• Title/Summary/Keyword: Packaging function

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Study on scheme for screening, quantification and interpretation of trace amounts of hazardous inorganic substances influencing hazard classification of a substance in REACH registration (REACH 물질 등록 시 분류에 영향을 주는 미량 유해 무기물질의 스크리닝·정량·해석을 위한 체계도 연구)

  • Kwon, Hyun-ah;Park, Kwang Seo;Son, Seung Hwan;Choe, Eun Kyung;Kim, Sanghun
    • Analytical Science and Technology
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    • v.32 no.6
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    • pp.233-242
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    • 2019
  • Substance identification is the first step of the REACH registration. It is essential in terms of Classification, Labelling and Packaging (CLP) regulation and because even trace amounts of impurities or additives can affect the classification. In this study, a scheme for the screening, quantification, and interpretation of trace amounts of hazardous inorganic substances is proposed to detect the presence of more than 0.1% hazardous inorganic substances that have been affecting the hazard classification. An exemplary list of hazardous inorganic substances was created from the substances of very high concern (SVHCs) in REACH. Among 201 SVHCs, there were 67 inorganic SVHCs containing at least one or ~2-3 heavy metals, such as As, Cd, Co, Cr, Pb, Sb, and Sn, in their molecular formula. The inorganic SVHCs are listed in excel format with a search function for these heavy metals so that the hazardous inorganic substances, including each heavy metal and the calculated ratio of its atomic weight to molecular weight of the hazardous inorganic substance containing it, can be searched. The case study was conducted to confirm the validity of the established scheme with zinc oxide (ZnO). In a substance that is made of ZnO, Pb was screened by XRF analysis and measured to be 0.04% (w/w) by ICP-OES analysis. After referring to the list, the presence of Pb was interpreted just as an impurity, but not as an impurity relevant for the classification. Future studies are needed to expand on this exemplary list of hazardous inorganic substances using proper regulatory data sources.

Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering (Sn-Ag-Cu-X 무연솔더로 솔더링 된 접합부의 진동파괴 거동)

  • Jin, Sang-Hun;Kang, Nam-Hyun;Cho, Kyung-Mox;Lee, Chang-Woo;Hong, Won-Sik
    • Journal of Welding and Joining
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    • v.30 no.2
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    • pp.65-69
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    • 2012
  • Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

Damage at the Peach Due to Vibrational Stress During Transportation Simulation Test (모의수송 중 진동피로에 의한 복숭아의 손상)

  • Choi, Seung-Ryul;Lee, Young-Hee;Choi, Dong-Soo;Kim, Man-Soo
    • Journal of Biosystems Engineering
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    • v.35 no.3
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    • pp.182-188
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    • 2010
  • Post-Harvest processing engineering is a field that studies prevention of the quality change of agricultural products during sorting, packaging, storage, and distribution after harvested. In distribution steps, agricultural products could be damaged by physical force, it is the main reason of low quality and they lost value of commodities. This study was performed to find the vibration characteristics of the peach, and to find the extent of the damage on the peach by fatigue stress. The vibration data was obtained on expressway and the vibration characteristics of peach was used to find the damage on the peach. To analyze the vibration characteristics of peach, the resonance frequency and vibration transmissibility were measured. The resonance frequency of the peach was 167.98 Hz and the transmissibility was 4.06 at resonance point. It was 150 ~ 250 Hz that the transmissibility was more than 1. And the transmissibility in simulated test was measured. When the trasmissibility was more than 1, the range was 15 ~ 65 Hz, and when it was less than 1, the range was 65 ~ 175 Hz. When the transmissibility was about 1, the range was 5 ~ 15 Hz. The damage and the vibration cycle numbers of peaches were compared with input frequency and acceleration. More damage and less cycle number happened in 30 Hz than in 62.5 Hz. The reason was that the transmissibility of 30 Hz was higher and the vibration displacement in lower frequency was more. The more acceleration and cycle number increased, the more the bruising volume of peaches increased. The bruising volume ratio for vibration fatigue was measured according to input acceleration and cycle number. Using measured data, regression models for bruising volume ratio(BVR) was developed as a function of the acceleration(A) and cycle number(CN) as follows. BVR = a * $A^b*$ $(CN)^c$

PDMS-based pixel-wall bonding technique for a flexible liquid crystal display (플렉서블 액정 디스플레이를 위한 PDMS 기반 pixel-wall bonding 기술)

  • Kim, Young-Hwan;Park, Hong-Gyu;Oh, Byeong-Yun;Kim, Byoung-Yong;Paek, Kyeong-Kap;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.04a
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    • pp.42-42
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    • 2008
  • Considerable attention has been focused on the applications of flexible liquid crystal (LC)-based displays because of their many potential advantages, such as portability, durability, light weight, thin packaging, flexibility, and low power consumption. To develop flexible LCDs that are capable of delivering high-quality moving images, like conventional glass-substrate LCDs, the LC device structure must have a stable alignment layer of LC molecules, concurrently support uniform cell gaps, and tightly bind two flexible substrates under external tension. However, stable LC molecular alignment has not been achieved because of the layerless LC alignment, and consequently high-quality images cannot be guaranteed. To solve these critical problems, we have proposed a PDMS pixel-wall based bonding method via the IB irradiation was developed for fasten the two substrates together strongly and maintain uniform cell gaps. The effect of the IB irradiation on PDMS with PI surface was also evaluated by side structure configuration and a result of x-ray photoelectron spectroscopic analysis of PDMS interlayer as a function of binder with substrates. large number of PDMS pixel-walls are tightly fastened to the surface of each flexible substrate and could maintain a constant cell gap between the LC molecules without using any other epoxy or polymer. To enhance the electro-optical performance of the LC device, we applied an alignment method that creates pretilt angle on the PI surface via ion beam irradiation. Using this approach, our flexible LCDs have a contrast ratio of 132:1 and a response time of about 15 ms, resulting in highly reliable electro-optical performance in the bent state, comparable to that of glass-substrate LCDs.

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A Study on the Conformity of the Goods under International Sale (국제물품매매에서 물품의 계약적합성에 관한 연구)

  • OH, Hyon-Sok
    • THE INTERNATIONAL COMMERCE & LAW REVIEW
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    • v.66
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    • pp.25-46
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    • 2015
  • The purpose of this paper is to provide a legal implication about conformity of goods in the international commercial transactions. There are so many legal relationship after the formation of contract. The most of important thing among the obligations of seller is to provide conformal goods which are of quantity, quality and description required by the contract and which are contained or packaged in the manner required by the contract. If seller violate above duties, seller take the warranty liability. However, CISG describe the conformity of the goods instead of the warranty as follows. First, CISG Art.35(1) states standards for determining whether goods delivered by the seller conform to the contract and Art.35(2) describes standards relating to the goods' quality, function and packaging that, while not mandatory, are presumed to be a part of sales contracts. Article 35(2) is comprised of four subparts. Two of the subparts (article 35(2) (a) and article 35(2)(d)) apply to all contracts unless the parties have agreed otherwise. Second, CISG Art.36 and 38 deals with the time at which a lack of conformity in the goods must have arisen in order for the seller to be liable for it. If seller lack of conformity becomes apparent only after that time, seller is liable for a lack of conformity existing when risk passed to the buyer. Third, CISG Art.49 describe that a buyer who claims that delivered goods do not conform to the contract has an obligation to give the seller notice of the lack of conformity. The most of important things about CISG articles and precedents is that buyer is aware of the lack of conformity and notice it to seller. Failure to satisfy the notice requirements of article 39 eliminates a buyer's defence, based on a lack of conformity in delivered goods, to a seller's claim for payment of the price. Consequently, parties of contract had better agree to the notifying times about lack of conformity. Also, If seller fined the non-conformity, seller has to notify this circumstance to the buyer within short period or agreed time.

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A Model for Detection and Refinement of Fixed Bending Regions for Improving the Degree of Thickness Uniformity in Rolled Film Manufacturing (롤 형상 필름 생산에서 두께평활도 개선을 위한 고정굴곡부 발현 모형 및 개선 모델)

  • Bae, Jae-Ho
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.38 no.3
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    • pp.21-28
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    • 2015
  • As film products are increasingly used in a wide range of areas, from producing traditional flexible packaging to high-tech electronic products, a higher level of quality is demanded. Most film products are made in the form of rolled finished goods, therefore, various quality issues related to their shape characteristics must be addressed. The thickness of the film products is one of the most common and important critical-to-quality attributes (CTQs). Particularly, the degree of thickness uniformity is more important than other thickness parameters, because it will be potential causes of many secondary thickness-related quality problems, such as wrinkles or faulty windings. To control the degree of thickness uniformity, the fixed bending region is oneof the most important CTQs to manage. Fixed bending regions are special points in the transverse direction of a rolled product with consistent minute variations of the thickness gap. This paper describes the measurement and analysis of thickness uniformity data, which were performed in a real manufacturing field of biaxial oriented polypropylene (BOPP) film. In previous researches, quality function deployment (QFD) or fault tree analysis were used to find the most critical process attributes out to controlthe CTQ of thickness uniformity. Whereas, this paper uses traditional control charts to find the most critical process attributes out in this problem. In addition, the selection of one of the major critical process attributes (CTPs) that is expected to affect the CTQ of thickness uniformity is also described. The selected critical-to-process attributes are the controlled temperatures along the transverse direction. A dramatic improvement in thickness uniformity was observed when the selected CTPs were controlled.

Ternary Phased Graphene/Silica/EVOH Nanocomposites Coating Films (삼성분계 그래핀/실리카/EVOH 나노 복합 코팅 필름)

  • Kim, Seong Woo
    • Journal of Adhesion and Interface
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    • v.23 no.3
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    • pp.94-99
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    • 2022
  • Ternary phased graphene/silica/EVOH nanocomposite coating materials were prepared via sol-gel process and solution blending process. From both SEM observations and XRD analysis, the exfoliated structure and dispersion state of graphene nanosheets and silica particles in the nanocomposites as well as the intercalated and exfoliated structure of the prepared graphene oxide were confirmed. The incorporation of GrO and silica at appropriate content resulted in remarkable improvement in oxygen barrier property of the ternary phased nanocompoiste-coated BOPP films, compared with that of binary(silica/EVOH) phased nanocomposite coating films, however, at excess amount of GrO and silica, very slight variation was observed due to incomplete exfoliation, dispersion of graphene tactoids, and formation of micro cracks in the silica clusters. In addition, the transparency of nanocomposite-coated film was investigated by measuring the light transmittance as a function of GrO contents, suggesting the possibility for the application of food packaging films.

A Study on Improving Scheme and An Investigation into the Actual Condition about Components of Physical Distribution System (물류시스템 구성요인에 관한 실태분석과 개선방안에 관한 연구)

  • Kim, Kyeong-Cho
    • Journal of Distribution Science
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    • v.7 no.4
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    • pp.47-56
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    • 2009
  • The purpose of this study is to present an alternative improving the efficient and reasonable of the physical distribution system management is influenced by many factors. Therefore, the study depends on the documentary method and survey method to achieve the purpose of this study. The major components of a physical distribution system are refers to as elements, include warehouse·storage system, transportation system, inventory system, physical distribution information system. The factors used in this study are ① factor of product(quality·A/S·added value of product·adaption of product·technical competitive power to other enterprises), ② factor of market(market channel·kinds of customer·physical distribution share), ③ factor of warehouse·storage(warehouse design·size·direction·storage ability·warehouse quality), ④ factor of transportation(promptness·reliability·responsibility·kinds of transportation·cooperation united transportation system·national transportation network), ⑤ factor of packaging (packaging design·material·educating program·pollution degree measure program), ⑥ factor of inventory(ordinary inventory criterion·consistence for inventories record), ⑦ factor of unloaded(unloaded machine·having machine ratio), ⑧ factor of information system (physical distribution quantity analysis·usable computer part), ⑨ factor of physical distribution cost(sales ratio to product) ⑩ factor of physical distribution system(physical distribution center etc). The implication of this study can be summarized as follows: ① In firms that have not adopted a systems integrative approach, physical distribution is a fragmented and often uncoordinated set of activities spread throughout various functions with function having its own set of priorities and measurements. ② The physical distribution is recognized as more an important strategic factor than a simple cost reduction factor, ③ It can be used a strategic competition tool to enterprise.

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Optimization of wiring process in semiconductor with 6sigma & QFD (6시그마와 QFD를 활용한 반도체용 wire공법 최적화 연구)

  • Kim, Chang-Hee;Kim, Kwang-Soo
    • Asia-Pacific Journal of Business Venturing and Entrepreneurship
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    • v.7 no.3
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    • pp.17-25
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    • 2012
  • Wire bonding process in making semiconductor needs the most precise control and Critical To Quality(CTQ). Thus, it is regarded to be the most essential step in packaging process. In this process, pure gold wire is used to connect the chip and PCB(substrate or lead frame). However, the price of gold has been skyrocketing continuously for a long period of time and is expected to further increase in the near future. This phenomenon situates us in an unfavorable condition amidst the competitive environment. To avoid this situation, many semiconductor material making companies developed new types of wires: Au.Ag wire is one material followed by many others. This study is aimed to optimize the parameter in wire bonding with the use of 6sigma and QFD(Quality Function Deployment). 6sigma process is a good means to not only solve the problem, but to increase productivity. In order to find the key factor, we focused on VOB(Voice of Business) and VOC(Voice of Customer). The main factors from VOB, VOC are called CTQ. However, there were times when these main factors were far from offering us the correct answer, thus making the situation more difficult to handle. This study shows that QFD aids in deciding which of the accurate factors to undertake. Normally QFD is used in designing and developing products. 6sigma process is held more effective when it used with QFD.

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Vibration Characteristics of the Oriental Melon by Vibration Test (진동시험에 의한 참외의 진동특성)

  • Kim, Man-Soo;Jung, Hyun-Mo;Kim, Ghi-Seok;Park, Chung-Gil
    • Korean Journal of Agricultural Science
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    • v.32 no.1
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    • pp.29-42
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    • 2005
  • During a long journey of agricultural products from the production area to markets, the quality of agricultural products was always affected by some degree of vibration. The vibration input during the transportation may cause serious agricultural product injury, and this damage is particularly severe whenever the vegetable inside package is free to bounce, and is vibrated at its resonant frequency. The objectives of this study were to determine the resonant frequency of the oriental melon and to investigate the relationships between resonant frequency and physical properties of the oriental melon such as mass, volume and major and minor axes. In this study vibration testing device was constructed to determine the vibration response of the oriental melon in frequency ranges of 5 to 150 Hz. The computer program for controlling the vibration shaker and the function generator and measuring the vibration characteristics of the oriental melon was developed. The ranges of resonant frequency and peak acceleration at resonance of the oriental melon were 51 to 73 Hz and 1.24 to 1.92 G-rms, respectively. The resonant frequency and the peak acceleration decreased with the increase of the sample mass, volume, major and minor axes of the oriental melon. Multiple regression models for resonant frequency and peak acceleration of the oriental melon as a function of mass, major axis and minor axis of the sample were developed and analyzed.

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