• Title/Summary/Keyword: Particle deposition

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Effect of Dry Deposition on Water Quality -The comparison of several methodologies for estimating dry deposition flux (수질에 대한 대기건식침적의 영향 - 건식침적량 추정 방법론의 비교를 중심으로)

  • Cheong, Jang-Pyo
    • Journal of Korean Society of Water and Wastewater
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    • v.22 no.1
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    • pp.159-168
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    • 2008
  • A special field experiment has been carried out from March 2001 to June 2001 at the Changhowon in Kyunggi to investigate a better methodology for the estimation of dry deposition of pollutions applicable in Korea. In this study, dry deposition plate was used to measure of total and water soluble acidic mass fluxes, and CPRI(Coarse Particle Rotary Impactor), CI(Cascade Impactor) were also used to measure ambient concentrations in various particle size ranges. Sehmel-Hodgson model was used to estimate dry depostion velocity and Weibull probability distribution function was applied to get generalized particle size distribution for the size fractioned concentration data sampled by CPRI and CI. Atmospheric dry deposition fluxes of mass and ionic matters estimated by the various techniques(one-step, multi-step, equi-concentration, subdivision for only the coarse particle range, applying Weibull distribution function, etc.) were compared to flux data sampled by DDP. It was found out that the deposition fluxes estimation methodology calculated by the each particle size range devided by particle size distribution characteristics and the rapidly changed points of deposition velocity using Weibull probability distribution function was the most applicable.

Analysis on Particle Deposition on a Heated Rotating Disk (가열되는 회전원판으로의 입자 침착 해석)

  • Yu, Gyeong-Hun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.2
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    • pp.245-252
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    • 2002
  • Numerical analysis was conducted to characterize particle deposition on a horizontal rotating disk with thermophorectic effect under laminar flow field. The particle transport mechanisms considered were convection, Brownian diffusion, gravitational settling and thermophoresis. The averaged particle deposition velocities and their radial distributions for the upper surface of the disk were calculated from the particle concentration equation in a Eulerian frame of reference for rotating speeds of 0∼1000rpm and temperature differences of 0∼5K. It was observed from the numerical results that the rotation effect of disk increased the averaged deposition velocities, and enhanced the uniformity of local deposition velocities on the upper surface compared with those of the disk at rest. It was also shown that the heating of the disk with ΔT=5K decreased deposition velocity over a fairly broad range of particle sizes. Finally, an approximate deposition velocity model for the rotating disk was suggested. The comparison of the present numerical results with the results of the approximate model and the available experimental results showed relatively good agreement between them.

Gas/Particle Level and Dry Deposition Flux of Atmospheric PCBs

  • Yeo, Hyun-Gu;Park, Ki-Chul
    • Journal of Environmental Health Sciences
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    • v.29 no.4
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    • pp.10-16
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    • 2003
  • Atmospheric samples were conducted from September 2001 to July 2002 with GPS-l PUF sampler in rural site to concentration distributions of gas/particle PCBs and to calculate dry deposition flux of PCBs. $\Sigma$PCBs concentrations of gas/particle PCBs were 59.29$\pm$48.83, 6.56$\pm$6.59 pg/㎥, respectively. Gas contribution (%) of total PCBs (gas + particle) was 90% which existed gas phase in the atmosphere. The particle contribution (%) of PCB congeners increased relatively more of the less volatile congeners with the highest chlorine number. The correlation coefficients (r) between total PCBs and temperature ($^{\circ}C$) showed negative correlation in - 0.62 (p<0.0l) for particle phase, positive correlation in 0.63 (p<0.01) for gas phase. In other word, particle phase PCBs is enriched in colder weather which could be due to greater in corporation of condensed gas phase at low temperature. The calculated dry deposition of total PCBs (gas + particle) was 0.008, 0.008 $\mu\textrm{g}$ $m^{-2}$ da $y^{-l}$ which showed maximum dry deposition flux in December, minimum data in July Bs in the atmosphere. The calculated dry deposition fluxes of total PCBs were influenced by particle phase PCBs even though PCBs in the atmosphere were present primarily in the gas phase.e.

Experimental Study on Thermophoretic Particle Deposition for an Agglomerated and Non-Agglomerated Particles (입자의 형상에 따른 열영동 영향에 대한 실험적 연구)

  • Choi, Gwang-Yul;Yoon, Jin-Uk;Ahn, Kang-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.7
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    • pp.741-746
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    • 2004
  • Agglomerated and non-agglomerated SiO$_2$ particles are synthesized in a furnace by oxidation of TEOS vapor. These polydispersed particles are classified with DMA to extract particles. Then these particles are introduced into a thermal precipitator through the ESP(Electrostatic Precipitator) to investigate the themophoretic particle deposition using CNCs(Condensation Nuclei Counter). The efficiency of themophoretic particle deposition according to agglomerated and non-agglomerated particles in the thermal precipitator has been studied as a function of particle size and TEOS mole concentration using monodisperse particles classified by DMA. The results show that the particle deposition efficiency decreases as TEOS mole concentration increases and particle size increases. Thereffre, it is concluded that the thermophoretic deposition efficiency is dependent of the particle morphology.

Analysis on Particle Deposition onto a Horizontal Semiconductor Wafer at Vacuum Environment (진공환경에서 수평 웨이퍼 표면으로의 입자침착 해석)

  • Yoo, Kyung-Hoon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.12
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    • pp.1715-1721
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    • 2002
  • Numerical analysis was conducted to characterize the gas flow field and particle deposition on a horizontal freestanding semiconductor wafer under the laminar flow field at vacuum environment. In order to calculate the properties of gas, the gas was assumed to obey the ideal gas law. The particle transport mechanisms considered were convection, Brownian diffusion and gravitational settling. The averaged particle deposition velocities and their radial distributions fnr the upper surface of the wafer were calculated from the particle concentration equation in an Eulerian frame of reference for system pressures of 1 mbar~1 atm and particle sizes of 2nm~10$^4$ nm(10 ${\mu}{\textrm}{m}$). It was observed that as the system pressure decreases, the boundary layer of gas flow becomes thicker and the deposition velocities are increased over the whole range of particle size. One thing to be noted here is that the deposition velocities are increased in the diffusion dominant particle size range with decreasing system pressure, whereas the thickness of the boundary layer is larger. This contradiction is attributed to the increase of particle mechanical mobility and the consequent increase of Brownian diffusion with decreasing the system pressure. The present numerical results showed good agreement with the results of the approximate model and the available experimental data.

Deposition of Polydisperse Particles in a Falkner-Skan Wedge Flow (포크너-스캔 경계층유동에서의 다분산 입자부착에 대한 연구)

  • 조장호;황정호;최만수
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.9
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    • pp.2342-2352
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    • 1995
  • Deposition of flame-synthesized silica particles onto a target is utilized in optical fiber preform fabrication processes. The particles are convected and deposited onto the target. Falkner-Skan wedge flow was chosen as the particle laden flow. Typically the particles are polydisperse in size and follow a lognormal size distribution. Brownian diffusion, thermophoresis, and coagulation of the particles were considered and effects of these phenomena on particle deposition were studied. A moment model was developed in order to predict the particle number density and the particle size distribution simultaneously. Particle deposition with various wedge configurations was examined for conditions selected for a typical VAD process. When coagulation was considered, mean particle size and its standard deviation increased and particle number density decreased, compared to the case without coagulation. These results proved the fact that coagulation effect expands particle size distribution. The results were discussed with characteristics of thermal and diffusion boundary layers. As the boundary layers grow in thickness, overall temperature and concentration gradients decrease, resulting in decrease of deposition rate and increase of particle residence time in the flow and thus coagulation effect.

Development of Particle Deposition System for Cleaning Process Evaluation in Semiconductor Fabrication (반도체 세정 공정 평가를 위한 나노입자 안착 시스템 개발)

  • Nam, Kyung-Tag;Kim, Ho-Joong;Kim, Tae-Sung
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.3168-3172
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    • 2007
  • As the minimum feature size decreases, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT and designed a particle deposition system which consists of scanning mobility particle sizer (SMPS) and deposition chamber. Charged monodisperse particles are generated using SMPS and deposited on the wafer by electrostatic force. The experimental results agreed with the simulation results well in terms of particle number and deposition area according to particle size, flow rate and deposition voltage.

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Three-dimensional analysis of the thermophoretic particle deposition in the OVD process (외부증착공정에서의 열영동에 의한 입자부착에 관한 3차원 해석)

  • Hong, Gi-Hyeok;Gang, Sin-Hyeong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.21 no.3
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    • pp.436-444
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    • 1997
  • Three-dimensional conjugate heat transfer and particle deposition on a circular cylinder in the OVD process are numerically investigated. Flow and temperature fields are obtained by an iterative method, and thermophoretic particle deposition is simulated. Effects of the heat conduction in the cylinder, the rotation speed of the cylinder, and the traversing speed of torch on the deposition are studied. Effects of variable properties are also included. As the conductivity of the cylinder decreases, particle deposition rate and deposition efficiency greatly decrease due to the reduced temperature gradient. The rotation of the cylinder has no significant effect on the deposition due to the small diameter of the cylinder and low speed of rotation. Since the increase of the torch speed keeps the surface low temperature, the particle deposition increases with the traversing speed.

Analysis of Particle Deposition onto a Heated or Cooled, Horizontal Free-Standing Wafer Surface (가열 또는 냉각되는 수평웨이퍼 표면으로의 입자침착에 관한 해석)

  • 유경훈;오명도;명현국
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.5
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    • pp.1319-1332
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    • 1995
  • Numerical analysis was performed to characterize the particle deposition behavior on a horizontal free-standing wafer with thermophoretic effect under the turbulent flow field. A low Reynolds number k-.epsilon. turbulence model was used to analyze the turbulent flow field around the wafer, and the temperature field for the calculation of the thermophoretic effect was predicted from the energy equation introducing the eddy diffusivity concept. The deposition mechanisms considered were convection, diffusion, sedimentation, turbulence and thermophoresis. For both the upper and lower surfaces of the wafer, the averaged particle deposition velocities and their radial distributions were calculated and compared with the laminar flow results and available experimental data. It was shown by the calculated averaged particle deposition velocities on the upper surface of the wafer that the deposition-free zone, where the deposition velocite is lower than 10$^{-5}$ cm/s, exists between 0.096 .mu.m and 1.6 .mu.m through the influence of thermophoresis with positive temperature difference of 10 K between the wafer and the ambient air. As for the calsulated local deposition velocities, for small particle sizes d$_{p}$<0.05 .mu.m, the deposition velocity is higher at the center of the wafer than at the wafer edge, whereas for particle size of d$_{p}$ = 2.0 .mu.m the deposition takes place mainly on the inside area of the wafer. Finally, an approximate model for calculating the deposition velocities was recommended and the calculated deposition velocity results were compared with the present numerical solutions, those of Schmidt et al.'s model and the experimental data of Opiolka et al.. It is shown by the comparison that the results of the recommended model agree better with the numerical solutions and Opiolka et al.'s data than those of Schmidt's simple model.

Simulation of the Particle Deposition on a Circular Cylinder in High-Temperature Particle-Laden Flow (원형 실린더 주위의 고온 유동에서 입자의 부착 해석)

  • Jeong, Seok-min;Kim, Dongjoo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.2
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    • pp.73-81
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    • 2019
  • Numerical simulations are performed for the thermal fluid flow around a circular cylinder, and the particle trajectories are calculated to investigate the particle motions and deposition characteristics. We aim to understand the effects of three important parameters (particle Stokes number, temperature difference in the flow and on the cylinder surface, and thermal conductivity ratio between the fluid and the particles) on the deposition efficiency. The results show that the thermophorectic effect is insignificant for particles with large Stokes numbers, but it affects particles with small Stokes numbers. The deposition efficiency increases with the increase in temperature difference between the flow and the cylinder or the decrease in ratio of thermal conductivity of the particles to the fluid. When thermophoresis becomes significant, the particles are deposited even on the back side of the cylinder.