• Analytical Science and Technology
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• v.23 no.2
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• pp.165-171
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• 2010

Glucose oxidase ($GOD_{ox}$) immobilized biosensor was fabricated by two methods. In one of the methods, gold nanoparticles (Au-NPs) prepared by ${\gamma}$-irradiation were loaded into the poly(maleic anhydride)-grafted multi-walled carbon nanotube, PMAn-g-MWCNT electrode via physical entrapment. In the other method, the Au-NPs were prepared by electrochemical reduction of Au ions on the surface of PMAn-g-MWCNT electrode and then GODox was immobilized into the Au-NPs. The $GOD_{ox}$ immobilized biosensors were tested for electrocatalytic activities to sense glucose. The sensing range of the biosensor based on the Au-NPs physically modified PMAn-g-MWCNT electrode was from $30\;{\mu}M$ to $100\;{\mu}M$ for the glucose concentration, and the detection limit was $15\;{\mu}M$. Interferences of ascorbic acid and uric acid were below 7.6%. The physically Au deposited PMAn-g-MWCNT paste electrodes appear to be good sensor in detecting glucose.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.490.2-490.2
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• 2014

Since the general solar cells accept sun light at the front side, excluding the electrode area, electrons move from the emitter to the front electrode and start to collect at the grid edge. Thus the edge of gridline can be important for electrical properties of screen-printed silicon solar cells. In this study, the improvement of electrical properties in screen-printed crystalline silicon solar cells by contact treatment of grid edge was investigated. The samples with $60{\Omega}/{\square}$ and $70{\Omega}/{\square}$ emitter were prepared. After front side of samples was deposited by SiNx commercial Ag paste and Al paste were printed at front side and rear side respectively. Each sample was co-fired between $670^{\circ}C$ and $780^{\circ}C$ in the rapid thermal processing (RTP). After the firing process, the cells were dipped in 2.5% hydrofluoric acid (HF) at room temperature for various times under 60 seconds and then rinsed in deionized water. (This is called "contact treatment") After dipping in HF for a certain period, the samples from each firing condition were compared by measurement. Cell performances were measured by Suns-Voc, solar simulator, the transfer length method and a field emission scanning electron microscope. According to HF treatment, once the thin glass layer at the grid edge was etched, the current transport was changed from tunneling via Ag colloids in the glass layer to direct transport via Ag colloids between the Ag bulk and the emitter. Thus, the transfer length as well as the specific contact resistance decreased. For more details a model of the current path was proposed to explain the effect of HF treatment at the edge of the Ag grid. It is expected that HF treatment may help to improve the contact of high sheet-resistance emitter as well as the contact of a high specific contact resistance.

• Journal of the Korean Chemical Society
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• v.35 no.5
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• pp.545-552
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• 1991

A mercury ion-sensitive carbon-paste electrode (CPE) was constructed with l-sparteine. Mercury (II) ion was chemically deposited by the complexation with l-sparteine onto the CPE. The surface of CPEs was characterized by cyclic voltammetry and anodic stripping voltammetry in an acetate buffer solution, separately. Exposure of CPEs to acid solution could regenerate surface and reuse it for deposition. In 5 deposition/measurement/regeneration cycle, the response was reproducible and in licnear up to $2.0\;{\times}\;10^{-6}$ M with linear sweep voltammetry. In case of using the differential pulse technique, we have obtained the linear response up to $7.0 {\times}10^{-7}$ M with relative standard deviation of ${\pm}5.1$%. The detection limit was $5.0{\times}10^{-7}$ M for 20 minutes of the deposition. We have investigated the interference effect of various metal ions, which are expected to form the complex with ligand. Silver (I) ion of these has interfered with the analysis of Hg (II) ions. However, pretreatment of the silver (I) ion with potassium chloride led to no interference on the analysis of mercury ions in aqueous solution.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.47-52
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• 2003

A new type of Bi based glass frit was developed for Ag paste in PDP applications and its properties are compared with the commercially used Pb based glass frit. After optimization of the properties of Bi based frits for PDP application such as the softening temperature and the coefficient of thermal expansion (C.T.E), the screen printed electrodes prepared with the Bi based fit contained Ag paste were characterized. In $Bi_2O_3-B_2O_3-Al_2O_3$ glass system with the more than 50% of $Bi_2O_3$, the softening temperature, the thermal expansion coefficient and the line resistivity was 400∼$480^{\circ}C$, 7.31∼$10.02\times 10^{-6}/^{\circ}C$> and 4.1∼4.8$\Omega$ respectively. Properties of the Bi based frits are comparable with the Pb based frits. A printability and an uniformity of the Bi based frits were excellent in screen printed Ag eletrode. The Bi based frit system is an excellent candidate material for Pb free and Alkali free frit in PDP applications.

• Carbon letters
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• v.26
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• pp.18-24
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• 2018

Pollution of chloride ion-reinforced concrete can trigger active corrosion processes that reduce the useful life of structures. Multifunctional materials used as a counter-electrode by electrochemical techniques have been used to rehabilitate contaminated concrete. Cement-based pastes added to carbonaceous material, fibers or dust, have been used as an anode in the non-destructive Electrochemical Chloride Extraction (ECE) technique. We studied the performance of the addition of Carbon Fiber (CF) in a cement-graphite powder base paste used as an anode in ECE of concretes contaminated with chlorides from the preparation of the mixture. The experimental parameters were: 2.3% of free chlorides, 21 days of ECE application, a Carbon Fiber Volume Fraction (CFVF) of 0.1, 0.3, 0.6, 0.9%, a lithium borate alkaline electrolyte, a current density of $4.0A/m^2$ and a cement/graphite ratio of 1.0 for the paste. The efficiency of the ECE in the traditional technique using metal mesh as an anode was 77.6% and for CFVF of 0.9% it was 90.4%, with a tendency to increase to higher percentages of the CFVF in the conductive cement-graphite paste, keeping the pH stable and achieving a homogeneous ECE in the mass of the concrete contaminated with chlorides.

• Bulletin of the Korean Chemical Society
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• v.35 no.10
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• pp.3025-3029
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• 2014

To realize copper-based electrode materials for printed electronics applications, it is necessary to improve the adhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastes using (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cu pastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> $250^{\circ}C$) under a formic acid/$N_2$ environment. According to the adhesion strengths and electrical conductivities of the sintered Cu films, the optimized Cu paste was composed of 1.0 wt % GPTMS prepolymer, 83.6 wt % Cu powder and 15.4 wt % vehicle. After sintering at $400^{\circ}C$ on a glass substrate and $275^{\circ}C$ on a PI substrate, the Cu films showed the sheet resistances of $10.0m{\Omega}/sq$. and $5.2m{\Omega}/sq$., respectively. Furthermore, the sintered Cu films exhibit excellent adhesion properties according to the results of the ASTM-D3359 standard test.

• Journal of Institute of Convergence Technology
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• v.8 no.1
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• pp.33-39
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• 2018

The screen printing method for forming the electrode by applying the existing pressure is difficult to apply to thin wafers, and since expensive Ag paste is used, it is difficult to solve the problem of cost reduction. This can solve both of the problems by forming the front electrode using a plating method applicable to a thin wafer. In this paper, the process conditions of electrode formation are optimized by using LIEP (Light-Induced Electrode Plating). Experiments were conducted by varying the Ni plating bath temperature $40{\sim}70^{\circ}C$, the applied current 5 ~ 15 mA, and the plating process time 5 ~ 20 min. As a result of the experiment, it was confirmed that the optimal condition of the structural characteristics was obtained at the plating bath temperature of $60^{\circ}C$, 15 mA, and the process time of 20 min. The Cu LIEP process conditions, experiments were conducted with Cu plating bath temperature $40{\sim}70^{\circ}C$, applied voltage 5 ~ 15 V, plating process time 2 ~ 15 min. As a result of the experiment, it was confirmed that the optimum conditions were obtained as a result of electrical and structural characteristics at the plating bath temperature of $60^{\circ}C$ and applied current of 15 V and process time of 15 min. In order to form Ni silicide, the firing process time was fixed to 2 min and the temperature was changed to $310^{\circ}C$, $330^{\circ}C$, $350^{\circ}C$, and post contact annealing was performed. As a result, the lowest contact resistance value of $2.76{\Omega}$ was obtained at the firing temperature of $310^{\circ}C$. The contact resistivity of $1.07m{\Omega}cm^2$ can be calculated from the conditionally optimized sample. With the plating method using Ni / Cu, the efficiency of the solar cell can be expected to increase due to the increase of the electric conductivity and the decrease of the resistance component in the production of the solar cell, and the application to the thin wafer can be expected.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.8
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• pp.461-465
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• 2016

n-type silicon shows the better tolerance towards metal impurities with a higher minority carrier lifetime compared to p-type silicon substrate. Due to better lifetime stability as compared to p-type during illumination made the photovoltaic community to switch toward n-type wafers for high efficiency silicon solar cells. We fabricated the front electrode of the n-type solar cell with AgAl paste. The electrodes characteristics of the AgAl paste depend on the contact junction depth that is closely related to the firing temperature. Metal contact depth with p+ emitter, with optimized depth is important as it influence the resistance. In this study, we optimize the firing condition for the effective formation of the metal depth by varying the firing condition. The firing was carried out at temperatures below $670^{\circ}C$ with low contact depth and high contact resistance. It was noted that the contact resistance was reduced with the increase of firing temperature. The contact resistance of $5.99m{\Omega}cm^2$ was shown for the optimum firing temperature of $865^{\circ}C$. Over $900^{\circ}C$, contact junction is bonded to the Si through the emitter, resulting the contact resistance to shunt. we obtained photovoltaic parameter such as fill factor of 76.68%, short-circuit current of $40.2mA/cm^2$, open-circuit voltage of 620 mV and convert efficiency of 19.11%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.878-881
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• 2013

In this study, we have fabricated the dye sensitized solar cell (DSSC) composed by a transparent conductive oxide (TCO), a nanocrystalline semiconductor film usually $TiO_2$, a sensitizer adsorbed on the surface of the semiconductor, an electrolyte containing a redox mediator and a counter electrode. The $TiO_2$ nanopowder was prepared by sol-gel methode. The HCl (hydrochloric acid) and TBAOH (Tetrabutyl amonium hydroxide) was added for improving the catalyst and distributed properties of $TiO_2$ nanopowder. Ammonium hydroixde was added in order to control the morphology and size of $TiO_2$ nano crystal. A $TiO_2$ paste for working electrode was prepared with the addition of HPC (hydroxypropyl cellulos) used as a binder of which volume was controled as 1.3, 1.5, 1.7, and 2.0%. The measured I-V curves of assembled DSSC showed that the cell with 1.7% HPC binder had the best efficiency of 6.79%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.966-970
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• 2006

We reported on characteristics of the piezoelectric ceramic-polymer composite for the application of the thick-film speaker. The PVDF-PZT composites were fabricated to incorporate the advantages of both ceramic and polymer with various mixing ratios by 3-roll mill mixer. The composite solutions were coated by the conventional screen-printing method on ITO electrode coated PET (Polyethylene terephthalate) polymer film. After depositing the top-electrode of silver-paste, 4 kV/mm of DC field was applied at $120^{\circ}C$ for 30 min to poling the composite films. The value of $d_{33}$ (piezoelectric charge constant) was increased when the PZT weight percent was increased. The maximum value of the $d_{33}$ was 24 pC/N at 70 wt% PZT. But the $g{33}$ (piezoelectric voltage constant) showed the maximum value of $32mV{\cdot}m/N$ at 65 wt% of PZT powder. The SPL (sound pressure level) of the speaker fabricated with the 65:35 composite film was about 68 dB at 1 kHz.