• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.103-106
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• 1999

In this paper, we suggest the FED packaging technology that have 4mm thickness, using sodalime glass-to-sodalime glass electrostatic bonding. It based on conventional silicon-glass bonding. The silicon film was deposited an around the exhausting hole on FED backside panel. And then, the silicon film of panel was successfully bonded with capping(bare) glass in vacuum environment and the FED panel was vacuum-sealed. In this method, we could achieve more 153 times increased conductance and 200 times increased vacuum efficiency than conventional tube packaging method. The vacuum level in panel, by SRG test, was maintained about low 10$_{-4}$ Torr during above two months And, the light emission was observed to 0.7-inch tubeless packaged FED. Then anode current was 34 $\mu$ A. Emission stability was constantly measured for 10 days.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.1
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• pp.1-6
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• 2009

The impact absorption materials made of synthetic organic chemical product like Expanded Polystyrene(EPS), Expanded Polyethylene(EPE), Expanded Polyurethane(EPU), etc. have been used with general packaging material until the present. But nowadays, the use of these materials is intended to be decreased and to be recycled in connection with environmental pollution. In addition, it has been tried to substitute these materials with non-pollution materials(natural materials) like pulp mould, paper protectors, etc. At the same time, it is required to evaluate and analyze these cushioning materials for cushioning properties based on impact and vibration, in order to make an efficiency on the overall packaging system because they are generally being used by a random choice regardless of the properties of contents and cushioning materials. Therefore, this study provides analyzed data on cushioning properties of various cushioning materials against impact and vibration, and is intended to provide more efficient model for packaging system by minimizing their using amount through choosing an optimal cushioning material as well as intended to lead to the use of nonpollution materials in case these cushioning materials have same cushioning properties.

• International Journal of Advanced Culture Technology
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• v.11 no.3
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• pp.163-171
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• 2023

A blind box is a kind of sales method in that you can only get the product information by opening the package. In 2019, blind box products began to grow rapidly in the Chinese market, and gradually formed a special "blind box economy". The particularity of blind box products is that driven by consumers' curiosity, consumers' purchasing behavior can be directly induced by the visual and tactile perception of commodity packaging. Therefore, it is necessary to explore the psychological needs of consumers and master the blind box packaging design elements under the influence of consumer psychology. This paper takes figurine blind box packaging elements as the research scope and Chinese blind box consumers as the research object. Through market research and literature study, We are designed to conduct a questionnaire survey and SPSS empirical study to find out the differences in the preferences of different consumer temperament types for blind box packaging, taking the characteristics of blind box products and consumer psychology as the relevant theoretical background. The research results show that among the blind box consumers, choleric type consumers predominate, the color of the blind box packaging presents red, orange, and yellow preference, and the material presents metal, and plastic preference. The shape of the blind box shows a preference for special shape.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.30-41
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• 2023

With the aggressive down-scaling of advanced integrated circuits (ICs), electronic packages have become the bottleneck of both reliability and performance of whole electronic systems. In order to resolve the reliability issues, Institute of Electrical and Electronics Engineers (IEEE) laid down a roadmap on fault detection and diagnosis (FDD), thrusting the digital twin: a combination of reliability physics and artificial intelligence (AI). In this paper, we especially review research works regarding the signal-based FDD approaches on the electronic packages. We also discuss the research trend of FDD utilizing AI techniques.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.976-980
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• 2002

This paper repors on low temperature sealing process of PDP using binder and capping glass. The exhausting hole on rear glass of PDP was sealed by capping glass using screen-printed binder without exhausting glass tube. Based on the tubeless packaging process, out gassing problem could be reduced and vacuum conductance could be improved by eliminating exhaust tube.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.3
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• pp.119-125
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• 2016

Fresh-cut agricultural products provide convenience to consumers. However, quality changes or microbial growth can easily occur due to physical changes such as cutting and peeling etc. during processing. Therefore, efforts have been made to develop a functional packaging for extension of shelf life of fresh-cut agricultural products, food etc., and researches on prolongation of storage period have been actively developed. The shelf life is extended by antimicrobial, far infrared rays, air permeability, anti-fogging, weak current, ethylene gas adsorption or decomposition, gas composition changes such as MA (Modified Atmosphere) or CA (Controlled Atmosphere). The method of extending the shelf life by various complex factors. This paper based on the published literature to extend the shelf life of fresh-cut agricultural products, food etc., The paper has summarized the storage period extension packing method, packaging material for shelf life extension and comprehensive evaluation method.

• Membrane Journal
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• v.25 no.2
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• pp.85-98
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• 2015

A global trend of replacing metal or glass containers with polymer-based packaging materials has been prevalent in the food packaging industry due to their ease in processibility, excellent transparency, and good cost efficiency. Barrier polymers tend to show low permeabilities for atmospheric gases such as oxygen, carbon dioxide, and water vapor, which allow them to be utilized in the food and beverage packaging industry. With the current global trend, expansion of polymeric packaging materials to new markets such as oxygen sensitive juices, flavored water, and energy drinks requires improved $CO_2$ and $O_2$ barrier properties. The improvement of the existing polymer-based barrier platform will enable a rapid market impact. In this paper, the current barrier technologies such as (1) antiplasticization-induced barrier materials, (2) synergistic effect of antiplasticization and crystallization, (3) new barrier polymers, (4) nanocomposite materials, and (5) polymer blending are introduced with their characterization techniques for the development of advanced packaging materials.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.3
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• pp.153-161
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• 2023

The worldwide effects of COVID-19 have led to a surge in online shopping and contactless services. The consumption pattern has caused the issues such as the environmental pollution together with the increase of plastic waste. Reducing the reliance on the petroleum based plastic use for the package and replacing it with environmentally friendly material are the simple ways in order to solve those problems. Paper is an eco-friendly product with high recyclability as the food packaging materials but has still poor barrier properties. A barrier coating on surface of the paper can be achieved with the proper packaging materials featuring water, gas and grease barrier. Polyethylene (PE) or polypropylene (PP) coatings which are generally laminated or coated to paper are widely used in food packaging applications to protect products from moisture and provide water or grease resistance. However, recycling of packaging containing PE or PP matrix is limited and costly because those films are difficult to degrade in the environment. This study investigated the recyclability of modified acrylic emulsion coating papers compared to PE and PP polymer matrixes as well as their mechanical and gas barrier properties. The results showed that PE or modified acrylic emulsion coated papers had better mechanical properties compared to the uncoated paper as a control. PE or PP coating papers showed strong oil resistance property, achieving a kit rating of 12. Those papers also had a significantly higher percentage of screen reject during the recycling process than modified acrylic coated paper which had a screen rejection rate of 6.25%. In addition an uncoated paper had similar value of a screen rejection rate. It may suggest that modified acrylic emulsion coating paper can be more easily recycled than PE or PP coating papers. The overall results of the study found that modified acrylic emulsion coating paper would be a viable alternative to suggest a possible solution to an environmental problem as well as enhancing the weak mechanical and poor gas barrier properties of the paper against moisture.