• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.217-218
• /
• 2007

Aluminum 분말과 고분자를 혼합하여 고분자-금속 복합재료(polymer-metal composite)를 만들어 copper foil과 기판의 접착력을 평가하였다. Tape casting 방법을 이용하여 sheet 만들고 vacuum lamination으로 PCB(Printed Circuit Board)기판을 제조한 후 포토공정으로 peel strength pattern을 형성하였으며, 본 연구에서는 최적의 aluminum 조건을 찾기 위하여 압력, 온도, copper foil의 표면 상태와 silane 표면 코팅에 따른 aluminum-polymer복합재료의 peel strength의 변화를 확인하였다. 최적의 조건은 silane 표면 코팅 처리를 한 aluminum 분말로 $210^{\circ}C$에서 $9.7kg/cm^2$ 압력으로 matte면의 돌기 크기가 크며, 응집이 잘 되어있는 copper foil을 사용하여 13.89N의 우수한 peel strength를 구현 할 수 있었다.

• Journal of Life Science
• /
• v.21 no.12
• /
• pp.1666-1677
• /
• 2011

The regulation of gene expression plays an important role in cell cycle controls. In this study, a novel gene, the $mas1^+$($\underline{mi}$tosis $\underline{as}$sociated protein) gene, a homolog of human CIP29/Hcc1, was isolated and characterized from fission yeast Schizosaccharomyces pombe (S. pombe) using a gene-specific polymerase chain reaction. The isolated gene contained a complete open reading frame capable of encoding 245 amino acid residues with a typical promoter, as judged by nucleotide sequence analysis. It was also found that a PCB ($\underline{p}$ombe cell $\underline{c}$ycle $\underline{b}$ox) is located in the promoter region, which controls M-$G_1$ specific transcription in S. pombe. The quantitative analysis of the $mas1^+$ transcript against $adh1^+$ showed that the pattern of expression is similar to that of the septation index. Cytokinesis of mas1 mutant was greatly delayed at $25^{\circ}C$ and $36^{\circ}C$, and a large number of multi-septate cells were produced. The mas1 mutant had 2C, 4C and 6C DNA contents, as determined by FACS analysis. In addition, the number of multi-septate cells significantly increased. When cells were cultured in nitrogen starvation medium to increase proliferation, the abnormal phenotypes of mas1 mutant dramatically increased. These phenotypes could be rescued by an overexpression of the $mas1^+$ gene. The mas1 protein localized in the nuclei of S. pombe and human HeLa cells, as evidenced by Mas1-EGFP signals. The abnormal growth pattern and the morphology of mas1 mutant were complemented by a plasmid carrying human CIP29/Hcc-1cDNA. In addition, CIP29 /Hcc-1 transcript level increased in active cell proliferation stages in the developing mouse embryos. These results indicate that the $mas1^+$ ishomologous to the human CIP29/Hcc1 gene and is involved in cytokinesis and cell shape control.

• Bulletin of the Korean Chemical Society
• /
• v.31 no.5
• /
• pp.1252-1256
• /
• 2010

A polyvinylpyrrolidone (PVP)/Ag nanocomposites was prepared by the simultaneous thermal reduction and radical polymerization route. The in situ synthesis of the Ag/PVP nanocomposites is based on the finding that the silver n-propylcarbamate (Ag-PCB) complex can be directly dissolved in the NVP monomer, and decomposed by only heat treatment in the range of 110 to $130^{\circ}C$ to form silver metal. Silver nanoparticles with a narrow size distribution (5 - 40 nm) were obtained, which were well dispersed in the PVP matrix. A successful synthesis of Ag/PVP nanocomposites then proceeded upon heat treatment as low as $110^{\circ}C$. Moreover, important advantages of the in situ synthesis of Ag/PVP composites include that no additives (e.g. solvent, surface-active agent, or reductant of metallic ions) are used, and that the stable silver nanocolloid solution can be directly prepared in high concentration simply by dissolving the Ag/PVP nanocomposites in water or organic solvent.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.273-274
• /
• 2009

현재 가로등의 93.3[%]를 차지하고 있는 나트륨램프는 색상이 적황색이며, 시력에 장애와 피로감을 주어 인체에 해로우므로 고효율 램프로 교체되고 있으며 백열전구는 전력을 많이 소모하고 잦은 고장으로 빈번한 대체와 유지보수를 필요로 하므로 LED를 선택하면, 유지보수 비용과 안전성, 에너지 효율성면에서 큰 강점을 갖는다. 본 연구에서는 에너지 효율이 높은 LED 가로등 제작을 위한 모듈을 제작하여, 열적, 광학적 분석을 하였다. 동작 150분 후, LED Module의 PCB기판 6 Point에서 Thermal Grease와 Thermal Pad의 처리에 의한 열적 변화를 측정하였으며, Thermal Grease 처리는 Thermal Pad 보다 평균 3 $[^{\circ}C]$ 정도 낮은 35 $[^{\circ}C]$결과를 얻었으며, 제작된 LED Module의 광학적평가의 결과는 10 [m] 높이에서 $20\times20\;[m^2]$ 면적에 조사된 조도의 최대,최소값은 10.9~0.6 [lx]이고, 주로 10~5 [lx] 값이 조도의 면적을 차지하였으며, 곡선은 옆으로 넓게 펼쳐진 곡선을 나타내었다.

• Journal of Applied Reliability
• /
• v.16 no.4
• /
• pp.331-337
• /
• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• Journal of Environmental Science International
• /
• v.18 no.9
• /
• pp.953-959
• /
• 2009

A practical and efficient disposal method for chemical dechlorination of PCBs (polychlorinated biphenyls) in transformer oil was evaluated. The transformer oil containing PCBs was treated by the PEG 600 (polyethylene glycol 600) and potassium hydroxide (KOH) along with different reaction temperatures(25, 50, 100 and $150^{\circ}C$) and times(30, 60, 240 and 480 min). The best disposal efficiency of PCBs in transformer oil was attained under the experimental conditions of PEG 600 (2.5 w/w%)/KOH (2.5 w/w%)/$150^{\circ}C$/4 hrs, showing completely removal of all PCBs containing 3-9 chlorines on two rings of biphenyl. In studying the reaction of PEG/KOH with PCBs, it confirmed that the process led to less chlorinated PCBs through a stepwise process with the successive elimination of chlorines.

• Journal of Environmental Science International
• /
• v.14 no.10
• /
• pp.919-928
• /
• 2005

This study introduces the development of new supercritical water oxidation(SCW)(multiple step oxidation) to destruct recalcitrant organic substances totally and safely by using sodium nitrate as an oxidant. This method has solved the problems of conventional SCW, such as precipitation of salt due to lowered permittivity, pressure increase following rapid rise of reaction temperature, and corrosion of reactor due to the generation of strong acid. Destruction condition and rate in the supercritical water were examined using Polyvinyl Chloride(PVC) and ion exchange resins as organic substances. The experiment was carried out at $450^{\circ}C$ for 30min, which is relatively lower than the temperature for supercritical water oxidation $(600-650^{\circ}C)$. The decomposition rates of various incombustible organic substances were very high [PVC$(87.5\%)$, Anion exchange resin$(98.6\%)$, Cationexchange resin$(98.0\%)$]. It was observed that hetero atoms existed in organic compounds and chlorine was neutralized by sodium (salt formation). However, relatively large amount of sodium nitrate (4 equivalent) was required to raise the decomposition ratio. For complete oxidation of PCB was intended, the amount of oxidizer was an important parameter.

• Proceedings of the Korean Environmental Sciences Society Conference
• /
• 2005.05a
• /
• pp.267-271
• /
• 2005

This experiment was carried out at 450"C, which is relatively lower than the temperature for supercritical water oxidation (600-650$^{\circ}C$). In this experiment, the decomposition rates of various incombustible organic substances were very high. In addition, it was confirmed that hetero atoms existed in organic compounds and chlorine was neutralized by sodium(salt formation).However, to raise the decomposition rate, relatively large amount of sodium nitrate(3-4 times the equivalent weight) was required. When complete oxidation is intended as in the case with PCB, the amount of oxidizer and decomposition cost is important. But when vaporization reduction is required as in the case with nuclear wastes, the amount of radioactive wastes increases instead. But as can be seen in the result of XRD measurement, unreacted sodium nitrate remained unchanged. If oxidation reaction of organic substance simply depends on collision frequency, unreacted sodium nitrate can be recovered and reused, then oxidation equivalent weight would be sufficient. In the gas generated, toxic gas was not found. As the supercritical water medium has high reactivity, it is difficult to generate relatively low energy level SO$_{X}$, and NO$_{X}$.

• Proceedings of the KWS Conference
• /
• 2005.11a
• /
• pp.225-227
• /
• 2005

Sn-8wt%Zn-3wt%Bi (이하, Sn-8Zn-3Bi) 솔더의 장기 신뢰성을 평가하기 위하여 열 충격 시험을 행하였다. 열 충격 시험은 $-40^{\circ}C$에서 $80^{\circ}C$범위에서 1000 사이클 동안 하였다. 접합 기판으로는 각각 OSP(Organic Solderability Preservative), Sn 그리고 Ni/Au 처리를 한 PCB(Printed Circuit Board) 패드를 사용하였다. 접합에 사용한 부품은 1608 Chip(Multi Layer Chip Capacitor, Chip Resistor) 으로 전극 부위에 Sn-37wt%Pb, Sn 도금하여 사용하였다. 솔더링 후 1608 Chip의 전단 강도와 솔더링부에서 미세조직 및 IMC(Inter Metallic Compound) 변화를 관찰하였다. 측정결과, Sn-8Zn-3Bi 솔더의 초기 전단 강도는 기판의 표면처리에 상관없이 약 40N 이상이었다. 그리고 열충격 시험 1000 사이클 후에는 모든 기판에서 2N 정도 약간의 강도 저하를 보였다.

• Journal of Welding and Joining
• /
• v.16 no.4
• /
• pp.92-97
• /
• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.