimated thermal model of the aluminum plate are searched by using genetic algorithm. In addition, based on this estimated model, the optimal PID control gain are inferred using a genetic algorithm. All of the sequence are simulated and verified with proposed real system.

광분광기의 노이즈 감소를 위한 암전류에 대한 실험적 고찰 (Experimental Study on Dark Current Noise to Reduce Background Voltage Level of Optical Emission Spectroscopy)

  • 육영준;이건우;최은종;김효영;김기현
    • 반도체디스플레이기술학회지
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    • 제22권4호
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    • pp.93-98
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    • 2023
  • As semiconductor devices become highly integrated and process difficulty increases, the need for highly sensitive sensors that can detect micro leaks is increasing. However, the noise contained in the CCD sensor itself acts as an obstacle to detecting fine leaks. In this study, integration time was changed for each condition, the sensor was cooled to 0℃, and the dark voltage level was measured to confirm through experiment the characteristics of the temporal noise included in the CCD sensor, a component of OES (Optical Emission Spectroscopy). When integration time was reduced from 30msec to 10msec, the dark voltage level decreased by about 20.5 % from an average of 151.5mV to 120.5mV. In the case of cooling device, Peltier elements were selected because of their simple structure and small size. During temperature cooling, the target temperature was controlled to within ±0.5℃ through PID control. When cooled from 20℃ to 0℃ using this cooling device, it was confirmed that the dark voltage level decreased by about 7% from an average of 147.0mV to 137.0mV.

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펠티어 냉난방시스템 최적화 기술에 관한 연구 (A Study on Optimization Development of Peltier Air-conditioning System)

  • 박상훈;정수진;박영우;박유경;송범중
    • 융복합기술연구소 논문집
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    • 제3권1호
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    • pp.19-23
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    • 2013
  • This study is concerned with air-conditioning system in use of thermoelectric device. It is introduced that the well designed structures for better cooling & heating performance with high efficiency. And also it is performed that the system performance test of four types trial products for the use of hybrid commercial vehicle. System performance is affected by many component parts, especially heat sink design & power control method. It is applied that dual extrusive fin tube with buffer zone for the effective radiating of circulating liquid in tube. And also it is applied that power supply method with constant-current system. It is attained that system cooling capacity is 1.2kW, COP is 0.95.

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사출 금형의 능동형 온도제어에 따른 사출특성에 관한 연구 (A Study on Injection Characteristic using Active Temperature Control of Injection mold)

  • 조창연;신홍규;홍남표;서영호;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 추계학술대회 논문집
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    • pp.302-305
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    • 2007
  • In recent years, many researches on new storage media with high capacity and information are developing. For manufacture of optical storage with high capacity, the injection molding process is generally used. In order to increase the filling ratio of the injection molding structure, the injection molding process required for high injection pressure, packing pressure and temperature control of the mold. However, conventional injection molding process is difficult to increase the filling ratio using injection master with the range of several nanometers and high aspect ratio. In order to improve and increase filling ratio of nano-structure with high aspect ratio, the active temperature control of injection mold was used. Experimental conditions were used injection pressure, time and temperature. Consequently, by using the peltier device into injection mold, we carried out the efficient and active temperature control of mold at low cost.

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급속냉각·가열장치에 따른 사출성형품의 휨에 관한 연구 (A Study on the Warpage of Injection Molded Parts for the rapid Cooling and Heating Device)

  • 이민;김태완
    • 한국산학기술학회논문지
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    • 제16권8호
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    • pp.5074-5081
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    • 2015
  • 플라스틱 제품의 휨을 개선하기 위한 방법은 사출성형 공정에서 일어나는 불균일한 냉각을 균일하게 만들어 플라스틱 제품의 잔류응력을 제거하는 방법이다. 본 연구는 균일한 냉각을 위하여 펠티에 소자를 사용하여 급속가열 냉각 장치를 개발하였다. 급속냉각 가열 장치(RCHD)를 제작하여 전통적인 수냉 장치(TWCD)방식과 급속냉각 가열 장치방식에 따른 휨을 비교 분석하였고, 비결정성 수지인 ABS 수지를 사용하였다. 사출성형 조건인 보압시간, 금형온도, 냉각시간, 보압에 따라 휨의 변화량을 측정 비교하였고, 비결정성 ABS 수지에서 급속가열 냉각 장치 냉각방식이 전통적인 수냉방식 보다 휨이 더 적게 발생하고, 위의 결과들로 보아 조금 더 균일하게 냉각되는 것을 알 수 있었다. ABS 폴리머의 분포 상태를 SEM 사진을 통해서 확인하였다. 전통적인 수냉방식은 폴리머의 분포상태가 조밀하게 분포되어 있고, 급속냉각 가열 방식은 전통적인 수냉방식 보다 넓게 분포되어 있었다. 이것은 냉각이 균일하게 이루어지고, 금형의 온도가 서서히 진행되면서 폴리머의 입자가 커지게 되는데, 이것은 내부응력이 줄어든 것을 의미한다.

열전소자 구조에 따른 COB LED의 방열 성능 비교 분석 (A Comparative Analysis of Thermal Properties of COB LED based on Thermoelectric Device Structure)

  • 김효준;강은영;임성빈;황근창;김용갑
    • 한국인터넷방송통신학회논문지
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    • 제15권2호
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    • pp.189-194
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    • 2015
  • 본 논문에서는 열전소자의 구조에 따른 COB LED의 방열성능을 비교 분석하였다. COB LED의 발열부분과 접합하는 열전소자는 구리박판 구조와 세라믹 구조의 열전소자를 사용하였다. COB LED와 열전소자의 접합부분은 접촉식 온도계를 통해 온도 분포를 측정하였고, 각각의 열전소자는 0.1A, 0.3A, 0.5A, 0.7A의 전류를 입력시켜서 온도 변화를 측정하였다. COB LED의 열 응집현상이 나타나는 접합부분의 온도는 0.7A를 인가하였을 때 구리박판 구조의 열전소자에서 $59^{\circ}C$로 측정되었고, 세라믹 구조의 열전소자는 $67^{\circ}C$로 나타났으며, 구리박판 열전소자가 세라믹 구조의 열전소자 보다 $9^{\circ}C$가 낮게 측정됨으로써 방열성능이 더 우수함을 보였다.

펠티어 소자를 사용한 Low Drift Flux Meter의 기초연구 (A Basic Study on the Low Drift Flux Meter by Using a Peltier Device)

  • 김철한;허진;신광호;사공건
    • 한국전기전자재료학회논문지
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    • 제14권11호
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    • pp.912-916
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    • 2001
  • Fluxmeter is a measuring instrument the magnetic flux intensity by means of an integration of the voltage induced to a search coil to unit time. It also is required to a precise integrator since the voltage induced to a search coil has a differential value of the flux ${\Phi}$ to unit time. In this study, a bias current which is a main problem of the integrator in a drift troublesome depending on the temperature of a FET is investigated. We have confirmed that the temperature dependence of both the bias current of a integrator using the FET and the reversal saturated current of the minor carrier in a P-N junction of a semiconductor were the same. The property of a commercial integrator goes rapidly down with increasing temperature. The bias current of a FET is increased twice as much with 10$^{\circ}C$ increment. As a result, the low drift integrator could be developed by setting the lower temperature up with a pottier device.

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발바닥 부위 쿨링이 심부 체온에 미치는 효과 (The Effect of Foot Cooling on Body Temperature)

  • 박유진;김정훈;박지은;김지인;이종민
    • 대한의용생체공학회:의공학회지
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    • 제38권5호
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    • pp.232-236
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    • 2017
  • In this study, We investigated the effect of foot cooling on the reduction of body temperature after hard exercise at the high temperature of $40^{\circ}C$. We performed a total of 30 subjects, and the subjects performed treadmill exercise for 30 minutes. We produced the cooling device to cool the foot using Peltier module. After the end of the exercise, We performed normal recovery method and cooling recovery method(one foot, both feet) for 1 hour on the same indoor environmental conditions and confirmed the change of body temperature of subjects. The results of deep body temperature measurement showed average $38.78{\pm}0.22^{\circ}C$ to $38.54{\pm}0.15^{\circ}C$ when the normal recovery method was performed. Cooling recovery method on one foot showed average $38.69{\pm}0.14^{\circ}C$ to average $38.06{\pm}0.17^{\circ}C$ and Cooling recovery method on both feet showed average $38.69{\pm}0.15^{\circ}C$ to average $37.84{\pm}0.21^{\circ}C$. There was a significant difference between the normal recovery method and the one foot cooling recovery method(p < .05), there was a significant difference between the normal recovery method and the both feet cooling recovery method(p < .05) and there was a significant difference between the one foot cooling recovery method and the both feet cooling recovery method(p < .05). Body temperature showed the lowest decrease rate when the normal recovery method was performed, and body temperature showed the highest decrease rate when the both feet cooling recovery method was performed. Therefore, recovery of cooling on the foot after hard exercise have decreased body temperature, delay fatigue in the body, and will be contributed to improvement of athlete performance.