• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.27 no.3
• /
• pp.203-210
• /
• 2021

With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.23 no.1
• /
• pp.53-63
• /
• 2005

The quality of the print can be specified through the quality of the coloring, the reproduction of fine structures and the range of tone values. Also, package printed quality are controlled by this points. In this paper, densitometry method was used for printed quality. By densitometry we can get the print density and the parameters of each conditions that characterize halftone printing, such as dot gain and relative printing contrast. Also, we have proposed the optimizes range of the parameters such as density, dot gain etc. to the package printed printability control.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.23 no.1
• /
• pp.65-75
• /
• 2005

An accurate characterization of the display device is essential for better color matching. The calibration and characterization process in display device is needed to transform the device dependent color to the device independent color. The process of characterization performs a linearization and transforms the linearized values into the CIE XYZ tristimulus values. The purposes of this paper is to propose optimal color transformation method for accurate reproduction of original copy in display device and to explain the propriety of transformation method using specific variable for the power of gradation expression.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.165-172
• /
• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• The monthly packaging world
• /
• s.139
• /
• pp.76-80
• /
• 2004

• The monthly packaging world
• /
• s.108
• /
• pp.128-131
• /
• 2002

• The monthly packaging world
• /
• s.154
• /
• pp.119-127
• /
• 2006

• The monthly packaging world
• /
• s.205
• /
• pp.76-80
• /
• 2010

• The monthly packaging world
• /
• s.331
• /
• pp.48-52
• /
• 2020

• Journal of Welding and Joining
• /
• v.17 no.2
• /
• pp.61-65
• /
• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.