• Korean Journal of Materials Research
• /
• v.17 no.10
• /
• pp.509-515
• /
• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• Proceedings of the Korean Fiber Society Conference
• /
• 1995.10a
• /
• pp.55-56
• /
• 1995

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.08a
• /
• pp.138.3-138
• /
• 1998

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.5
• /
• pp.474-481
• /
• 2009

Fracture models and criteria of adhesive with two parameters, namely $G_C$ and ${\sigma}_{max}$, have been developed to describe the fracture process of adhesive joints. Cohesive zone model(CZM) is a representative two parameter failure criteria approach. In CZM, ${\sigma}_{max}$ is a critical, limiting maximum value of the stress in the damage zone ahead of the crack and is assumed to have some physical significance in adhesive failure. Based on CZM and finite element analysis method, the relationship between fracture load and adhesive properties, as $G_{IC)$ and $({\sigma}_{max})_I$, was investigated in adhesively bonded joint tensile test and T-peel test. The two parameters in tensile mode loading were evaluated by using the relationship. The value of $G_{\IC}$ evaluated by proposed method showed close agreement with analytical solution for tapered double cantilever beam(TDCB) test which proposed in an ASTM standard.

• The Journal of Korean Academy of Prosthodontics
• /
• v.30 no.3
• /
• pp.411-436
• /
• 1992

The purpose of this study was to assess the adhesion of resilient denture liners (such as, heat-cured silicone molloplast B,cold- cured silicone Mollosil) to polymethyl metacrylate (K-33) and metal (Megalloy) in the laboratory by peel test. The resilient denture lines were processed according to manufactures instruction, onto prepared specimens(original resin base plate, rough resin base plate, stippled metal plate, mesh metal plate ) 75mm long and 25m wide. And then, the peel test was performed by instron. The results were as follows : 1. The bonding strength of Mollosil was stronger than that of Molloplast B except the specimen of stippled metal plate. 2. The tensile strength of Mollosil was weaker than that of Molloplast Bas tearing of Mollosil was occured in the peel test. 3. Mesh metal plate had the highest bonding strength in the case of Molloplast B and Mollosil. But stippled metal plate have high bonding strength in the case of Molloplast B and have the lowest bonding strength in the case of Mollosil. 4. The bonding strength of rough resin base plate was stronger than that of original resin base plate in the case of Molloplast B and Mollosil. 5. The bonding strength of metal plates was stronger than that of resin base plates in the case of Molloplast B and Mollosil except the case of bonding strength between the stippled metal plate and Mollosil. 6. It seems that the Increase of surface and retention form of metal plate and resin base plate produces higher physical bonding strength.

• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
• /
• 2001.06a
• /
• pp.1021-1021
• /
• 2001

Sample presentation, which means how to set samples to an NIR instrument, is very important in Near Infrared (NIR) Spectroscopy. When sample presentation is not suitable for the samples that you use, very good spectra can not be obtained even if you use a sophisticated NIR instrument. In my presentation, various NIR sample presentations for agricultural products such as intact fruits, single grains, vegetable juice and the others will be explained. In case of peaches with thin peel, the fiber optics of Interactance can be used. However, the fiber optics are not suitable for oranges with relatively thick peel. In this case, transmittance method is useful. As for a small sample such as single grains, a specially designed cell is needed. The cell in transmittance mode has been developed and then applied to single kernels of rice and soybean. In this case we also used the fiber optics. As regards liquid type of sample, a cuvette cell made of quartz in transmittance mode is popular. However, it is time-consuming to wash and dry it. In order to compensate this disadvantage the sample presentation using normal test tubes as sample cells have been developed and applied to milk, rumen juice and urine of a milking cow. An individual test tube can be used for each sample if you use the calibration equation with sample cell compensation. The test tube cell has also been applied to spinach juice for determination of undesirable constituents. It is concluded that sample presentation is most important for NIR Spectroscopy.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.75-81
• /
• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Current Photovoltaic Research
• /
• v.4 no.2
• /
• pp.59-63
• /
• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• Journal of the Korean Applied Science and Technology
• /
• v.17 no.4
• /
• pp.262-266
• /
• 2000

Acrylic pressure sensitive adhesives of n-butyl acrylate, 2-ethyl acrylate, methyl acrylate, vinyl acetate, acrylic acid, acrylonitrile and 2-hydroxyethyl acrylate were synthesized and basic physical properties of pressure sensitive adhesives with increasing the contents of 2-hydroxyethyl acrylate were investigated. 2-Hydroxyethyl acrylates effects on glass transition temperature, viscosity, hardening time and peel strength. Glass transition temperature(Tg) decreased with increasing the contents of 2-hydroxyethyl acrylate. Viscosity and hardening time were increased with increasing the contents of 2-hydroxyethyl acrylate. On the other hands, peel strength increased with increasing the contents of 2-hydroxyethyl acrylate up to 6 wt% and the decreased at further higher contents of 2-hydroxyethyl acrylate. In peel test, interfacial failure was occured in 8 wt% and 10wt%.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.2
• /
• pp.41-48
• /
• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.