• Title/Summary/Keyword: Pad Force

검색결과 240건 처리시간 0.021초

CMP에서 패드 그루브의 채수가 연마특성에 미치는 영향 (The Effect of Pad Groove Dimension on Polishing Performance in CMP)

  • 박기현;김형재;정영석;정해도;박재홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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    • pp.1308-1311
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    • 2004
  • It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.

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낙상충격 보호패드의 개발 및 평가 (Development and Evaluation of Fall Impact Protection Pad)

  • 박정현;이진숙;이정란
    • 한국의류산업학회지
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    • 제20권4호
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    • pp.422-428
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    • 2018
  • In this study, we developed honeycomb pads using foam and polymer gel and verified the impact protection performance of pads for the development of a fall protection pants for elderly women aged 65 and over who have a high risk of fracture due to falls. The results are as follows; In the first experiment, the impact protection performance was evaluated for four honeycomb pad samples (CR foam, EPDM foam, hardness 15 polymer gel, and hardness 30 polymer gel) manufactured to a thickness of 5 mm using a single material. When the force of about 10757N was applied to the specimens, all four pads reduced the impact force to 3100N or less. Polymer gels showed better protection than foam materials. In the second experiment, the thickness of the protective pad was set to 8 mm in order to improve the shock absorbing performance of the protective pad. As a result of evaluating the impact protection performance of the foam single pad and foam gel composite pad, the impact absorbing performance of the foam single pad was better. Finally, four kinds of protection pads were made by assigning the foam single pad and the foam gel composite pad to pants type and underwear type respectively. The pad thickness of the main protection area was set to 8 mm to enhance the protection, and gradually decreased to 5mm and 3mm toward the edge to improve the appearance and fit.

패드식 피스톤의 특성 해석에 관한 연구 (Analysis of the Characteristics of the Low Friction Pad Type Piston)

  • 김청균;김희붕
    • Tribology and Lubricants
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    • 제9권2호
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    • pp.70-78
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    • 1993
  • Using the finite element method, the film pressure, the transverse force and the firction torque which are distributed over the pad surface of low-friction piston skirt are calculated in order to investigate the dynamic characteristics of the piston. The results indicate that the frictional torque for the low-friction piston pad may increase 3% efficiency in comparison th the conventional one.

공기윤활 구면틸팅패드베어링에 대한 연구 (A Study on Air-Lubricated Spherical Tilting Pad Bearings)

  • 김성국;김경웅
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 1998년도 제28회 추계학술대회
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    • pp.160-165
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    • 1998
  • A theoretical analysis has been undertaken to show the influence of bearing geometry on the steady state characteristics of air lubricated spherical tilting pad bearings. The geometry variations considered are the number of pads, the eccentricity ratio, the direction of load, and the preloading.

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Measurement of Cohesion Force between Diamond and Matrix in CMP Pad Conditioner

  • Kang, Seung-Koo;Song, Min-Seok;Jee, Won-Ho
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1128-1129
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    • 2006
  • Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond cohesion. Strong cohesion between diamond and metal matrix prevents macro scratch on the wafer during CMP Process. Typically the diamond tool has been manufactured by sintered, brazed and electro-plated methods. In this paper, some results will be reported of cohesion between diamond and metal matrix of the diamond tools prepared by three different manufacturing methods. The cohesion force of brazed diamond tool is found stronger than the others. This cohesion force is increased in reverse proportion to the contact area of diamond and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of Cr in metal matrix and C in diamond, which enhance the interfacial cohesion strength between diamonds and metal matrix.

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실리콘 연마에서 패드 버핑 공정이 연마특성에 미치는 영향 (Effect of Pad Buffing process on Material Removal Characteristics in Silicon Chemical Mechanical Polishing)

  • 박기현;정해도;박재홍;마사하루키노시타
    • 한국전기전자재료학회논문지
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    • 제20권4호
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    • pp.303-307
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    • 2007
  • This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

Brake-by-Wire 시스템을 위한 강인한 휠 슬립 제어 (Robust Wheel Slip Control for Brake-by-Wire System)

  • 홍대건;허건수;강형진;윤팔주;황인용
    • 한국자동차공학회논문집
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    • 제13권3호
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    • pp.102-109
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    • 2005
  • Wheel-slip control systems are able to control the braking force more accurately and can be adapted to different vehicles more easily than conventional ABS systems. But, in order to achieve the superior braking performance through the wheel-slip control, real-time information such as the tire braking force is required. For example, in the case of EHB (Electro-Hydraulic Brake) systems, the tire braking force cannot be measured directly, but can be approximated based on the characteristics of the brake disk-pad friction. The friction characteristics can change significantly depending on aging of the brake, moisture on the contact area, heat etc. In this paper, a wheel slip The proposed wheel slip control system is composed of two subsystems: braking force monitor and robust slip controller In the brake force monitor subsystem, the tire braking forces as well as the brake disk-pad friction coefficient are estimated considering the friction variation between the brake pad and disk. The robust wheel slip control subsystem is designed based on sliding mode control methods and follows the target wheel-slip using the estimated tire braking forces. The proposed sliding mode controller is robust to the uncertainties in estimating the braking force and brake disk-pad friction. The performance of the proposed wheel-slip control system is evaluated in various simulations.

FSR로 구성된 촉각 센서 패드용 Readout 회로의 설계 및 구현 (Design and Implementation of a Readout Circuit for a Tactile Sensor Pad Based on Force Sensing Resistors)

  • 윤선호;백승희;김청월
    • 센서학회지
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    • 제26권5호
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    • pp.331-337
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    • 2017
  • A readout circuit for a tactile sensor pad based on force sensing resistors was proposed, which was composed of an analog signal conditioning circuit and a digital circuit with a microcontroller. The conventional signal conditioning circuit has a dc offset voltage in the output signal, which results from the reference voltage applied to the FSR devices. The offset voltage reduces the dynamic range of the circuit and makes it difficult to operate the circuit under a low voltage power supply. In the proposed signal conditioning circuit, the dc offset voltage was removed completely. The microcontroller with A/D converter and D/A converter was used to enlarge the measurement range of pressure. For this, the microcontroller adjusts the FSR reference voltage according to the resistance magnitude of FSR under pressure. The operation of the proposed readout circuit which was connected to a tactile sensor pad with $5{\times}10$ FSR array was verified experimentally. The experimental results show the proposed readout circuit has the wider measurement range of pressure than the conventional circuit. The proposed circuit is suitable for low voltage and low power applications.

고무코어패드와 강재이력감쇠장치를 결합한 복합감쇠장치의 이력특성에 관한 연구 (A Study on Characteristics of Hybrid Damping Device Combining Rubber Core Pad and Hysteretic Steel Slit)

  • 박병태;이준호
    • 한국공간구조학회논문집
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    • 제23권1호
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    • pp.45-52
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    • 2023
  • This study proposes an RCS composite damping device that can achieve seismic reinforcement of existing buildings by dissipating energy by inelastic deformation. A series of experiments assessing the performances of the rubber core pad, hysteretic steel slit damping device, and hybrid RCS damping device were conducted. The results showed that the ratios of the deviations to the mean values satisfied the domestic damping-device conformity condition for the load at maximum device displacement in each direction, at the maximum force and minimum force at zero displacement, as well as the hysteresis curve area. In addition, three analysis models based on load-displacement characteristics were proposed for application to seismic reinforcement design. In addition, the validity of the three proposed models was confirmed, as they simulated the experimental results well. Meanwhile, as the shear deformation of the rubber-core pad increased, the hysteretic behavior of super-elasticity greatly increased the horizontal force of the damping device. Therefore, limiting the allowable displacement during design is deemed to be necessary.

로드셀을 이용한 컬링 스위핑 힘 측정 장치 개발 (Development of a force measurement device for curling sweeping with load cells)

  • 이상철;김태완;길세기;최상협
    • 한국융합학회논문지
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    • 제8권11호
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    • pp.49-56
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    • 2017
  • 컬링 스위핑 동작은 컬링 스톤의 위치를 조절하는 중요한 동작 중 하나이며, 스위핑 속도와 브룸 패드에 가해지는 힘이 중요한 연구 대상이다. 본 연구에서는 컬링 스위핑 동작에서 컬링 브룸 패드에 가해지는 힘을 측정할 수 있는 장비를 개발하였으며, 두 개의 로드셀을 브룸 패드와 패드 홀더 사이에 장착하는 구조를 이용하였다. 로드셀에서 발생되는 아날로그 신호는 마이크로 제어기를 이용하여 초당 약 300회의 속도로 샘플링을 수행한 후 10 bit 디지털 신호로 변환하였다. 3개의 M1 급 분동을 이용하여 로드셀의 교정과 측정된 전기 신호를 질량(힘)으로 환산하는 회귀 방정식을 추출하였으며, 브룸의 무게 증가를 최소화하기 위해서 웨어러블 장비로 구성하였다. 스포츠 분야에서 힘 측정 시 기준 장비로 사용하는 지면 반력기와 개발된 장비에 동일한 힘을 가하면서 측정된 측정값 차이는 약 $0.909{\pm}1.375N$ (평균과 표준 편차)로 측정되었다. 개발된 장비는 스위핑 동작과 유사한 힘 측정을 필요로 하는 다른 종류의 연구에도 적용이 가능할 것으로 판단된다.