• Title/Summary/Keyword: Packaging printing

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Comparison of analytical method of headspace and tenax analysis for residue of solvent amounts on plastic packaging materials (Headspace 방법과 tenax 방법을 이용한 잔존 용제 분석 방법의 비교)

  • An, Duek-Jun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.10 no.1
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    • pp.63-68
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    • 2004

  • The regulations for migration amounts in USA, EU and Korea are investigated to compare the actual overall and specific migration date from plastic food packaging materials. Among the packaging materials regulated in above countries, printing ink solvents on packaging materials is used very widely and sometimes cause off-flavor in the food by migration of residual solvents. Even though migration of the residual solvents dose not generally cause safety problems in the contained food, it certainly can generate off-flavor and finally deteriorate quality of the finished product. Therefore regulation and development of analytical method for amount of residual ink solvents are very important issue in food industry. The headspace analytical method and tenax method for residual ink solvent on food packaging materials were evaluated from the accuracy, precise, swiftness and convenience of viewpoint. Headspace analytical method was selected and recommended for using in food industry field.

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Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes

  • Sharma, Ashutosh;Mallik, Sabuj;Ekere, Nduka N.;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.83-89
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    • 2014

  • Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

  • https://doi.org/10.6117/kmeps.2014.21.4.083 인용 PDF KSCI