Development of rapid mold heating & cooling technology to remove weldline on surface appearance in telephone case (전화기 케이스 외관의 Weldline 제거를 위한 금형 급속 가열-냉각 기술 개발)
-
- Proceedings of the Korean Society for Technology of Plasticity Conference
- /
- 2008.10a
- /
- pp.439-443
- /
- 2008