• Title/Summary/Keyword: Patterned thin films

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Direct-Patternable SnO2 Thin Films Incorporated with Conducting Nanostructure Materials (직접패턴형 SnO2 박막의 전도성 나노구조체 첨가연구)

  • Kim, Hyun-Cheol;Park, Hyung-Ho
    • Korean Journal of Materials Research
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    • v.20 no.10
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    • pp.513-517
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    • 2010
  • There have been many efforts to modify and improve the properties of functional thin films by hybridization with nano-sized materials. For the fabrication of electronic circuits, micro-patterning is a commonly used process. For photochemical metal-organic deposition, photoresist and dry etching are not necessary for microscale patterning. We obtained direct-patternable $SnO_2$ thin films using a photosensitive solution containing Ag nanoparticles and/or multi-wall carbon nanotubes (MWNTs). The optical transmittance of direct-patternable $SnO_2$ thin films decreased with introduction of nanomaterials due to optical absorption and optical scattering by Ag nanoparticles and MWNTs, respectively. The crystallinity of the $SnO_2$ thin films was not much affected by an incorporation of Ag nanoparticles and MWNTs. In the case of mixed incorporation with Ag nanoparticles and MWNTs, the sheet resistance of $SnO_2$ thin films decreased relative to incorporation of either single component. Valence band spectral analyses of the nano-hybridized $SnO_2$ thin films showed a relation between band structural change and electrical resistance. Direct-patterning of $SnO_2$ hybrid films with a line-width of 30 ${\mu}m$ was successfully performed without photoresist or dry etching. These results suggest that a micro-patterned system can be simply fabricated, and the electrical properties of $SnO_2$ films can be improved by incorporating Ag nanoparticles and MWNTs.

A Dry-patterned Cu(Mg) Alloy Film as a Gate Electrode in a Thin Film Transistor Liquid Crystal Displays (TFT- LCDs) (TFT-LCDs 게이트 전극에 적용한 Cu(Mg) 합금 박막의 건식식각)

  • Yang Heejung;Lee Jaegab
    • Korean Journal of Materials Research
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    • v.14 no.1
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    • pp.46-51
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    • 2004
  • The annealing of a Cu(4.5at.% Mg)/$SiO_2$/Si structure in ambient $O_2$, at 10 mTorr, and $300-500^{\circ}C$, allows for the outdiffusion of the Mg to the Cu surface, forming a thin MgO (15 nm) layer on the surface. The surface MgO layer was patterned, and successfully served as a hard mask, for the subsequent dry etching of the underlying Mg-depleted Cu films using an $O_2$ plasma and hexafluoroacetylacetone [H(hfac)] chemistry. The resultant MgO/Cu structure, with a taper slope of about $30^{\circ}C$ shows the feasibility of the dry etching of Cu(Mg) alloy films using a surface MgO mask scheme. A dry-etched Cu(4.5at.% Mg) gate a-Si:H TFT has a field effect mobility of 0.86 $\textrm{cm}^2$/Vs, a subthreshold swing of 1.08 V/dec, and a threshold voltage of 5.7 V. A novel process for the dry etching of Cu(Mg) alloy films, which eliminates the use of a hard mask, such as Ti, and results in a reduction in the process steps is reported for the first time in this work.

Quench Distribution in AU/YBCO Thin Film Meander Lines with a Au Meander Line Heater (금선 히터가 있는 금/YBCO 박막 선에서의 퀜치 분포)

  • Kim, H. R.;J. W. Shim;O. B. Hyun;J. M. Oh
    • Progress in Superconductivity
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    • v.5 no.2
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    • pp.118-123
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    • 2004
  • We investigated quench distribution in AU/YBCO thin film meander lines with a heater. Quench distribution during faults is important for superconducting fault current limter applications, because uniform quench allows application of higher voltages across the meander lines. AU/YBCO thin films grown on sapphire substrates were patterned into meander lines by photolithography. Gold films grown on the rear sides of the substrates were also patterned into meander lines, and used as heaters. Meander lines on the front and the rear sides were connected in parallel. The meander lines were subjected to simulated AC fault currents for quench measurements during faults. They were immersed in liquid nitrogen during the experiment for effective cooling. Resistance of the AU/YBCO meander lines initially increased more rapidly with the rear heater than without, and consequently the fault current was limited more. The resistance subsequently became similar, The resistance distribution was more uniform with the heater, especially during the initial quench. Quench was completed more uniformly and significantly earlier. This resulted in uniform distribution of dissipated power. These results could be explained with the concept of quench propagation, which was accelerated by heat transfer across the substrate from the rear heater.

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Improvement of Electrochemical Reaction Kinetics in Lithium Manganese Oxide Thin Films (리튬 망간산화물 박막에서의 전극 반응의 개선)

  • Park Young-Shin;Kim Chan-Soo;Joo Seung-Ki
    • Journal of the Korean Electrochemical Society
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    • v.3 no.2
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    • pp.96-99
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    • 2000
  • In order to improve the rate capability of lithium manganese oxide thin film, we prepared the patterned cathode films by conventional lithography and etching techniques. From the investigation of discharge current density effects on discharge curves of cathode films, the rate capability was greatly improved due to increase of lithium intercalation kinetics fur charge transfer.

Preparaton of ECR MOCVD $SrTiO_3$ thin films and their application to a Gbit-scale DRAM stacked capacitor structure

  • Lesaicherre, P-Y.
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.138-144
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    • 1995
  • It is commonly believed that high permittivity materials will be necessary for future high density Gbit DRAMs. In a first part, we explain the choice of SrTiO3 by ECR MOCVD for Gbit-scale DRAMs. In a second part, after describing the ECR MOCVD system and presenting the requirements SrTiO3 thin films should meet for use in Gbit-scale DRAMs, the physical and electrical properties of srTiO3 thi film prepared by ECR MOCVD are then studied. A stacked capacitor technology, suitable for use in 1 Gbit DRAM, and comprising high permittivity SrTiO3 thin films prepared by ECR MOCVD at $450^{\circ}C$ on electron beam and RIE patterned RuO2/TiN storage nodes is finally described.

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Fabrication of Organic Thin-Film Transistors with Polymer Gate Insulators on Plastic Substrate

  • Ahn, Seong-Deok;Kang, Seung-Youl;Oh, Ji-Young;You, In-Kyu;Kim, Gi-Heon;Baek, Kyu-Ha;Kim, Chul-Am;Suh, Kyung-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1170-1173
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    • 2006
  • Active layer patterned OTFT was obtained on a plastic substrate using the optimal growth condition of pentancene thin films as active layer and parylene thin films as passivation layer. Tranditional photolithography was performed to use a dry etch to pattern the material stack. The pentacene thin film and parylene thin film were deposited onto a plastic substrate using PC-OVD and CVD, respectively.

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Fabrication of Superconducting Narrow Bandpass Filters with Parallel Microstrip Line (마이크로스트립 평행결합선을 이용한 초전도 협대역 필터의 제작)

  • Park, Joo-Hyung;Lee, Sang-Yeol;Yoon, Hyung-Kuk;Yoon, Young-Joong
    • Proceedings of the KIEE Conference
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    • 1998.07d
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    • pp.1549-1551
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    • 1998
  • We have designed and developed narrow bandpass multipole filters for satellite communication using $YBa_2Cu_3O_{7-x}$(YBCO) thin films on MgO substrates. The superconducting film used in this study was prepared by laser ablation on one side polished MgO (100) substrates. A Nd:YAG laser was used to fabricate YBCO thin films. The wave length of the laser was 355 nm. The laser beam was focused onto a YBCO target rotating linearly to avoid deep craters that may eject macroscopic YBCO particles. The YBCO films were grown at $750^{\circ}C$ in the oxygen partial pressure of 200 mTorr. The deposited YBCO thin films were patterned by conventional wet-etching method. The transition temperatures of YBCO thin films were 85 - 88 K and the film thicknesses were about 5,000 $\AA$. By comparing the performances of normal-metal filters and YBCO filters, we observed that superconducting YBCO multipole filters have been showed superior performances at 77 K.

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Fabrication of transparent conductive thin films with Ag mesh shape using the polystyrene beads monolayer

  • Jung, Taeyoung;Choi, Eun Chang;Hong, Byungyou
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.313-313
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    • 2016
  • Transparent conductive oxide (TCO) films have many disadvantages, such as rarity, possible exhaustion, process temperature limitations, and brittleness on a flexible substrate. In particular, as display technology moves toward flexible displays, TCO will become completely unsuitable due to its brittleness. To address theses issue, many researchers have been studying TCO substitutes. In recent efforts, metal nanowires, conducting polymers, carbon nanotube networks, graphene films, hybrid thin films, and metal meshes/grids have been evaluated as candidates to replace TCO electrodes. In this study, we fabricated the TCO film with Ag meshes shape using polystyrene (PS) beads monolayer on the substrate. The PS beads were used as a template to create the mesh pattern. We fabricated the monolayer on the flexible substrate (PES) with the well-aligned PS beads. Electrodes with Ag mesh shape were formed using this patterned monolayer. We could fabricated the Ag mesh electrode with the sheet resistance with $8ohm{\Omega}/{\Box}$.

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Au nano array formed on patterened $Al_2O_3$(0006)

  • Hwang, Jae-Seong;Gang, Hyeon-Cheol;Seo, Ok-Gyun;O, Pil-Geon;Lee, Seong-Pyo;Lee, Su-Yong;Kim, Su-Nam;Kim, Jae-Myeong;Jo, In-Hwa;No, Do-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.402-402
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    • 2010
  • The formation of Au nano particles from thin films on patterned substrates depends sensitively on film thickness and time. The nano Au line and shape formed by annealing Au films on patterned oxide substrates are different from those formed on semiconductor. In this experiment, we deposited thin Au films on patterned $Al_2O_3$(0006) using E-beam evaporator, and annealed them at various temperatures and thickness under various conditions by RTA. We measured behavior of the Au during annealing Au structure and shape are changed when Au film becomes thicker. The shape of the resultant Au nano particles and their coarsening process are investigated using SEM and XRD.

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Effect of the Surface Roughness of ITO Thin Films on the Characteristics of OLED Device (ITO 박막의 표면 거칠기에 따른 OLED 소자의 특성)

  • Lee, Bong-Kun;Lee, Kyu-Mann
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.4
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    • pp.49-52
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    • 2009
  • We have investigated the effect of the surface roughness of TCO substrate on the characteristics of OLED (organic light emitting diodes) devices. In order to control the surface roughness of ITO thin films, we have processed photolithography and reactive ion etching. The micro-size patterned mask was used, and the etching depth was controlled by changing etching time. The surface morphology of the ITO thin film was observed by FESEM and atomic force microscopy (AFM). And then, organic materials and cathode electrode were sequentially deposited on the ITO thin films. Device structure was ITO/$\alpha$-NPD/DPVB/Alq3/LiF/Al. The DPVB was used as a blue emitting material. The electrical characteristics such as current density vs. voltage and luminescence vs. voltage of OLED devices were measured by using spectrometer (minolta CS-1000A). The current vs. voltage and luminance vs. voltage characteristics were systematically degraded with increasing surface roughness. Furthermore, the retention test clearly presented that the reliability of OLED devices was directly influenced with the surface roughness, which could be interpreted in terms of the concentration of the electric field on the weak and thin organic layers caused by the poor step coverage.

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