• 한국포장학회지
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• 제24권2호
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• pp.73-84
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• 2018

This study sought efficiency of collaboration between manufacturers and distributors by finding a way to improve logistics efficiency in order to save distribution cost and standardize packaging together with profit generation by way of simple-display packaging in discount stores. For the study purpose, the impact of products with RRP (Retail Ready Packaging) by each discount store on the collaboration achievement such as loading efficiency was observed. From this observation, an alternative packaging system that can improve logistics efficiency between manufacturers and distributors was sought and the role of distributors in distribution standardization was explored. The purpose of this study also includes suggesting some implications on future basic direction of environment-friendly management. If this study would induce distributors to have more interest in distribution standardization and if logistics efficiency would be enhanced by the operation of packaging system considered of compatibility with pallets, this study would have academic significance and create practical values.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• 한국포장학회지
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• 제23권2호
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• pp.109-117
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• 2017

Due to the rise of customer's alertness about fresh foods to health, in the past few years, the consumption of fresh food has increased sturdily. The use of gas scavengers is the most appropriate packaging technologies for fresh, fresh-cut produces and in ready to eat products. The gas absorber/scavenger has ability to protect or stabilize the wanted properties and shelf life of food. The success of gas absorbers in food depends on many parameters such as types of foods, storage temperature, relative humidity, initial gas concentration, and the characteristics of package materials. In this review article, we focus on the most recent research trends in gas scavenging systems used in food packaging, future trends. Intense research from industry and engineers remains important to the development of gas scavenging package that fulfill consumer requirements, enhance product quality, and offer environmentally friendly design and cost-effective application.

• 한국포장학회지
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• 제26권2호
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• pp.61-69
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• 2020

As post-harvest processes of onions are carried by a 20 kg-net package which results in high-cost and low-efficiency, especially, the insufficient drying and physical damage of onions after harvesting leads to a huge second loss in storage, we had developed a low-cost, high-efficiency post-harvest bulk handling machinery system by collecting onions on a farm using ton-bags, drying with forced air circulation, and sorting/packaging. The post-harvest bulk handling machinery system consisted of 6 devices, and this study designed an automatic feed hopper with a feeding rate control device, an inclined belt conveyor with a two-step chute, and an automatic pallet unloading device for feeding onions into the sorting/packing line. This study also analyzed the performance and control of the total system. The device had 1-ton handling capacity, but the operational condition was set to increase the capacity. The three-step filling method of pallet by the velocity control of the inclined belt conveyor was applied in the post-harvest bulk handling machinery system for the prevention of physical damage. If one worker was set to operate the total system, the time required to complete one palletized load was approximately 5 minutes and 5 seconds. The calculated daily handling capacity was approximately 94 tons, when the daily actual working time was 8 hours. When the developed system was applied to the managerial size of 2,000 ton, the processing cost per ton of the system was decreased by 19.5%, compared with the existing 20 kg-net package-based handling. The developed post-harvest bulk handling machinery system would be a good substitute for the rapid decline and aging of rural labor.

• 한국포장학회지
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• 제23권3호
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• pp.191-200
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• 2017

적정포장설계는 포장 원자재 사용량 및 폐기물 발생량뿐만 아니라 재료비 및 물류비 절감이 가능하여 포장재의 환경성과 경제성을 모두 충족시킨다. 유한요소해석은 구조해석, 열전달, 유체운동, 전자기 등 다양한 분야에 유용한 도구로 적용되고 있지만, 포장분야에서는 그 적용이 미비하다. 이에 따라 포장분야에 유한요소해석 적용은 컴퓨터 시뮬레이션으로 포장 설계가 가능하기 때문에 향후 연구에 있어 비용과 시간 절약이 가능하며 적정포장설계를 통해 포장 폐기물과 물류비 절감이 가능할 것으로 판단된다. 따라서 본 연구에서는 향후 포장분야에서 유한요소해석(FEM) 프로그램을 활용한 연구 설계에 도움이 되고자 하는 목적으로 국내에서 발표된 유한요소해석 관련 논문을 조사하였다. 1991년부터 2017년까지의 국내 학술지 및 학위논문에 게재된 유한요소해석 관련 논문 중 포장과 직접적인 연관성이 있다고 판단된 32편의 논문을 분석하여 연구의 동향을 살펴보았다. 그 결과 각 논문을 사용한 연구주제 및 내용, 유한요소해석 프로그램, 해석방법 등으로 분석하고 향후 포장분야에 활용할 수 있는 방향에 대하여 제시하였다. 포장 영역에 유한요소해석의 적용은 포장재에 가해지는 응력 및 진동해석을 통해 구조변경 및 두께 감량을 가능하게 하고 이에 따라 기계적 강도 향상 및 포장소재 사용량 감소를 통해 적정포장설계로 원가 절감이 가능할 것으로 판단된다. 따라서 향후 포장 분야의 연구에 있어, 유한요소해석을 함께 병행한다면 경제적이고 합리적인 포장 설계를 할 수 있을 것으로 판단된다.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.15-22
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• 2013

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

• 한국정보통신학회논문지
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• 제16권5호
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• pp.1029-1034
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• 2012

본 논문에서는 US-PCS(US-personal communications services)를 위해 사용이 가능한 저가격 고성능 FBAR (film bulk acoustic resonator) 듀플렉서(duplexer) 모듈(module)을 제시하였다. FBAR 소자는 일반적인 실리콘(Si) 기반의 공정보다 가격경쟁력이 우수한 유리(glass) 웨이퍼 기반의 패키지를 개발하여 적용하였다. FBAR 듀플렉서 모듈의 전송단(Tx)과 수신단(Rx)에서 얻어진 최대 삽입손실 특성은 각각 1.9 dB와 2.4 dB이다. 전송단 및 수신단 FBAR 소자와 본딩(bonding)된 유리 기반의 웨이퍼 및 PCB 기판과 몰딩(molding) 물질을 모두 포함하는 FBAR 듀플렉서 모듈의 전체 두께는 1.2 mm이다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.63-85
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• 1999

$\cdot$New CSP using Lead Frame and solder ball techniques. $\cdot$EMC needs high filler content, low CTE and high flexural modulus. $\cdot$Solder Joint Reliability improved by anchor leads. .Uniform inner lead shape would be better at capacitance values. $\cdot$Low Assembly cost CSP.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.124-128
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• 2001

We apply for the first time a low cost and loss wafer level packaging technology for RF-MEMS device. The proposed structure was simulated by finite element method (FEM) tool (HFSS of Ansoft). S-parameter measured of the package shows the return loss (S11) of 20dB and the insertion loss (S21) of 0.05dB.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance