• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.453-454
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• 2005

PDP에 사용되는 유전체, 격벽재, 봉착재 등의 glass들은 모두 PbO를 다량 함유하는 저융점 유리조성계로 되어있다. 최근 환경규제에 따라 Pb 대체 재료의 개발이 필요하게 되었으며, 그에 대한 많은 연구들이 진행되고 있다. 본 연구에서는 투명 유전체를 겨냥한 저융점 이면서 무해한 3성분계 Pb-free 유리를 제조하였다. 또한 SnO 계 유리와의 혼합 용융에 의한 영향을 고찰하였으며, 유리로서의 고유물성과 응용용도별 특성을 함께 고찰하였다.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.47-53
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• 2000

The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.47-52
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• 2003

A new type of Bi based glass frit was developed for Ag paste in PDP applications and its properties are compared with the commercially used Pb based glass frit. After optimization of the properties of Bi based frits for PDP application such as the softening temperature and the coefficient of thermal expansion (C.T.E), the screen printed electrodes prepared with the Bi based fit contained Ag paste were characterized. In $Bi_2O_3-B_2O_3-Al_2O_3$ glass system with the more than 50% of $Bi_2O_3$, the softening temperature, the thermal expansion coefficient and the line resistivity was 400∼$480^{\circ}C$, 7.31∼$10.02\times 10^{-6}/^{\circ}C$> and 4.1∼4.8$\Omega$ respectively. Properties of the Bi based frits are comparable with the Pb based frits. A printability and an uniformity of the Bi based frits were excellent in screen printed Ag eletrode. The Bi based frit system is an excellent candidate material for Pb free and Alkali free frit in PDP applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.295-298
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize BaO-ZnO-$B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.

• Proceedings of the Korean Ceranic Society Conference
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• 2000.10a
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• pp.75.1-75
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• 2000

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1096-1099
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• 2004

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3$-$V_2O_5$. DTA, and XRD were used to characterize BaO-ZnO-$B_2O_3$-$V_2O_5$ glasses. In this present study, PbO free paste had thermal expansion of $74\times10^{-7}/^{\circ}C$, DTA softening point of $460^{\circ}C$, and firing condition of $520^{\circ}C$, 20min

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.150-150
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• 2002

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.876-879
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• 2003

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system $BaO-ZnO-B_2O_3-V_2O_5$. DTA, XRD and SEM were used to study and characterize $BaO-ZnO-B_2O_3-V_2O_5$ glasses. PbO free paste developed at this paper has thermal expansion of $74{\times}10^{-7}/^{\circ}C$, DTA transformation point of $460^{\circ}C$, and firing condition of $560^{\circ}C$, 10min.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.524-525
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• 2005

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system $ZnO-B_2O_3-Bi_2O_3-SiO_2$, DTA, and XRD were used to characterize $ZnO-B_2O_3-Bi_2O_3-SiO$ glasses. In this present study, PbO free paste had thermal expansion of $74\times10^{-7}/^{\circ}C$, DTA transformation point of $470^{\circ}C$, and firing condition of $540^{\circ}C$, 20min.

• Journal of the Korean Ceramic Society
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• v.38 no.7
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• pp.628-633
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• 2001

전자 패키징에 적용 가능한 저융점 유리 중에서 납성분이 포함되어 있지 않는 Bi계 유리의 연구를 행하였다. 기판과의 일체화를 위한 유리의 응용으로, 소자와의 반응 억제와 열응력 완화를 위해 유리의 저융점화 및 열팽창계수를 제어하였다. 본 연구에서 제조된 Bi계 유리는 DTA와 TMA의 열분석을 통해 5$50^{\circ}C$ 부근에서 연화점이 있고, 열팽창계수는 7.52~12.09$\times$$10^{-6}$/$^{\circ}C$의 범위였으며, 비유전율은 9~13이었다. 본 연구의 납성분을 포함되어 있지 않는 유리조성은 우수한 내산성을 나타내었다.