• Polymer(Korea)
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• v.36 no.2
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• pp.119-123
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• 2012

Adhesion strength of polyurethane adhesive for laminated metal plate was investigated. Also, the effect of laminating conditions on the adhesion strength was understood by measuring peel strength as a function of adhesion temperature and time. The amount of isocyanate appearing due to the unblocking of oxime in polyurethane adhesive affected the strength of adhesion with hydroxyl on the metal plate or aluminum foil and it was controlled by adhesion temperature and time. However, the excess of temperature and time in laminating process caused the lowering of adhesion strength because of the decrease of solvent content as well as thermal degradation of the adhesive.

• Proceedings of the Korean Society of Rheology Conference
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• 2001.06a
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• pp.77-80
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• 2001

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.520-525
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• 2014

In this paper, the effect of silane-treated silicas and epoxidized soybean oil (ESBO) addition on adhesion properties of silicas-filled epoxy adhesives was examined. The silicas were treated by ${\gamma}$-methacryloxy propyltrimethoxy silane (MPS), ${\gamma}$-glycidoxy propyl trimethoxy silane (GPS), and ${\gamma}$-mercapto propyl trimethoxy silane (MCPS). Surface and structural properties of the adhesives were determined by using scanning electron microscope (SEM) and Fourier transform infrared spectroscopy (FT-IR). The t-peel strength of the adhesives was estimated using the universal testing machine (UTM). And, the equilibrium spreading pressure, surface free energy, and specific surface area were investigated by BET methods with $N_2$/77 K adsorption. As a result, the peel strength of the adhesives was increased in the presence of silane-treated silicas in the adhesives compared to that of untreated silicas. This result indicated that the silane coupling agent played an important role in improving the dispersion of silicas in epoxy adhesives. And, the adhesives treated by MCPS were superior to the others in adhesion.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.155-161
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• 2010

A series of ethylene vinyl acetate (EVA) based hot melt adhesives containing different types and compositions of tackifier resins were prepared to investigate their rheological behavior and T-peel adhesion strength on polyurethane (PU) elastomeric sheets. C5 aliphatic hydrocarbon resin (C5 resin), C9 aromatic hydrocarbon resin (C9 resin), hydrogenated dicyclopentadiene resin ($H_2$-DCPD resin), and dicyclopentadiene and acrylic monomer copolymer resin (DCPD-acrylic resin) were used as the tackifiers for the hot melt adhesives. To determine the polarity of the tackifiers, their oxygen contents were analyzed, and the DCPDacrylic resin was found to contain an oxygen content higher than the other tackifiers. Only the DCPD-acrylic resin showed complete miscibility with EVA and the homogeneous phase of the hot melt adhesive blends at all compositions. The T-peel adhesion strength between the hot melt adhesives and polyurethane elastomeric sheets was mainly affected by the polarity of the tackifier resins in the hot melt adhesives, rather than by the storage moduli, G', of the hot melt adhesives themselves.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Elastomers and Composites
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• v.35 no.4
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• pp.296-302
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• 2000

The surfaces of injection and pressure-molded sheets of poly(ethylene-covulylacetate)(EVA) foams used for shoe mid-sole were treated with low temperature plasma to improve adhesion with a water-based polyurethane adhesives. Several experimental variables were considered, such as radio frequency power, treating time, type of gas. gas flow, and distance between electrode and sample. The modificated surface by plasma treatment were characterized using contact angle meter, scanning electron microscopy(SEM), universal testing machine(UTM). Adhesion was tested by T-peel tests of treated EVA foams/polyurethane adhesive joints. The treatment in the low temperature plasma produced a noticeable decrease in contact angle. The peel strength of EVA foams treated with plasma was increased with plasma treating time, and gas flow.

• Journal of the Korean Applied Science and Technology
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• v.17 no.4
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• pp.262-266
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• 2000

Acrylic pressure sensitive adhesives of n-butyl acrylate, 2-ethyl acrylate, methyl acrylate, vinyl acetate, acrylic acid, acrylonitrile and 2-hydroxyethyl acrylate were synthesized and basic physical properties of pressure sensitive adhesives with increasing the contents of 2-hydroxyethyl acrylate were investigated. 2-Hydroxyethyl acrylates effects on glass transition temperature, viscosity, hardening time and peel strength. Glass transition temperature(Tg) decreased with increasing the contents of 2-hydroxyethyl acrylate. Viscosity and hardening time were increased with increasing the contents of 2-hydroxyethyl acrylate. On the other hands, peel strength increased with increasing the contents of 2-hydroxyethyl acrylate up to 6 wt% and the decreased at further higher contents of 2-hydroxyethyl acrylate. In peel test, interfacial failure was occured in 8 wt% and 10wt%.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.49 no.1
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• pp.67-74
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• 2023

In this study, for a natural cosmetics market, we sought to explore alternatives that can replace polyvinyl alcohol (PVA) of peel-off packs. A peel-off type pack was prepared by combining pullulan, a water-soluble polysaccharide, and other polysaccharides (sodium hyaluronate, cellulose gum, hydroxyethyl cellulose, sodium alginate, corn starch), and the pH, viscosity, and stability against temperature of each peel-off type pack were confirmed. The thickness and tensile strength of the manufactured film were measured for comparison with the PVA peel-off type pack, and applicability, drying speed, and removal degree were measured. Among them, the pullulan-sodium hyaluronate peel-off type pack showed excellent film formation ability to replace the peel-off type pack containing PVA with 5.12% thin film thickness and 4.23% high film tensile strength. When applied to actual skin, the degree of spread of the pack, the usability that can be uniformly applied, and the formation and removal strength of the film when removed after drying were also similar to the peel-off type pack containing PVA. Therefore, it was confirmed that the film formed of pullulan-sodium hyaluronate showed enough physical properties to replace the PVA of the peel-off type pack as a natural peel-off type pack.

• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1176-1180
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• 1999

The adhesion strength and high temperature/high humidity reliability of polyetherimide (PEI) adhesive on silicon wafer after being treated by each reactive ion etching (RIE) Aluminum (Al)-chelate adhesion promoter were investigated. 180$^{\circ}$ peel test and <85$^{\circ}C$ 85%> humidity test were performed for the initial adhesion strength and high temperature/high humidity reliability, respectively. For investigating surface effect scanning electron microscope (SEM), atomic force microscope (AFM), deionized (DI)-water contact angle studies were carried out. To investigate RIE effect, PEI was treated with $^O_2$ RIE, and then laminated. The initial peel strength increased slightly from 1.6 kg/cm for the first 2 minutes, and then decreased. High temp/high humid resistance decreased rapidly by RIE etching. RIE treatment on PEI affected on both of roughness and hydrophilicity increase. Aluminum-chelate adhesion promoter was coated by spinning on silicon wafer. The initial peel strength showed no effect of adhesion promoter treatment, but high temp/high humidity resistance increased remarkably. Al-chelate adhesion promoter did not affect the roughness but increased hydrophilicity.