• The Journal of Korean Academy of Prosthodontics
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• v.31 no.3
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• pp.423-446
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• 1993

Titanium and its alloys are finding increasing use in medical devices and dental implants. The strong selling point of titanium is its resistance to the highly corrosive body fluids in which an implant must survive. This corrosion resistance is due to a tenacious passive oxide or film which exists on the metal's surface and renders it passive. Potentiodynamic polarization measurement is one of the most commonly used electro-chemical methods that have been applied to measure corrosion rates. And the potentiodynamic polarization test supplies detailed information such as open circuit, rupture, and passivation potential. Furthermore, it indicates the passive range and sensitivity to pitting corrosion. This study was designed to compare the corrosion resistance of the commonly used dental implant materials such as CP Ti, Ti-6A1-4V, Co-Cr-Mo alloy, and 316L stainless steel. And the effects of galvanic couples between titanium and the dental alloys were assessed for their useful-ness-as. materials for superstructure. The working electrode is the specimen , the reference electrode is a saturated calomel electrode (SCE), and the counter electrode is made of carbon. In $N_2-saturated$ 0.9% NaCl solutions, the potential scanning was performed starting from -800mV (SCE) and the scan rate was 1 mV/sec. At least three different polarization measurements were carried out for each material on separate specimen. The galvanic corrosion measurements were conducted in the zero-shunt ammeter with an implant supraconstruction surface ratio of 1:1. The contact current density was recorded over a 24-hour period. The results were as follows : 1. In potential-time curve, all specimens became increasingly more noble after immersion in the test solution and reached between -70mV and 50mV (SCE) respectively after 12 hours. 2. The Ti and Ti alloy in the saline solution were most resistant to corrosion. They showed the typical passive behavior which was exhibited over the entire experimental range. Therefore no breakdown potentials were observed. 3. Comparing the rupture potentials, Ti and Ti alloy had the high(:st value (because their break-down potentials were not observed in this study potential range ) followed by Co-Cr-Mo alloy and stainless steel (316L). So , the corrosion resistance of titanium was cecellent, Co-Cr-Mo alloy slightly inferior and stainless steel (316L) much less. 4. The contact current density sinks faster than any other galvanic couple in the case of Ti/gold alloy. 5. Ag-Pd alloy coupled with Ti yielded high current density in the early stage. Furthermore, Ti became anodic. 6. Ti/Ni-Cr alloy showed a relatively high galvanic current and a tendency to increase.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.12
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• pp.1063-1069
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• 2012

In present paper, we used magnesium alloy having a lower density and higher electrical conductivity for bipolar plate to reduce the weight of PEM fuel cell. The silver was coated to prevent corrosion and form passivation film on the metal surface with sputtering. In acid proof evaluation for setting optimal coating conditions, the homogeneity of coating thickness was improved by coating with the thickness of 3 ${\mu}m$ which not indicated any micro cracks and the temperature $180^{\circ}C$. The performance test and evaluation based on the clamping pressure and channel depth to determine the configuration of bipolar plate for assembling single cell was implemented. And then we assembled single cell with this bipolar plate and implemented the performance test to ensure and compare the current-voltage performance followed as several factors such as coating or non-coating, the change of clamping pressure, the change of channel depth, etc. As these results, the maximum power density of single cell with the coated bipolar plate was 192 $mW/cm^2$ and it was confirmed that the power density per unit mass was better than existing metal bipolar plate.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.452-452
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• 2010

차세대 디스플레이로서 주목 받고 있는 유연성 정보표시 소자 개발에 대한 요구도가 날로 증대되고 있다. 유연성 정보표시 소자로서 플라스틱 기반 유연성 소자가 특히 주목 받고 있으나, 이의 실용화를 위해서는 플라스틱 기판에 적용 가능한 보호막 형성 기술 개발이 선행되어야 한다. 플라스틱 필름의 경우 높은 산소 및 수분 투과율 때문에 유연성 디스플레이의 응용에 걸림돌이 되고 있다. 플라스틱 기반 유연성 소자의 장수명화를 위해서는 수분과 산소의 투과를 방지하는 passivation layer 형성 기술이 필수적으로 요구된다. 본 연구에서는, polyethylene terephethalate (PET) 기판상에 증착된 $SiO_x$ 보호막의 합성에 있어서 중간층 유무에 따른 투습특성의 변화를 살펴보았다. 기화된 HMDSO (Hexamethyldisiloxane)와 Ar 및 $O_2$ 혼합기체를 이용하여 PECVD 방법으로 $SiO_x$ 박막을 합성하였다. 15 nm 두께의 $Al_2O_3$를 중간층으로 사용하여 중간층 유무에 따른 초기성장 거동 변화가 $SiO_x$ 박막의 투습 특성에 미치는 영향을 조사하였다. $SiO_x$ 박막 구조와 화학적 조성은 각각 FE-SEM과 FT-IR을 이용하여 분석하였으며, AFM을 이용하여 $SiO_x$ 박막 표면 미세 형상을 관찰하였다. 투습률은 MOCON사(社)의 Permatran-W 3/33 MA을 이용하여 측정하였다. 그리고 반복 굽힘 시험기를 이용하여 $SiO_x$ 보호막의 동적 투습 특성을 조사하였다. $Al_2O_3$ 중간층 유무에 따라 $SiO_x$ 박막의 투습률 (WVTR; water vapor transmission rate)은 ${\sim}10^{-1}g/m^2/day$(300 nm-thick $SiO_x$/PET)에서 ${\sim}5{\times}10^{-3}g/m^2/day$(300 nm-thick $SiO_x$/15 nm-thick $Al_2O_3$/PET)으로 변화하였다. 300 nm-thick $SiO_x$/15 nm-thick $Al_2O_3$/PET 시편의 경우 곡지름 50 mm에서 1,000회 반복 굽힘 후에도 투습률 변화를 보이지 않았다. 이와 같은 $SiO_x$ 박막의 투습 특성 변화는 $Al_2O_3$ 중간층 유무에 따른 초기 성장 거동의 변화로 해석된다. FE-SEM 및 AFM 표면 미세 구조 관찰을 통한 초기 성장 거동 변화 조사 결과, $Al_2O_3$ 중간층 없이 PET 기판위에 $SiO_x$ 박막 증착한 경우 3 차원 성장을 하는 반면, PET기판위에 $Al_2O_3$ 중간층 형성 후 $SiO_x$ 박막 증착하는 경우 2 차원 성장을 하게 됨을 관찰하였다. 따라서 본 연구를 통하여, 플라스틱 기반 유연성 표시 소자에 적용하기 위한 $SiO_x$ 보호막 합성 에 있어서 초기 성장 거동의 변화가 투습 특성에 민감한 영향을 미침을 알 수 있었다.

• Applied Chemistry for Engineering
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• v.32 no.6
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• pp.664-670
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• 2021

Stainless steel was applied as bipolar plate (BP) of polymer electrolyte membrane fuel cell (PEMFC) due to high mechanical strength, electrical conductivity, and good machinability. However, stainless steel was corroded and increased contact resistance resulting PEMFC performance decrease. Although the corrosion resistance could be improved by surface treatment such as noble metal coating, there is a disadvantage of cost increase. The stainless steel corrosion behavior and passive layer influence on PEMFC performance should be studied to improve durability and economics of metal bipolar plate. In this study, SUS316L bipolar plate of 25 cm² active area was manufactured, and experiments were conducted for corrosion behavior at an anode and cathode. The influence of SUS316L BP corrosion on fuel cell performance was measured using the polarization curve, impedance, and contact resistance. The metal ion concentration in drained water was analyzed during fuel cell operation with SUS316L BP. It was confirmed that the corrosion occurs more severely at the anode than at the cathode for SUS316L BP. The contact resistance was increased due to the passivation of SUS316L during fuel cell operation, and metal ions continuously dissolved even after the passive layer formation.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.