• Transactions on Electrical and Electronic Materials
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• 제18권6호
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• pp.316-319
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• 2017

A new approach to improving the electrical characteristics and optical response of a polysilicon-based metal-semiconductor-metal (MSM) photodetector is proposed. To understand the cause of current restriction in the MSM photodetector, modified trap mechanisms are suggested, which include interfacial electron traps at the metal/polysilicon interface and silicon dangling bonds between silicon crystallite grains. Those traps were passivated using hydrogen ion implantation with subsequent post-annealing. Photodetectors that were ion-implanted under optima conditions exhibited improved photoconductivity and reduced dark current instability, implying that the hydrogen bonds in the polysilicon influence the simultaneous decreases in the density of dangling bonds at grain boundaries and the trapped positive charges at the contact interface.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.491.2-491.2
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• 2014

Generally, silicon heterojunction solar cell has intrinsic and n-type of hydrogenated amorphous silicon (a-Si:H) as passivation layer and BSF layer. In this study, antimony, novel material, deposited on back side of the heterojunction solar cell as passivation and BSF layer to substitute the a-Si:H and the characteristics of the solar cell such electrical properties and optical properties were analyzed. And SIMS analysis was carried out to obtain the depth profile of the BSF layer which was deposited by laser annealing process.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.604-604
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• 2012

기존의 실리콘 이종접합 태양전지는 후면에도 passivation layer인 i-a-Si:H 및 BSF층인 n-a-Si:H가 형성되는 구조를 가지고 있었다. 이러한 구조를 대체하기 위하여 본 연구에서는 실리콘 이종접합 태양전지의 후면 구조에 passivation 층 및 BSF층을 novel material인 Sb증착 및 RTP, laser anneal을 통해 새로운 BSF층 형성하고 태양전지 특성에 대해서 분석하였다. 이를 위해서 carrier lifetime, LIV, DIV 및 QE 등 전기적, 광학적 분석뿐만 아니라 SIMS 분석을 통하여 laser annealing 공정으로 형성된 BSF층의 depth profile 분석도 진행하였다. 또한 wafer orientation에 따른 특성을 분석하기 위하여 (100) 및 (111) wafer를 이용하여 분석하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.72-72
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• 2011

Surface science is intrinsically related to the performance of solar cells. In solar cells the generation and collection of charge carriers determines their efficiency. Effective transport of charge carriers across interfaces and minimization of their recombination at surfaces and interfaces is of utmost importance. Thus, the chemistry at the surfaces and interfaces of these devices must be determined, and related to their performance. In this talk we will discuss the role of two important interfaces, First, the role of surface passivation is very important in limiting the rate of carrier of recombination. Here we will combine x-ray photoelectron spectroscopy of the surface of a Si device with electrical measurements to ascertain what factors determine the quality of a solar cell passivation. In addition, the quality of the heterojunction interface in a ZnSe/CdTe solar cell affects the output voltage of this device. X-ray photoelectron spectroscopy gives some insight into the composition of the interface, while ultraviolet photoemission yields the relative energy of the two materials' valence bands at the junction, which controls the open circuit voltage of the solar cell. The relative energies of ZnSe and CdTe at the interface is directly affected by the material quality of the interface through processing.

• 대한기계학회논문집
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• 제17권2호
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• pp.300-312
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• 1993

The material deterioration of service-exposed boiler tube steels in fossil power plant was evaluated by using the electrochemical technique namely, modified electrochemical potentiokinetic reactivation(EPR). It was focused that the passivation of Mo$_{6}$C carbide which governs the mechanical properties of Mo alloyed steels did not occur even in the passivity region of steel in sodium molybdate solution and the reactivation peak current (Ip) observed as the result of non-passivation indicating the precipitation of Mo$_{6}$C carbides. To obtain the optimal test conditions for the field test by using the specially designed electrochemical cell, the effects of scan rate, the surface roughness and the pH of electrolyte on Ip value were also investigated. Furthermore, the change of mechanical properties occurred during the long time exposure at high temperature was evlauated quantitatively by small punch(SP) tests and micro hardness test taking account of the metallurgical changes. It is known that reactivation peak current (Ip) has a good relationship with Larson-Miller Parameter(LMP) which represents the information about material deterioration occurred at high temperature environment. In addition it was possible to estimate the ductile-brittle transition temperature (DBTT) by means of the SP test. The Sp test could be, therefore, suggested as a reliable test method for evaluating the material degradation of boiler tube steels. From the good correaltion between the SP DBTT and Ip values shown in this study, it was knows that the change of mechanical properties could be evaluated non-destructively by measurring only Ip values.ues.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.38-41
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• 1994

The method of passivation for protecting the $Hg_{1-x}Cd_{x}$Te surface is important device fabrication process. Because the surface components are highly reactive leading to its chemical and electrical instability. Especially. the material of detecting for infrared radiation, of which composition is x=0.2 or 0.3, is narrow bandgap semi- conductor. The narrow bandgap semi conductors are largely governed by the properties of the semiconductor surface. The narrow bandgap semi-conductors are largely governed by the properties of the semiconductor surface. The electro-chemical processing of $Hg_{1-x}Cd_{x}$Te allows rigorous control of the surface chemistry and provides an in-suit monitor of surface reaction. So electro-chemical reduction at specific potential can be selectively eliminated the undesirable species on the surface and mainpulated to reproducibly attain the desired stoichiometry. This method shows to assess the quality of chemically treated good $Hg_{1-x}Cd_{x}$Te surface.

• 한국전기전자재료학회논문지
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• 제35권6호
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• pp.603-609
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• 2022

Passivation quality is mainly governed by epitaxial growth of crystalline silicon wafer surface. Void-rich intrinsic a-Si:H interfacial layer could offer higher resistivity of the c-Si surface and hence a better device efficiency as well. To reduce the resistivity of the contact area, a modification of void-rich intrinsic layer of a-Si:H towards more ordered state with a higher density is adopted by adapting its thickness and reducing its series resistance significantly, but it slightly decreases passivation quality. Higher resistance is not dominated by asymmetric effects like different band offsets for electrons or holes. In this study, multilayer of intrinsic a-Si:H layers were used. The first one with a void-rich was a-Si:H(I₁) and the next one a-SiO_x:H(I₂) were used, where a-SiO_x:H(I₂) had relatively larger band gap of ~2.07 eV than that of a-Si:H (I₁). Using a-SiO_x:H as I₂ layer was expected to increase transparency, which could lead to an easy carrier transport. Also, higher implied voltage than the conventional structure was expected. This means that the a-SiO_x:H could be a promising material for a high-quality passivation of c-Si. In addition, the i-a-SiO_x:H microstructure can help the carrier transportation through tunneling and thermal emission.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

• 전기학회논문지
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• 제66권4호
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• pp.659-665
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• 2017

Power semiconductor devices required the low on-resistance and high breakdown voltage. Wide band-gap materials opened a new technology of the power devices which promised a thin drift layer at an identical breakdown voltage. The diamond had the wide band-gap of 5.5 eV which induced the low power loss, high breakdown capability, low intrinsic carrier generation, and high operation temperature. We investigated the p-type pseudo-vertical diamond Schottky barrier diodes using a numerical simulation. The impact ionization rate was material to calculating the breakdown voltage. We revised the impact ionization rate of the diamond for adjusting the parallel-plane breakdown field at 10 MV/cm. Effects of the field plate on the breakdown voltage was also analyzed. A conventional diamond Schottky barrier diode without field plate exhibited the high forward current of 0.52 A/mm and low on-resistance of $1.71{\Omega}-mm$ at the forward voltage of 2 V. The simulated breakdown field of the conventional device was 13.3 MV/cm. The breakdown voltage of the conventional device and proposed devices with the $SiO_2$ passivation layer, anode field plate (AFP), and cathode field plate (CFP) was 680, 810, 810, and 1020 V, respectively. The AFP cannot alleviate the concentration of the electric field at the cathode edge. The CFP increased the breakdown voltage with evidences of the electric field and potential. However, we should consider the dielectric breakdown because the ideal breakdown field of the diamond is higher than that of the $SiO_2$, which is widely used as the passivation layer. The real breakdown voltage of the device with CFP decreased from 1020 to 565 V due to the dielectric breakdown.

• 조명전기설비학회논문지
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• 제13권4호
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• pp.87-95
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• 1999

새로운 종류의 고체상태 대전력, 고속전자장치 즉 광전도전력스위치(PCPS)의 가장 큰 문제점은 평균전계하의 표면에서 스위치 섬락의 대부분이 반도체의 벌크파괴보다 낮다는 것이다. 이러한 문제를 극복하고 고밀도 고체 전력 스위치에 사용할 수 있는 유일한 방법이 고체 절연물로 표면을 페시베이션(Passivation)하는 것이다. 본 실험에서 Silicon의 절연내력은 진공중에서 10[kV/cm]에서 심하게 열화되어졌고, 기중에서 30[kV/cm], SF6에서 80∼90[kV/cm]으로 개선되지만, 스위치의 주 응용이 진공 또는 우주에서 사용되기 때문에 이러한 현상은 매우 심각한 문제이다. 페시베이션후 소자들은 진공과 기중에서 언페시베이션된 소자가 SF6내에서 얻을 수 있는 만큼의 높은 파괴값을 가졌다. 이러한 결과로 볼 때 페시베이션된 소자들이 매우 우수한 파괴값을 가진다는 것을 알 수 있다. 본 논문은 고전계 하에서 페시베이션 전·후 실리콘 파괴의 주 특성과 메커니즘에 대해 밝혔다.