• 한국정밀공학회지
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• 제26권3호
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• pp.113-121
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• 2009

Behavior of a package of a microwave oven under the clamping condition is evaluated by tests and the finite element analyses. PAM-CRASH software is used for the finite element analyses. Results of the analyses are compared with those of the tests and accuracy is shown to be favorable. Under the clamping condition of the original design, severe deformation occurs and an improved design of the outer case and upper EPS(Expandable Poly Styrene) is proposed to reduce it. Face beads of the outer case are introduced and shape of the upper EPS is modified to reduce the deformation resulting from the clamping load. The improved design model is analyzed and its deformation is shown to be satisfactory. A prototype is produced according to the improved design and tests are performed. Results of the clamping test of the prototype show that the plastic deformation is removed totally.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.492-497
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• 2004

Three methods for design sensitivity such as numerical differentiation, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis is exact, it is hard to implement for practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable for most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate because its computational cost depends on the number of design variables and large numerical errors can be included especially in nonlinear design sensitivity analysis. Thus semi-analytical method is more suitable for complicated design problems. Moreover semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure for the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and computational technique is proposed, which evaluates the pseudo-load for design sensitivity analysis easily by using the design variation of corresponding internal nodal forces. Errors in semi-analytical design sensitivity analysis are examined and numerical examples are illustrated to confirm the reduction of numerical error considerably.

• 한국콘텐츠학회논문지
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• 제16권1호
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• pp.42-51
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• 2016

오늘날 유통구조의 변화는 오프라인에서 온라인으로 급격하게 수요가 변화해 가고 있다. 이러한 현상은 상품을 편리하게 구입하고자 하는 소비자의 심리가 반영되어 있다고 할 수 있다. 농산물 역시 내용물을 보호하려는 안전성과 소비자들에게 신뢰를 줄 수 있는 브랜드 및 디자인이 어느때보다 중요하게 인식되어지고 있다. 특히, 딸기 과채류는 다른 과채류에 비해 껍질이 얇아서 약한 충격과 흔들림에도 상품의 품질이 떨어지기 때문에 패키지의 지기구조나 소재에 안정성 영향을 많이 받는다. 또한, 직거래 유통이 많은 과채류다보니 생산농가의 열약한 환경 때문에 패키지디자인이 다른 상품에 비해 경쟁력이 떨어지는 것이 현실이다. 즉, 딸기 수요가 날로 증가하는데 비해 딸기패키지는 생산자와 소비자 욕구에 충족하지 못한다는 점이다. 딸기판매에 경쟁력 강화를 위해서는 패키지개발의 기초연구가 시급한 실정이다. 패키지요소(형태, 소재, 디자인) 조사 분석을 통하여 패키지의 문제점을 파악하고, IPA MAP(중요도, 만족도)분석을 통하여 생산자와 소비지가 추구하는 개선점을 파악하고자 한다.

• 디자인학연구
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• 제21권
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• pp.139-147
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• 1997

본 연구는 우리의 일상 생활에서 물건을 보호하며 이를 용기에 담아 운반하는 것과 넓은 의미의 포장은 인류의 역사와 더불어 시작된 지혜이며 인간의 삶의 질을 향상시킨다는 하나의 행위이다. 산업발달과 국민경제의 고도성장과 수출증대에 따라 포장산업은 국내외적으로 대량유통체제가 요청되고 있으며 이러한 유통체제에 적응키 위해 제품의 생산에서 소비에 이르는 유통과정을 일관하는 매체로서 중요한 산업이 되어가고 있다. 그러나 산업발달에 따른 다양해지는 제품과 포장의 급증으로 배출되는 포장 폐기물은 심각한 사회문제가 되고 있다. 그러므로 제품의 보호, 운송, 보관에 적합하게 하면서도 기능적으로 편리하게 하고 내용물을 소모한 뒤의 포장 폐기물 처리 문제에까지 고려하는 것이 오늘날의 문제이다. 따라서 일반소비자들은 환경 적으로 건전하다고 판단되는 제품을 구매하거나 재활용함으로써 일차적인 환경보존에 기여할 수 있어야 한다. 그러므로 본 논문은 포장의 1차용도의 개념에서 벗어나 2차용도인 재활용을 위한 새로운 포장기능을 널리 인식시키고 앞으로 디자인방향의 개선점을 고려해 봄에 있다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 D
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• pp.2568-2570
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• 2004

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new FEM (Finite Element Method) package in CEMTool environment. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way With the introduction of new mesh generation algorithm and NDM (Hosted Dissection Method), our FEM package can guarantee the shorter computational time than MATLAB PDE Toolbox. In addition, using the advanced electromagnetics library of CEMTool FEM package, we can analyze the practical problems such as the motor field analysis. Consequently, with our new FEM package, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• 전자공학회논문지D
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• 제35D권4호
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• pp.61-70
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• 1998

The electrical performance of a package is extremely important for high speed digital system operations. CSP(chip scale package) is known to have better electrical performance than the convnetional packages. In this paper, the electrical performance of the BLP(bottom leaded plastic) package, a kind of CSP, has been alayzed by both simulation and real measurement. The electrical perfdormance of a BLP was compared with that of the conventioanl TSOP(thin small outline package). The leadinductanceand lead capacitance were used for the comparison purposes. The new BLP design provides much better electrical performance that TSOP package. It has about 40% favorable parameter values.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.79-83
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• 2016

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If thhe distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.25-32
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• 2012

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

• 한국정보과학회:학술대회논문집
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• 한국정보과학회 2004년도 가을 학술발표논문집 Vol.31 No.2 (3)
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• pp.370-372
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• 2004

본 논문에서는 개방형 운영체제인 리눅스상에서 package streaming service를 제공하는 Network Streaming Service(통칭 NSS)를 설계하는 문제를 다룬다. NSS는 client가 serve 측에 설치된 소프트웨어 package를 마치 client 자신의 local disk상에 이미 인스톨된 패키지를 실행하는 것처럼 동작하도록 해준다. NSS는 client측의 NSS Mounter, Package Streaming Consumer, NSS Configurator와 server측의 NSS Load Balancer, Package Streaming Supplier, NSS Manager, Accounting & Security Manager로 구성되며 local disk caching과 background prefetching 기능을 사용하여 향상된 서비스를 제공한다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.