• 한국수소및신에너지학회논문집
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• 제5권2호
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• pp.59-63
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• 1994

Thermally evaporated Pd films on substrate were hydrogenated upto 1 bar of hydrogen gas at room temperature. Thickness dependence on hydrogenation on Pd film is examined in the thickness range between $60{\AA}$ and $800{\AA}$. Hydrogenation kinetics of thinner films(thinner than $500{\AA}$) and that of thicker films are different. Thin film(thickness < $200{\AA}$, substrate temp. = RT) showed recrystallization due to hydrogen induced heat. Hydrogen was absorbed by chemisorption process in ${\alpha}$ phase of thinner films, and diffusion process in ${\alpha}'$ phase of thicker films respectively.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권1호
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• pp.1-4
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• 2004

This paper presents an investigation of the phase-resolved partial discharge (PD) pattern of PET (Poly Ethylene Telephthalate) films with carbon black particles. The phase-resolved PD pattern and statistical parameter from PET samples according to the number of included semiconductor particles were measured. The measurement system consisted of a conventional PD detector using a digital signal processing technique. The partial discharge patterns of the PET films that include the semiconductor particles were investigated to simulate an actual situation that may exist in the cable. In addition, difference of PD patterns between semiconducting particles in PET films and artificial voids was studied. The relationship between the numbers of semiconductor particles in PET films was discussed through the difference of Ψ-q-n distribution and statistical analysis.

• Journal of Electrical Engineering and Technology
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• 제10권5호
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• pp.2089-2098
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• 2015

With the continuous development in insulation of electrical equipment design, the reliability of the system has been enhanced. However, in the manufacturing process and during operation under continues stresses introduce local defects, such as voids between interfaces that can responsible to occurrence of partial discharge (PD), electric field distortion and accumulation of charges. These defects may lead to localize corrosion and material degradation of insulation system, and a serious threat to the equipment. A model of three layers of PI film with air gap is presented to understand the influence of interface and voids on exploitation conditions such as strong electrical field, PD activity and charge movement. The analytical analysis, and experimental results are good agreement and show that the lose contact between interfaces accumulate more residual charges and in consequences increase the electric field intensity and accelerates internal discharges. These residual charges are trapped charges, injected by the electrodes has often same polarity, so the electric field in cavities increases significantly and thus partial discharge inception voltage (PDIV) decreases. Contrary, number of PD discharge quantity increases due to interface. Interfacial polarization effect has opposite impact on electric field and PDIV as compare to void.

• The Korean Journal of Ceramics
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• 제5권2호
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• pp.125-130
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• 1999

After $SnO_2$ fine powder by precipitation method, Ca as crystallization inhibitor and Pd as catalyst were added to $SnO_2$ raw material by various methods. Thick film device was fabricated on the alumina substrate by mixing ethylene glycol and such mixed powders. The sensing characteristics of the device for methane gas were investigated. The most excellent gas sensing property was shown by the thick film device fabricated by Method 3 in which Ca and Pd doped $SnO_2$ powder is prepared by mixing $SnO_2$ powder, 0.1 wt% Ca acetate and 1 wt% $PdCl_2$ in deionized water and by calcining the mixture, after $Sn(OH)_4$ is dried at $110^{\circ}C$ for 36h. The sensitivity of the sensor fabricated with $SnO_2$-0.1 wt%Ca acetate-1wt%$PdCl_2$ powder heat-treated at $700^{\circ}C$ for 1h was about 86% for 5,000 ppm methane in air at $350^{\circ}C$ of the operating temperature. Response time and recovery were also excellent.

• 전기화학회지
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• 제5권2호
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• pp.68-73
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• 2002

상용 고분자 전해질인 Nafion 115 및 Nafion 117막 위에 do magnetron sputtering방법으로 Pd박막을 다양한 두께로 증착한 다음, 개질된 고분자 전해질 막의 morphology, proton 전도도(conductivity), 메탄을 투과도(permeability)를 측정하였으며, membrane and electrode assemblies(MEA)를 구성하여 DMFC 단위전지 성능을 측정하였다. Pd 박막은 Nafion막이 지니고 있는 단점인 메탄을 crossover에 대한 barrier로서 작용하였지만, 동시에 Nafion막의 고유 특성인 proton전도도의 감소를 가져왔다. Pd박막에 의하여 개질된 Nafion막의 메탄올에 대한 투과도와 proton전도도는 Nafion 막 상에 증착된 Pd 박막의 두께가 증가할수록 직선적으로 감소하는 경향을 나타냈다 개질된 Nafon 막을 사용하여 제작한 direct methanol fuel cell(DMFC)단위전지의 성능은 전체적으로 약간 저하되었다.

• 분석과학
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• 제6권2호
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• pp.217-223
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• 1993

저항가열식 진공중착기를 이용하여 실온(ambient temp.)과 $250^{\circ}C$에서 알루미나 기판 위에 Au/Cr, Au/Ni/Cr 및 Au/Pd/Cr 박막을 제조하였으며, 공기 중에서 $300^{\circ}C$, $450^{\circ}C$, $600^{\circ}C$의 온도로 각각 1시간 동안 열처리하였다. Au, Ni(또는 Pd) 및 Cr 박막의 두께는 각각 $1000{\AA}$, $300{\AA}$, 및 $50{\AA}$이었다. 박막 제조시 기판의 온도와 박막 제조 후 열처리 온도는 각 층의 상호확산으로 인하여 박막의 면저항값에 영향을 주었다. Auger depth profile 분석결과, Au/Cr 시스템에서는 기판의 온도는 $250^{\circ}C$로 하여 박막을 제조할 때 이미 Cr은 Au 표면으로 확산되었으며, 열처리 후에는 Au의 분포도만 변화하였다. Au/Ni/Cr과 Au/Pd/Cr 시스템의 경우 Ni와 Pd 모두 확산현상이 발견되었으며, 특히 Ni(약 45 at.%)는 Au 박막 표면으로 확산되어 산화되었다.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 학술대회 논문집
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• pp.143-145
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• 2003

External shunt resistor is used in Nb/AlOx/Nb Josephson junction which is basic component of RSFQ circuit. This is to increase damping and to make the so called 'self-reset' optimized for high speed operation. In this study, we fabricated and investigated sheet resistance of Pd and PdAu thin film, and simulated the inductance effect of the shunt resistor to the Josepshon junction dynamics.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2005년도 하계학술연구발표회 논문개요집
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• pp.170-171
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• 2005

• 대한금속재료학회지
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• 제47권6호
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• pp.372-377
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• 2009

We report on hysteresis behavior in the electrical resistance-hydrogen concentration of Pd thin films. The variation of the electrical resistance has been investigated during the process of absorption and desorption of hydrogen gas ($H_{2}$) as a function of thickness of Pd thin films. The hysteresis behavior in the electrical resistance with $H_{2}$ concentration was found for Pd thin films and consists of $\alpha$ phase, ${\alpha}+{\beta}$ phase, and $\beta$ phase regions. The sensitivity of Pd thin films with $H_{2}$ concentration was found to follow Sieverts' law in the $\alpha$ phase region. However, the sensitivity was observed to increase abruptly with $H_{2}$ concentration in the ${\alpha}+{\beta}$ phase co-exist region. This is because Pd-H interaction is stronger in the $\beta$ phase than in the $\alpha$ phase and needs a higher concentration gradient as a driving force to desorb. The formation of the $\beta$ phase also was observed to cause the structural change because of the lattice expansion during absorption. The hysteresis height and the trace of structural change were affected by the thickness of the Pd film. As the film becomes thinner, the hysteresis height becomes lower and the amount of delamination on the surface becomes smaller. For films thinner than 20 nm in thickness, the delamination was not found but electrical resistance hysteresis was still observed.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.