• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.9-13
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• 2002

Recently, Organic electroluminescent devices (OELDs) have been demonstrated the medium sized full color display with effective multi-layer thin films. In this study, the multi-layer OELDs were prepared on the patterened ITO (indium tin oxide)/glass substrates by the vacuum thermal evaporation method. The low molecule compounds such as $Alq_3$(trim-(8-hydroxyquinoline)aluminum) and CTM (carrier transfer material) as the electron transport and injection layers as well as TPD (triphenyl-diamine) and CuPc (copper phthalocyanine) as the hole transport and injection layers were used. The luminance was rapidly increased above the threshold voltage of 10 V. The luminance and emission spectrum for the OELDs samples with $A1/CTM/Alq_3$/TPD/1TO structures were found to be 430 cd/$m^2$and 512 nm at 17 V showing green color emission. In contrast, the samples with $Li-A1/Alq_3$/TPD/CuPC/1TO multi-structures showed 508 nm in emission spectrum and 650 cd/$m^2$at 17 V in the luminance. The increment of luminance may be ascribed to the improved efficiency of recombination in the region of the emission layers by the deposition of CuPc as hole injection layer and the low work function of the Li-Al electrode compared to the Al electrode.

• Korean Journal of Agricultural Science
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• v.30 no.2
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• pp.175-183
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• 2003

Fruit and vegetables are subjected to complex dynamic stresses in the transportation environment. During a long journey from the production area to markets, there is always some degree of vibration present. Vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serious fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonance frequencies of the fruit and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. Instrumentation and technologies are described for determining the vibration response characteristics of the fruits with frequency range 3 to 150 Hz. The computer program for controlling the vibration exciter and the function generator and for measuring the vibration response characteristics of the fruits was developed. The resonance frequency of the pear ranged from 64.5 to 72.2 Hz and the amplitude at resonance was between 1.78 and 2.21 G-rms. The resonance frequency and amplitude at resonance decreased with the increase of the sample mass, and they were slightly affected by mechanical properties such as bioyield deformation and rupture deformation. Regression analysis was performed among the relatively high correlated parameters from the results of correlation coefficient analysis.

• Journal of Korean Society of Rural Planning
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• v.19 no.2
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• pp.21-33
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• 2013

In these days, agricultural products are regarded as a core income source in tourism villages. Nevertheless, poor packaging of agricultural products has threatened the competitiveness and quality of products. For farmers, it is less likely to employ individual designer for developing and improving their packages due to low accessability to rural villages and budgets. Based on this background, this study conducted 'Charrette' in order to improve agricultural product packaging. The target village was 'Goraday' in Gangwon province. This study consisted of different steps for building and implementing proper 'Charrette' programs. Then, it also conducted empirical investigation about the effectiveness and efficiency of 'Charrette'. 'Charrette' has made progress as follows; first step was concerned with advance preparation for constructing program. Second, implementation of 'Charratte' included data collection and analysis, and development of design. Third, evaluation and feedback stage have given presentation and discussion about suggested design with local residents. Empirical investigation about the effectiveness and efficiency of 'Charrette' has been composed with survey and interview targeting participants. In survey and interviews, designers were asked about their attitudinal changes in relation to knowledge, recognition, function, motivation, and satisfaction toward 'Charrette' and 'agricultural product package design' before and after participating the event. The results showed that knowledge and perception of designers toward 'agricultural product package design' have positively increased. In addition, it revealed that designers were satisfied with collaborations with others and their contribution to rural community business. However, the results also suggested that sufficient preparation time/schedules and opportunity to meet other and farmers before events would be required to have better communication and understanding in relation to their tasks and role distribution. Furthermore, it is also required for designers to hold relationship with local community in order to actualize their packaging design.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.253-258
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• 2005

Characteristics of electroplated Ni films such as grain size, resistivity, solder wetting angle, and growth rate of intermetallic compound were evaluated as a function of electroplating current density. With increasing the electroplating current density from $5\;mA/cm^2 $ to $40\;mA/cm^2 $, the nodule size on the Ni film surface decreased, grain refinement occurred, and resistivity increased from $7.37\mu\Omega-cm$ to $9.13\mu\Omega-cm$. Compared with Ni film processed at $40\;mA/cm^2 $, Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ exhibited low resistivity, dense microstructure, and slow growth rate of intermetallic compound. Ni films electroplated at $5\;mA/cm^2 $ and $10\;mA/cm^2 $ are more suitable for Ni UBM application than that fabricated at $40\;mA/cm^2 $.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.19-24
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• 2009

Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties of the $TaN_x$ film deposited by reactive sputtering were investigated. The adhesion strength between Cu film and $SiO_2$/Si substrate was quantitatively measured by $180^{\circ}$ peel test and topple test as a function of the composition of the adhesive $TaN_x$ film. As the nitrogen content increased in the adhesive $TaN_x$ film, the adhesion strength between Cu and $SiO_2$/Si substrate increased, which was attributed to the increased formation of interfacial compound layer with the nitrogen flow rate. We also examined the diffusion-barrier properties of the $TaN_x$ films against Cu diffusion and found that it was improved with increasing nitrogen content in the $TaN_x$ film up to N/Ta ratio of 1.4.

• The KIPS Transactions:PartD
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• v.16D no.5
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• pp.715-728
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• 2009

The Enterprise Service Bus based on Java Business Integration is an web service standard and one of the methods for implementing distribution channels of Service Oriented Architecture. Consisting of open source group, extensive venders and users, the ESB based JBI has the problems of ineffectiveness as well as advantages of extensibility of service plug-in. That is, in case users need to use Service plug-in, manual connection of packaging process and sequential distribution method is required. This study, therefore, proposes as a way of trouble-shooting the user-oriented component deployment tool which can manage entire process for deploying The ESB middleware platform to Service unit. At the same time, this study elicited the requirements based on issues of JBI-based ESB and has developed the modeling property, packaging, distribution and evaluation thru Schema analysis of JBI-compatible component. Using the deployment tool this study proposed, users will be able to perform and manage the whole deploying process without additional manual work for connecting component. Not only it is expected that interface based on Graphic User Interface provide usability and convenience but they can also minimize the errors rate through component and route validity verification function provided in deployment tool.

• Journal of electromagnetic engineering and science
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• v.5 no.3
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• pp.140-145
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• 2005

In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2449-2452
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• 2007

Hot spots on thin wafers of IC packages are becoming important issues in thermal and electrical engineering fields. To investigate these hot spots, we developed a Diode Temperature Sensor Array (DTSA) that consists of an array of 32 ${\times}$32 diodes (1,024 diodes) in a 8 mm ${\times}$ 8 mm surface area. To know specifically the hot spot temperature which is affected by the chip thickness and a generated power, we made the DTSA chips, which have 21.5 ${\mu}m$, 31 ${\mu}m$, 42 ${\mu}m$, 100 ${\mu}m$, 200 ${\mu}m$, and 400 ${\mu}m$ thickness using the CMP process. And we conducted the experiment using various heater power conditions (0.2 W, 0.3 W, 0.4 W, 0.5 W). In order to validate experimental results, we performed a numerical simulation. Errors between experimental results and numerical data are less than 4%. Finally, we proposed a correlation for the hot spot temperature as a function of the generated power and the wafer thickness based on the results of the experiment. This correlation can give an easy estimate of the hot spot temperature for flip chip packaging when the wafer thickness and the generated power are given.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2182-2186
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• 2003

This paper presents the differential type resonant accelerometer (DRXL) and its performance test results. The DRXL is the INS grade, surface micro-machined sensor. The proposed DRXL device produces a differential digital output upon an applied acceleration, and the principle is a gap-dependent electrical stiffness variation of the electrostatic resonator with torsion beam structures. Using this new operating concept, we designed, fabricated and tested the proposed device. The final device was fabricated by using the wafer level vacuum packaging process. To test the performance of the DRXL, a nonlinear self-oscillation loop is designed using describing function technique. The oscillation loop is implemented using discrete electronic elements. The performance test of the DRXL shows that the sensitivity of the accelerometer is 12 Hz/g and its long term bias stability is about $2mg(1{\sigma})$. The turn on repeatability, bandwidth, and dynamic range are 4.38 mg, 100 Hz, and ${\pm}\;70g$, respectively.

• Korean Journal of Computational Design and Engineering
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• v.16 no.1
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• pp.52-60
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• 2011

In this research, we developed a design system for a compressor of an air conditioner using solid CAD system. The developed design system has some characteristics. First, the design system used a configuration design method, so a designer can design a compressor very quickly by using the constructed master libraries. Next, the system was developed to be used not only by engineers but also by salesmen. It is very easy for a user to use it, so a salesman can get a result very easily with the design system. And it has some design modules which give a considerable convenience to designers. Actually, designers are accustomed to the module based design. Then, it has calculation and analysis functions. Volume and mass of a part, and interference between parts are calculated by using the geometric calculation function of a solid CAD system. Also a packaging calculation was implemented to get the smallest space to package compressors for transportation and storing. An interface with a program to analyze the vibration of a compressor was developed in this design system. The design system is similar to CBD (Case-Based Design) system in the view of the whole design process.