• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.545-546
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.749-750
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• 2011

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 추계학술대회 초록집
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• International Journal of Aeronautical and Space Sciences
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• 제13권2호
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• pp.229-237
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• 2012

In this study, the failure mechanism of sandwich-to-laminate T-joints under pull-off loading was investigated by experiment and the finite element method. A total of 26 T-joint specimens were manufactured and tested in order to investigate the effects of both adhesive thickness (0.4, 2.0, and 4.0 mm) and environmental conditions on the failure of the joints. The results showed that failure occurred mainly as intralaminar failure in the first layer of the sandwich face, which was contacted to the paste adhesive. The failure load did not significantly change with increasing adhesive thickness in both RTD (Room Temperature and Dry) and ETW (Elevated Temperature and Wet) conditions. In the case of ETW conditions, however, the failure load increased slightly with an increase in adhesive thickness. The joints tested in ETW conditions had higher failure loads than those tested in RTD conditions. In addition to the experiment, a finite element analysis was also conducted to investigate the failure of the joint. The stress inside the first ply of the sandwich face was of interest because during the experiment, failure always occurred there. The analysis results showed good agreement with the trend of experimental results, except for the case of the smallest adhesive thickness. The highest stress was predicted in the regions where initial failure was observed in the experiment. The maximum stress was almost constant when the adhesive thickness was beyond 2 mm.

• Restorative Dentistry and Endodontics
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• 제43권1호
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• pp.7.1-7.7
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• 2018

Objectives: The aim of this study is to compare the shear bond strengths of ceramic brackets bonded to zirconia surfaces using different zirconia primers and universal adhesive. Materials and Methods: Fifty zirconia blocks ($15{\times}15{\times}10mm$, Zpex, Tosoh Corporation) were polished with 1,000 grit sand paper and air-abraded with $50{\mu}m$ $Al_2O_3$ for 10 seconds (40 psi). They were divided into 5 groups: control (CO), Metal/Zirconia primer (MZ, Ivoclar Vivadent), Z-PRIME Plus (ZP, Bisco), Zirconia Liner (ZL, Sun Medical), and Scotchbond Universal adhesive (SU, 3M ESPE). Transbond XT Primer (used for CO, MZ, ZP, and ZL) and Transbond XT Paste was used for bracket bonding (Gemini clear ceramic brackets, 3M Unitek). After 24 hours at $37^{\circ}C$ storage, specimens underwent 2,000 thermocycles, and then, shear bond strengths were measured (1 mm/min). An adhesive remnant index (ARI) score was calculated. The data were analyzed using one-way analysis of variance and the Bonferroni test (p = 0.05). Results: Surface treatment with primers resulted in increased shear bond strength. The SU group showed the highest shear bond strength followed by the ZP, ZL, MZ, and CO groups, in that order. The median ARI scores were as follows: CO = 0, MZ = 0, ZP = 0, ZL = 0, and SU = 3 (p < 0.05). Conclusions: Within this experiment, zirconia primer can increase the shear bond strength of bracket bonding. The highest shear bond strength is observed in SU group, even when no primer is used.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.53-57
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• 2011

In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.223-226
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• 2007

본 연구에서는 Ag anisotropic conductive adhesive(ACA)의 종류, 경화 조건 및 안테나 패턴의 재질에 따른 flip chip bonding된 RFID die의 접합부 신뢰성이 조사되었다. 접합강도 측정에 의하여 접합강도가 최적화되는 공정 시간을 결정할 수 있었으며, 그러한 최적의 공정조건에서는 paste-type Ag ink로 인쇄된 안테나 상에서의 RFID die의 접합강도가 Cu 재질 안테나에 비해 상대적으로 높게 측정됨을 알 수 있었다. RFID tag의 인식거리 측정 시험을 통하여 적절한 경화 조건이 적용된다면 안테나의 재질이 인식거리 변화에 가장 주요한 영향을 미치는 인자임을 알 수 있었다. 아울러 Cu 안테나 패턴은 RFID die의 접합 과정에서 곡률을 가지며 휘어지면서 인식거리와 관련된 long-tem reliability를 악화시킬 수 있음을 관찰할 수 있었다.

• 한국인쇄학회지
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• 제29권2호
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• pp.45-58
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• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• 한국세라믹학회지
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• 제39권5호
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• pp.467-472
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• 2002

다이아몬드 연마 필름(diamond lapping film)으로 긴 탄소나노튜브를 절단하고 이를 Scanning Electron Microscope(SEM)으로 관찰했다. 절단된 탄소나노튜브를 ${\alpha}$-terpineol을 용매로 ethyl cellulose를 바인더로 사용하여 제조한 페이스트를 스크린 프린팅과 주사 사출법으로 유리 기판에 도포하였다. 스크린 프린팅으로 인쇄된 선에 존재하는 절단된 탄소나노튜브를 기판에 대해 수직 배향을 시키기 위하여 사포, 다이아몬드 연마 필름을 사용하여 마찰시키거나 접착성이 있는 테이프를 이용하여 접촉시켰다가 분리 하는 방법을 시도하였다. SEM으로 탄소나노튜브의 배향 특성을 관찰한 결과 주사 사출법과 스크린 프린팅 후 다이아몬드 연마 필름을 사용하여 후처리하는 간편한 방법으로 탄소나노튜브의 우수한 수직배양이 이루어짐을 알 수 있었다.