통합 검색 | Korea Science

Bauer, Charles E.
- 한국마이크로전자및패키징학회:학술대회논문집
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- 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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- pp.1-7
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- 2001
This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.
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Zuo, Li;Seog, Eun-Ju;Lee, Jun-Ho;Rhim, Jong-Whan
- 펄프종이기술
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- 제38권5호
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- pp.66-73
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- 2006
The effects of active packaging on the surface stiffness, mass, volume, density and weight changes of fresh as well as stored eggplant were studied at 11 and $25^{\circ}C$ for 10 days with active packaging material Type 1 and 2 and control. Mass, volume, and surface stiffness of eggplant decreased linearly throughout the storage period regardless of storage conditions; while the mass density showed a reverse trend in the ease of $11^{\circ}C$ storage. Reduction rate of mass, mass density and weight was observed minimum at $25^{\circ}C$ storage temperature with active packaging Type 1. The weight of eggplant decreased at a higher rate in the initial 4 days compared to that in the later period of storage regardless of storage temperature and type of packaging.
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