• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.235-241
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• 2005

Incorporation of solid electrodes frequently involves plasma-based processing. The effect of plasma can influence the physical characteristics, depending on the magnitude in plasma. The undesired feature of plasma-induced damage should be prevented in characterizing the ultra-thin materials, such as ultra-thin films and organic monolayers. The current work at first proves the applicability of a liquid phase electrode in the electrical/dielectric properties through comparative work using Al and Hg on ultrathin $Al_2O_3$ films deposited through atomic layer deposition at low temperature: Two types of metals such as Aluminum (Al) and mercury (Hg) were used as electrodes in $Al_2O_3$ thin films in order to investigate the effect of electrode preparation on the current-voltage characteristics and impedance features as a function of thickness in $Al_2O_3$ film thickness. The success of Hg in $Al_2O_3$ thin films is applied to the AC and DC characterization of the organic monolayers obtained using the Langmuir-Blodgett method. From the DC current-voltage characteristics, the diode-like response is found to originate from the bulk response of the organic materials, evidenced by the fact and the capacitance is inversely related to the absolute thickness of organic layers.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.13-17
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• 2014

The direct-patternable $SnO_2$ thin film was successfully fabricated by photochemical metal-organic deposition. The composition and chemical bonding state of $SnO_2$ thin film were analyzed by using X-ray photoelectron spectroscopy (XPS) from the surface to the interface with Si substrate. XPS depth profiling analysis allowed the determination of the atomic composition in $SnO_2$ film as a function of depth through the evolution of four elements of C 1s, Si 2p, Sn 3d, and O 1s core level peaks. At the top surface, nearly stoichiometric $SnO_2$ composition (O/Sn ratio is 1.92.) was observed due to surface oxidation but deficiency of oxygen was increased to the interface of patterned $SnO_2/Si$ substrate where the O/Sn ratio was about 1.73~1.75 at the films. This O deficient state of the film may act as an n-type semiconductor and allow $SnO_2$ to be applied as a transparent electrode in optoelectronic applications.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2000.06a
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• pp.34-39
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• 2000

Today's size of production operations in the packaging paper sector I sconstantly increasing , featuring integral processing systems, high-speed paper machines, and the increased marketing of lower basis weight products. The risk factors involved in these large investments lie more than ever in the available furnish potential and ongoing requirements for further closure of water loops and lower operating costs. A comparison is drawn between recovered paper furnish mixtures used in European mills with regard to fibre properties, strength potential and contaminant content, Both the furnish situation and development trends in modern fluting and testliner machines are instigating concept changes in stock preparation, the approach flow as well as in process water and rejects technology. Developments are currently focussed for example on more efficient debris separation using fine slotted screening, optimized refining , more systematic process water management with loop separation and integral water clarification as well as more efficient removal of microstickies, fillers and fines through appropriate combination of rejects handling and water clarification processes. Product quality differentiation depends decisively on strength characteristics as a function of refining , fines removal , paper machine technology, and sizing . Maximum availability of today's high speed paper machines and , as a result, cost effective production can be ensured by optimum balancing of all subsystems with in the overall concept and by reliable control of problems with contaminants and deposits.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.91-98
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• 2015

In order to apply to stretchable electronics packaging, locally stiffness-variant stretchable substrates consisting of island structure were fabricated by combining two polydimethylsiloxane elastomers of different stiffnesses and their elastic moduli were characterized as a function of the width of the high-stiffness island. The low-stiffness substrate matrix and the embedded high-stiffness island of the stretchable substrate were formed by using Dragon Skin 10 of the elastic modulus of 0.09 MPa and Sylgard 184 of the elastic modulus of 2.15 MPa, respectively. A stretchable substrate was fabricated to be a configuration of 6.5-cm length, 0.4-cm thickness, and 2.5-cm width, in which a high-stiffness Sylgard 184 island, of 4-cm length, 0.2-cm thickness, and 0.5~1.5-cm width, was embedded. The elastic modulus of a stretchable substrate was increased from 0.09 MPa to 0.16 MPa by incorporating the Sylgard 184 island of 0.5-cm width to Dragon Skin 10 substrate matrix. The elastic modulus was further improved to 0.18 MPa and 0.2 MPa with increasing the Sylgard 184 island width to 1.0 cm and 1.5 cm, which were in good agreement with values estimated by combining the Voigt structure of isostrain and the Reuss structure of isostress.

• Archives of design research
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• v.14 no.2
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• pp.117-126
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• 2001

Dietary life is said to be consummated even to a phase of art from phase of survival, recognition, selection and preference. Dietary life, from a sheer earing, is now transforming itself into a joy, and therefore, function of foodstuff packaging demand diversification rather than a simple packaging. Recently, socio-economic environment is showing conspicuous changes in that there are increasing number of working couples nuclear family, old-age population, social activity and improvement of living standards. Such a change in the living environment has much impact on our dietary life. Particularly, an age when cake and cookies of western origin were all but strange is gradually phasing out, while it is deemed to be improper to overlook the fact that bread and cakes are solidifying their position as part of foodstuff meanies for on dietary life. Of cakes and cookies, cakes have come to enjoy a position whereby they are regarded as part of an imperative for family banquets, various get-together and birthday celebration, etc., with a significant improvement that caters to our taste vis-a-vis an stage of introduction of cakes. At the time when reined foreign bakeries, one after another , are contemplating to make an inroad into Korea, and when the distribution market is to be opened fully in July of 1993, Korea bakeries that have been building up their position within the domestic market are expected to face a considerable number of difficulties. Accordingly, under such circumstances of the time text we are in it is attempted in this study to map out measures that may contribute to the strengthening of the products of business enterprises and improvement of corporate image that may appeal to feeling and emotions of consumers packaging that could attain objectives, and package design planning that, as an important factor for playing its own share in the restoration of humanism that is being alienated, may appeal to consumer sensitivity, rather than packaging that is being utilized merely as tool designed for marketing

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.621-627
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• 2013

In order to apply eco-friendly poly(propylene carbonate) (PPC) into barrier packaging materials, six different PPC/exfoliated graphite (EFG) nanocomposite films with different EFG were successfully prepared by a solution blending method. Their water sorption behavior was gravimetrically investigated as a function of the EFG content and interpreted with respect to their chemical structure and morphology. The water sorption isotherms were reasonably well fitted by Fickian diffusion model, regardless of morphological heterogeneities. With increasing the EFG content, the diffusion coefficient and water uptake decreased from $12.5{\times}10^{-10}cm^2sec^{-1}$ to $7.2{\times}10^{-10}cm^2sec^{-1}$ and from 8.9 wt% to 4.2 wt%, respectively, which indicates that the moisture resistance capacity of PPC was greatly enhanced by incorporating EFG into PPC. The enhanced water barrier property of the PPC/EFG nanocomposite films with the high aspect ratio EFG makes them potential candidates for versatile packaging applications. However, to maximize the performance of the nanocomposite films, further researches are required to increase the compatibility of EFG in the PPC matrix.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.610-616
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• 2011

A series of polyurethane acrylate/ZnO (PUA/ZnO) nanocomposite films with different ZnO contents were successfully prepared via a UV-curing system. The synthesis and physical properties including morphological structure, thermal properties, barrier properties and optical properties, and antimicrobial properties were investigated as a function of ZnO concentration. FTIR and SEM results showed that these PUA/ZnO nanocomposite films did not have a strong interaction between PUA and ZnO, which may lead to no increase in thermal stability. By incorporating ZnO nanoparticles, the UV blocking and antibacterial properties increased as the content of ZnO increased. Specially, the oxygen permeability in composite films changed from $2005cc/m^2/day$ to $150cc/m^2/day$ by adding the ZnO nanoparticle, which indicates that the PUA/ZnO nanocomposite films can be applied as good barrier packaging materials. Physical properties of the UV-cured PUA/ZnO nanocomposite film are strongly dependent upon the dispersion state of ZnO nanoparticles and their morphology in the films.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1587_1588
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• 2009

In this paper, PCB embedded balanced-to-unbalamced duplexer using coupled LC resonator was introduced for low cost dualband WiMax front-end-module application. In order to obtain the function of bandpass filter and balun transformer, proposed duplexer was configured by using magnetically coupled LC resonator. Out-of-band suppression was enhanced by applying two m-Derived transform circuits to obtain transmission zeros at 2GHz and 4.8GHz. In order to reduce the size of embedded duplexer, BaSrTiO3 (BST) composite high Dk RCC film was applied to improve the capacitance density. This high Dk film provided the capacitance density of 12.2 pF/mm2. The simulation results shows that fabricated duplexer had an insertion loss of 2.9dB and 5.5dB and return loss of 15dB and 16dB for 2.5GHz~2.6GHz and 3.5GHz~3.6GHz, respectively. The maximum magnitude and phase imbalance were 0.01dB and 0.17dB, and 1degree and 2degree in its passband, respectively. The out-of-band suppression was observed approximately 29dB and 40dB below 1.9GHz and over 4.5GHz, respectively. It has a volume of 6 mm $\times$ 7 mm $\times$ 0.7 mm (height).

• Toxicological Research
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• v.17
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• pp.157-166
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• 2001

Almost all currently available retroviral vectors based on murine leukemia virus (MLV) contain one or more viral coding sequences. Because these sequences are also present in the packaging genome, it has been suggested that homologous recombination may occur between the same nucleotide sequence in the packaging genome and the vector, resulting in the production of replication competent retrovirus (RCR). Up until now, it has been difficult to completely remove viral coding sequences since some were thought to be involved in the optimum function of the retroviral vector. For example, the gag coding sequence present in almost all available retroviral vectors has been believed to be necessary for efficient viral packaging, while the pol coding sequence present in the highly efficient vector MFG has been thought to be involved in achieving the high levels of gene expression. However, we have now developed a series of retroviral vectors that are absent of any retroviral coding sequences but produce even higher levels of gene expression without compromising viral titer. In these vectors, the intron and exon sequences from heterologous cellular or viral genes are present. When compared to the well known MLV-based vectors, some of these newly developed vectors have been shown to produce significantly higher levels of gene expression for a longer period. In an experimental system that can maximize the production of RCR, our newly constructed vectors produced an absence of RCR. These vectors should prove to be safer than other currently available retroviral vectors containing one or more viral coding sequences.