Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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A Study on Thermal Performance of Cooling System for a Laptop Computer Using a Cold Plate

Cold plate를 이용한 휴대용 컴퓨터 냉각 시스템의 열성능에 관한 연구

  • 박상희 (금오공과대학교 기계공학부) ;
  • 조남해 (금오공과대학교 대학원 기계공학과) ;
  • 최성대 (금오공과대학교 기계공학부)
  • Received : 2009.10.26
  • Accepted : 2009.12.15
  • Published : 2009.12.30
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Abstract

This study investigates two-phase cooling system of close-loop by using FC-72 and PCM(Phase change material). The cooling system consists of evaporator, cold plate, micro pump, and condenser. The heat input on the performance of evaporator is appreciated by visualizing the boiling on the evaporator. The heat performance of cooling system is investigated to determine the effects of volume fill ratio change at working fluid, pump flow rate change, and volume fill ratio change at PCM in cold plate. Experimental results show the ideal condition when the volume ratio of working fluid, the pump flowing, and the volume ratio of PCM are 60%, 6ml/min, and 60% respectively.

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References

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