• 대한전자공학회논문지TC
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• 제42권1호`
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• pp.111-118
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• 2005

기지국 안테나의 수직 패턴 형태는 자기 셀 뿐만 아니라 인접 셀의 통신 품질에도 크게 영향을 미치므로, 셀의 설계에 있어서 매우 중요한 고려 사항이다. 현재 기지국 안테나에 적용되는 수직 패턴의 형태는 크게 5가지로 분류될 수 있다. 안테나의 설계에 있어서, 5가지의 수직 패턴은 단독으로 적용되기도 하고, 또는 복합적으로도 적용될 수 있다. 본 논문에서는 상측의 부엽이 억압되고, 하측의 널이 널 필링된 수직 패턴을 갖으며, 또한, 수직면 상에서 연속적인 전기적 다운 틸팅이 가능한 이중 편파의 기지국용 안테나를 설계 및 제작하였다. 성형 빔 합성은 R. S. Elliott이 제안한 패턴 합성법들을 순차적으로 사용하여 구현하였으며, 또한 전기적인 다운 틸팅 기능을 위해 위상 배열 안테나 기술이 적용되었다. 측정한 결과, 0°～14°의 연속적인 다운 틸팅 범위와 13.3dBi 이상의 이득, 그리고 최대 -23dB의 상측 부엽 성능이 나타났다. 또한, 다운 틸팅 시에도 상측 부엽의 변화가 크지 않음을 확인할 수 있었으며, 패턴의 널 필링 특성도 전반적으로 양호하다.

• 한국산업융합학회 논문집
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• 제8권1호
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• pp.11-17
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• 2005

This study was performed to analysis the operation process when fabric pattern design was done by the use of CAD system compared with the manual work in order to determine the operation efficiency with the application of fabric design CAD system. The results of the study were as follows: 1. since 160,000 colors were supported by CAD system, color proposed by consumer was able to match exactly according to the its design. However, exact color matching was not possible by manual work. 2. Woven state of back of pattern design could be identified simultaneously with face of it for CAD system, while face and back of the fabrics should be designed separatedly in case of manual work. 3. Since the combination of warp and filling yarn was compatible with the fabric density in one repeat unit in CAD system, exact size of pattern design to be woven was able to expressed. 4. Only simple graphical expression by manual work was seen, while with the CAD system, texture and shade effect as well as graphical expression could be expressed and so fault could be reduced in advance with the simulation of actual feeling of fabrics in the screen. In conclusion, when CAD system will be introduced to the textile industry, operation time of designing pattern can be reduced. Since the operation is easy and simple, a beginner can operate CAD system easily. Thus, production and wage costs can be saved and this can be related directly with the improvement of productivity which is the main purpose of introducing CAD system.

• Restorative Dentistry and Endodontics
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• 제22권2호
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• pp.622-636
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• 1997

Glass ionomer cements, which had been developed in 1972, were widely used as an agent for cementation, base, pit and fissure sealant, and esthetic filling material with the advantages of excellent biocompatibility, anti-cariogenic fluoride release. Specimens were made to evaluate the color change of Glass ionomer cement with a newly developed improved Fuji II Le. Specimens for color change study with cement thickness of 1, 2, 3mm were made and those for the study of color shift pattern were made with the assumption that new mid-shade can be made by mixing of equal amount of both shades in 2mm thickness. After 24 hours in a $37^{\circ}C$ incubator, CIELAB color spaces were evaluated with a spectrophotometer. The results were as follows ; 1. All specimens discolored to dark and blue with an increased thickness in all shades (p<0.05). 2. There were significant $a^*$ space (red-green direction) changes in every A, B, C, D shade series except the relationship between 1mm and 2mm thickness groups in B shade series. But the changes were irregular, i.e., each shade series has its own pattern. 3. Each shade series showed its own specific color shift pattern in all $L^*$, $a^*$, $b^*$ spaces. 4. B shade series showed less amont of changes in ${\Delta}{\pm}E$ than those of A and C shade series (p<0.05), but there was no significant difference in ${\Delta}E$ within each shade series.

• 한국작물학회지
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• 제57권2호
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• pp.151-159
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• 2012

최근 개발된 직파재배의 일종인 무논점파는 무논점파기(8조식, $15{\times}28cm$, 주당 5~8립)를 이용하여 파종하므로 이앙재배의 재식거리와 유사한 밀도를 유지할 수 있는 장점이 있다. 벼 무논점파재배의 생육 및 출수특성과 출수일변동에 따른 등숙율과 완전립율의 변이를 알아보고자 국립식량과학원 답작과 논포장(수원)에서 2009년부터 2011년까지 3년동안 본 시험을 수행하였다. 1. 무논점파는 입모수는 기계이앙의 재식밀도와 큰 차이가 없었으나 분얼수가 많아 최고분얼기에 단위면적당 경수는 기계이앙의 1.3~2배였다. 최고분얼기 이후 분얼수는 감소해 성숙기 이삭수는 기계이앙과 큰 차이가 없었다. 2. 무논점파의 출수전 생육일수는 운광벼 84일, 호품벼 98일로 기계이앙의 파종일로부터 14일, 19일의 재배기간이 단축되었다. 3. 무논점파의 성숙기 생육특성은 간장과 수장 및 면적당 이삭수는 기계이앙과 차이가 없었다. 통계적 유의성은 없었으나 수당립수는 많아지는 경향이었다. 4. 출수기는 무논점파가 이앙보다 운광벼는 9일, 호품벼는 3일 늦어졌는데 호품벼의 연차간 변이가 작았다. 호품벼는 출수기간이 기계이앙보다 2일 짧아 동시출수율이 높았다. 4. 무논점파재배시 출수일변이에 따른 등숙율과 현미완 전립율은 기계이앙과 차이가 없거나 오히려 높은 것으로 나타났으나 조생종인 운광벼보다 중만생종인 호품벼의 연차간 변이가 적어 무논점파 안정성이 우수한 것으로 나타났다.

• 한국표면공학회지
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• 제38권1호
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• pp.28-36
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• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.

• 자원환경지질
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• 제27권1호
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• pp.11-28
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• 1994

The Anyang Feldspar Mine is located in Seoksu Dong, Anyang City, Kyeonggi Do, Korea and has a long exploitation record that is once produced high grade sodium feldspars, for glaze. Geologically, This area is mainly composed of Mesozoic Jurassic biotite granite (Anyang granite) which intruded Precambrian Kyeonggi Gneiss Complex outcroped near the mining area. The deposit is localized on the southwest hill side of Anyang granite batholith and is confined in hydrothemal alteration zone formed by sodium-rich alkali hydrothermal fluids along the fractures of leucocratic granite showing later differentiation facies in the biotite granite. The hydrothermal alteration is characterized by albitization, sericitization, and desilication. The microscopic observation and EPMA, XRD analysis of the feldspar ores show that major minerals are albite and quartz and accessory minerals are orthoclase and sericite, and they are rarely associated with perthite, fluorite, zircon, kaolinite, molybdenite, microcline and iron-oxide. In the REE pattern, the strong negative Eu anomalies of the feldspar ores indicate the influence of feldspar fractionation and show similiar pattern of the host leucocratic granite. The filling temperature of quartz crystals in ore zone ranges from $276^{\circ}C$ to $342^{\circ}C$, and it is inferred that the alteration occurred by the hypothermal solution.

• 한국진공학회지
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• 제15권5호
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• pp.465-474
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• 2006

기체저장용기, 단순 개폐밸브 및 기체 공급 관으로 구성된 기체연료 주입계는 가장 간단하게 사전에 기체 도입유형을 정할 수 있다는 장점이 있다. 장치의 동작특성을 알아보기 위해 기체 흐름에 관한 일차원 동특성 방정식을 세우고 수치적으로 풀었다. 이 계산의 목적은 저장기체 압력, 저장용기 체적, 공급관의 굵기, 길이 따위의 기계적 요소들과 최대유량까지의 지연시간, 최대유량 값, 기체 펄스폭 따위의 기체 흐름의 유형을 결정하는 인자들 사이의 관계를 정립하려는 것이다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.91-94
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• 2006

In this paper, in order to get micro or nano size optical patterns, an analytical and experimental investigation on a LGP (light guide plate) injection molding process has performed. The LGP, which diffusing and emitting the light from the CCFL or the LEDs to the panel front direction uniformly, typically has an under 1mm thick base substrate and numerous 60 to $170{\mu}m$ width and 6 to $10{\mu}m$ thick dot patterns on it. Generally, the small size LGPs, for mobile devices, have been and are being made of PMMA through the injection molding process. However, the substrate thickness and the dot pattern size are decreasing, it becomes hard to fill the micro to sub-micro cavities completely. To investigate the flow behavior of resin in micro/nano cavities and identify the characteristics of the LGP injection molding process, we carried out the flow analyses with respect to the variations of the substrate thickness, the dot pattern size and the pitch of a cavity.

• 제어로봇시스템학회논문지
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• 제7권1호
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• pp.1187-1195
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• 2001

This paper presents a sweeping path planning algorithm for an autonomous smearing robot. An automatic planner generates a sweeping path pattern by proposed five basic procedures. This algorithm rocog-nizes obstacle on the architectural CAD draft and generates subgoals as tracking points which executes the area filling task based on heuristic approach. A sweeping path is planned by sequentially connecting the track-ing points in such a way that(1) the connected line segments should not be crossed, (2) the total tracking points should be as short as possible, and (3) the tracking line should not pass through the obstacle, Feasibility of the developed techniques has been demonstrated on a real architectural CAD draft.

• Transactions on Electrical and Electronic Materials
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• 제16권6호
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• pp.312-316
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• 2015

Through silicon via (TSV) technology holds the promise of chip-to-chip or chip-to-package interconnections for higher performance with reduced signal delay and power consumption. It includes high aspect ratio silicon etching, insulation liner deposition, and seamless metal filling. The desired etch profile should be straightforward, but high aspect ratio silicon etching is still a challenge. In this paper, we investigate the use of etch hard mask for finer TSVs etching to have clear definition of etched via pattern. Conventionally employed photoresist methods were initially evaluated as reference processes, and oxide and metal hard mask were investigated. We admit that pure metal mask is rarely employed in industry, but the etch result of metal mask support why hard mask are more realistic for finer TSV etching than conventional photoresist and oxide mask.