• Journal of Microbiology
• /
• v.34 no.2
• /
• pp.144-150
• /
• 1996

During growth of the genetically engineered E. coli CU103 in different media, extracellular DNAs released from the cells were studied. The extracellular DNAs released in the medium were concentrated by an thanol precipitation method and then quantified by a fluorescence method using Hoechst 33258. The released extracellular DNAs were also examined by gel electrophoresis and identified by Southern hybridization for the cloned pcbCD genes. The chromosomal DNAs and recombinant plasmid containing the cloned genes were observed to be released in an exponential growth phase. In Luria-Bertani (LB) broth and MM2-GLUCOSE, 210 and 69 ng/ml of DNAs were detected, respectively, after 3-4 days incubation at $30^{\circ}C$ and at pH 7.0. But the released DNAs were measured to be about 10-15 ng/ml in filtered river water (FW) and Tris-EDTA (TE). The at both $15^{\circ}C$ and $4^{\circ}C$, but the released DNAs were more easily degraded at the higher temperature. The extracellular DNAs were produced about 2 times more at pH 7.0 than at both pH 5.0 and pH 9.0 in MM2-glucose medium at $30^{\circ}C$. Therefore, the extracellular DNAs were found to be released actively from the cells during growth in liquid media.

• Proceedings of the IEEK Conference
• /
• 2001.10a
• /
• pp.165-170
• /
• 2001

The main purpose of this study is to generate a fine copper oxide powder of high purity, with a compact structure and a uniform particle size by a spray pyrolysis process. The raw material is a waste copper chloride solution formed in the manufacturing process of Print Circuit Board (PCB). This study also examines the influences of various factors on the properties of the generated powder. These factors include the reaction temperature, the inflow speed of the raw material solution, the inflow speed of the air, the size of the nozzle tip, and the concentration of the raw material solution. It is discovered that, as the reaction temperature increases from 80$0^{\circ}C$ to 100$0^{\circ}C$ , the particle size of the generated powder increases accordingly, and that the structure of the powder becomes much more compact. When the reaction temperature is 100$0^{\circ}C$, the particle size of the generated powder increases as the concentration of copper in the raw material solution increases to 40g/l, decreases as the concentration increases up to 120g/l, and increases again as the concentration reaches 200g/1. In the case of a lower concentration of the raw material solution, the generated powder appears largely in the form of CuO. As the concentration increases, however, the powder appears largely in the form of CuCl. When the concentration of copper in the raw material solution is 120g/1, the particle size of the generated powder increases as the inflow speed of the raw material solution increases. When the concentration of copper in the raw material solution is 120g/1, there is no evident change in the particle size of the generated powder as the size of the nozzle tip and the air pressure increases. When the concentration is 40g/1, however, the particle size keeps increasing until the air pressure increases to 0.5kg/$\textrm{cm}^2$, but decreases remarkably as the air pressure exceeds 0.5kg/$\textrm{cm}^2$.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.9 no.4
• /
• pp.871-876
• /
• 2005

Theme park automation system is developed by using the RFID sensor reader, IIS web server, ASP.NET and MSSQL database in this paper. Its operation is that park entrance people checked automatically when he who possessed the ta8 passed the reader acquisition bound and its tag information is sent to the host computer through the RS-232 data acquisition system. Tag information and time data will be stored in the RFID database tables and reused to extract and distribute the entrance people for the purpose of each arrangement of each entertainment devices. First of all, we developed interface program between host and reader and then, programmed the related web site and database connection function using ASP.NET with $C\#$ and MSSQ. We also design and make an production of external Ant. to extend the acquisition range up to $30\~40$ cm using copper PCB plate. We confirmed the performance through the RFID test bed site.

• Proceedings of the KWS Conference
• /
• 2005.11a
• /
• pp.228-230
• /
• 2005

Sn-8wt%Zn-3wt%Bi (이하, Sn-8Zn-3Bi) 솔더의 장기 신뢰성을 평가하기 위하여 고용고습시험을 행하였다. 고온 고습 시험은 $85^{\circ}C$/85RH 조건에서 1000 시간 동안 하였다. 접합 기판으로는 각각 OSP (Organic Solderability Preservative), Sn 그리고 Ni/Au 처리를 한 PCB(Printed Circuit Board) 패드를 사용하였다. 접합에 사용한 부품은 1608Chip 으로 MLCC(Multi Layer Ceramic Capacitor 이하, 1608C) 와 Chip Resister(이하, 1608R)을 사용하였으며, 이 두 부품의 전극부위에 Sn-10wt%Pb(이하 Sn-l0PB), Sn을 각각 도금하였다. 솔더링 후 1608C 와 1608R의 전단 접합 강도와 솔더링부에서 Zn상의 변화를 관찰하였다. 측정결과, Sn-8Zn-3Bi 솔더의 초기 전단 접합 강도는 기판의 표면처리에 상관없이 약 40N 이었다. 그러나 고온 고습 시험 1000 시간 후에는 기판의 표면처리에 상관없이 약 30N 까지 감소하였다. 하지만 이는 reference인 Sn-37Pb 솔더의 강도값과 거의 유사하며, 이는 Sn-8Bi-3Zn 솔더의 고온 고습 시험 후 전단강도 특성은 기존 유연솔더와 비교하여 동등이상이라고 평가할 수 있다.

• Journal of Environmental Science International
• /
• v.20 no.11
• /
• pp.1499-1507
• /
• 2011

Practical disposal of transformer insulation oil laden with PCBs (polychlorinated biphenyls) by a chemical treatment has been studied in field work. The transformer insulation oil containing PCBs was treated by the required amounts of PEG (polyethylene glycol) and KOH, along with different reaction conditions such as temperatures and times. The reaction of PEG with PCBs under basic condition produces arylpolyglycols, the products of nucleophilic aromatic substitution. Removal efficiencies of PCBs in insulation oil before and after chemical treatment were examined. The removal efficiency of PCBs was very low at lower temperatures of 25 and $50^{\circ}C$. Under the reaction condition of PEG 600/KOH/$100^{\circ}C$/2hr, removal efficiency of PCBs was approximately 70%, showing completely removal of PCBs containing 7~9 chlorines on biphenyl frame which appear later than PCB IUPAC Number 183 (2,2',3,4,4',5',6-heptaCB) in retention time of GC/ECD. However, when increasing the reaction temperature and time to $150^{\circ}C$ and 4 hours, removal efficiency of PCBs reached 99.99% without any formation of PCDDS/PCDFs during the process. Such reaction conditions were verified by several official analytical institutions. In studying the reaction of PEG with PCBs, it confirmed that the process of chemical treatment led to less chlorinated PCBs through a stepwise process with the successive elimination of chlorines.

• Journal of the Korean Society of Safety
• /
• v.28 no.2
• /
• pp.21-25
• /
• 2013

The purpose of this study is to provide basic data for the safety assessment of a water purifier when water leaks due to inappropriate maintenance and the examination of the cause of accidents related to the leak. Due to its inspection and management by non-specialists, if a leak occurs in a water purifier with the water level controller being inclined, it may result in the failure of the compressor, power supply line, PCB, etc. The analysis of the thermal diffusion pattern of water purifier compressors using a thermal image camera shows that its maximum temperature was approximately $80^{\circ}C$. In addition, its operating current was a maximum of 13 A and the system's operating current was approximately 1.7 A after the compressor was charged. It was found that the housing type power cable cover of the compressor had the effect of preventing electric shock but has poor flame resistance. Furthermore, the performance of the overload protector, PTC relays, etc., was excellent but they have potential for problems as metallic terminals were exposed, resulting in the potential of a safety related accident. The terminals and their surface damaged by the tracking showed a trace of carbonization and the resistance between terminals was measured to be approximately $8{\Omega}$. In addition, while the tracking was proceeding, the fuse and circuit breaker installed for system protection did not operate.

• Journal of electromagnetic engineering and science
• /
• v.10 no.3
• /
• pp.179-182
• /
• 2010

This paper proposed a novel compact bandpass filter with folded half mode substrate integrated waveguide (FHMSIW) cavities using two-layer printed circuit board(PCB) process. The area of the FHMSIW filter is reduced by nearly 50 % and 75 % compared with half mode substrate integrated waveguide(HMSIW) filter and substrate integrated waveguide(SIW) filter, respectively. A four-pole Chebyshev FHMSIW bandpass filter at C-band has been designed, simulated and fabricated. Measured results are presented and found to agree with the full-wave simulated results by using Ansoft HFSS. The filter shows good performance and compact size.

• Proceedings of the KIEE Conference
• /
• 2009.07a
• /
• pp.1929_1930
• /
• 2009

Fully embedded tunable bandpass filter (BPF) with inductive coupling circuits is newly designed and demonstrated for UHF TV tuner ranged from 500MHz to 900MHz receivers. Conventional RF tuning circuit with an electromagnetic coupled tunable filter has several problems such as large size, high volume, and high cost, since the electromagnetic coupled filter is comprised of several passive components and air core inductors to be assembled and controlled manually. To address these obstacles, compact tunable filter with inductive coupling circuit was embedded into low cost organic package substrate. The embedded filter was optimally designed to have high performance by using high Q spiral stacked inductors, high dielectric $BaTiO_3$ composite MIM capacitors, varactor diodes. It exhibited low insertion loss of approximately -2dB, high return loss of below -10dB, and large tuning range of 56.3%. It has an extremely compact size of $3.4{\times}4.4{\times}0.5mm^3$.

• Journal of Environmental Health Sciences
• /
• v.29 no.4
• /
• pp.10-16
• /
• 2003

Atmospheric samples were conducted from September 2001 to July 2002 with GPS-l PUF sampler in rural site to concentration distributions of gas/particle PCBs and to calculate dry deposition flux of PCBs. $\Sigma$PCBs concentrations of gas/particle PCBs were 59.29$\pm$48.83, 6.56$\pm$6.59 pg/㎥, respectively. Gas contribution (%) of total PCBs (gas + particle) was 90% which existed gas phase in the atmosphere. The particle contribution (%) of PCB congeners increased relatively more of the less volatile congeners with the highest chlorine number. The correlation coefficients (r) between total PCBs and temperature ($^{\circ}C$) showed negative correlation in - 0.62 (p<0.0l) for particle phase, positive correlation in 0.63 (p<0.01) for gas phase. In other word, particle phase PCBs is enriched in colder weather which could be due to greater in corporation of condensed gas phase at low temperature. The calculated dry deposition of total PCBs (gas + particle) was 0.008, 0.008 $\mu\textrm{g}$ $m^{-2}$ da $y^{-l}$ which showed maximum dry deposition flux in December, minimum data in July Bs in the atmosphere. The calculated dry deposition fluxes of total PCBs were influenced by particle phase PCBs even though PCBs in the atmosphere were present primarily in the gas phase.e.

• KIEAE Journal
• /
• v.14 no.6
• /
• pp.81-86
• /
• 2014

In recent years, many researchers have considered the building energy consumption reduction accordingly to deal with abnormal climate changes and greenhouse gas reduction. However, the lighting energy use ratio has increased in spite of the development of the high efficiency lighting device. Therefore, the study aims to produce the LED lighting applications for the effective lighting heat removal by using the heat characteristics of LED lighting and analyzing the heat removal effect. In order to increase radiant heat efficiency, the heat pipe and heat sink was attached on PCB as LED lighting applications. Experiment was conducted to verify the temperature and air velocity of inside duct: thermocouples, anemometer. The heat removal effect of LED lighting applications was measured by observing the temperature of the lighting applications and the change of air velocity in duct. The experiment shows that the temperature change in the duct according to air velocity was $0.9{\sim}5.8^{\circ}C$. It is also concluded that heat removal was calculated from 33 to 81W.