• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• Journal of Information Technology Services
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• v.20 no.2
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• pp.57-76
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• 2021

Today's ERP system has become a core system of IT·SW that not only supports and manages enterprise resources efficiently, but also encompasses major business tasks. In other words, the ERP system is an essential strategic element for the survival of a company as a powerful means to innovate the management of an organization. This study analyzed the impact on the utilization of IT·SW from the perspective of the entire organization's process without limiting the performance evaluation of the ERP system itself, which is a core system of a company. The measurement data for evaluating the performance of the ERP system was the 2018 domestic company IT·SW utilization survey result report (subject to survey : 3,017 domestic companies with 10 or more employees). Based on this data, this study analyzed the impact of the ERP system on the entire enterprise's IT·SW utilization. In particular, attention was paid to whether there would be a difference in the use of IT·SW if the type of ERP system introduction was changed through the improvement of the business process of the company. Multiple regression analysis was performed using the statistical package SPSS 25. As a result, among the ERP system introduction types, the greatest degree of (+)influence on the company's IT·SW utilization is when the ERP package SW or ASP service is used as it is. Although the difference is insignificant, the second case was to build an ERP system through self-development or outsourcing, followed by customizing the package SW or system through self-development or outsourcing. Through the results of this study, it is expected that the organization will improve the business process and use the standard ERP package SW as it is without modification, thereby effectively enhancing the use of IT·SW of the company and leading to management performance.

• Journal of Digital Convergence
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• v.20 no.2
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• pp.383-388
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• 2022

This study is about the elements of cosmetic's package design which MZ generation prefer and the effect on purchase. Naming, brand logo, color, typography, layout, illustration, matter & finish, and meaningful are classified 8 visual elements through the pilot study. After that this study analyzes specific visual elements which MZ generation prefer through online survey and In-depth interview based on the 8 visual elements. As a result of study, MZ generation prefer tidy and neat design to decorated style, and they feel brand logo is the most important thing of all 8 visual elements. In additional, meaningful of brand is barley able to compare with price, although it is significant visual element. This study may help to develop the way of the cosmetic's package design for MZ generation.

• East Asian Journal of Business Economics (EAJBE)
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• v.11 no.2
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• pp.91-108
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• 2023

Purpose - This research paper empirically analyzes the effect of changes in the employment environment due to the 4th industrial revolution on the turnover intention of cosmetic employers and employees and seeks the necessary measures for job instability in the industrial field. Research design, data, and methodology - A self-report questionnaire was conducted on 513 cosmetic implementers. Statistical processing of the data collected by the data analysis method was analyzed using the Statistical Package for Social Science (SPSS) WIN23.0 statistical package program through data coding and data organizing process. Results - Changes in the employment environment were found to have a significant effect on the effect of job instability (t=13.218, p<0.05). As for the effect of organizational commitment on turnover intention, the higher the organizational commitment, which is a parameter, has a negative (-) effect on turnover intention, a dependent variable (p<0.05). Conclusions - Our results are based on an analysis that allows cosmetic employers and workers to explore ways to address job insecurity. Based on the analysis results, it will help the growth of the cosmetics industry by providing basic data for the identity of the cosmetics industry and the development of the cosmetics service organization.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.6 no.1
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• pp.31-36
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• 2000

180g of fermented soy paste and 150g of red pepper paste were packaged in glass jars of 232 mL with different conditions of active packaging and then stored at $13^{\circ}C$ for about 170 and 128 days, respectively. During the storage, package atmosphere, surface color, pH, acidity and microbial flora were monitored to see the effect of packaging conditions. Test packaging conditions include package equipped with $Ca(OH)_2\;as\;CO_2$ absorber, package with pinhole and closed control one. Closed control packages of soypaste and red pepper paste showed the increased $CO_2$ partial pressure, the decreased $O_2$ partial pressure and the constant $N_2$ partial pressure to produce high pressure buildup with storage. The paste packages with $Ca(OH)_2$ maintained relatively low $CO_2$ partial pressure and thus the package pressure close to normal atmospheric pressure for initial storage period of 70 days. The packages with air pinhole channel had the partial pressures of $O_2\;and\;N_2$ decreased with storage time, while $CO_2$ partial pressure first increased to a maximum and then slowly decreased thereafter Without any pressure increase the packages with pinhole gave the lowest quality changes possibly due to the effect of package atmosphere, but it had problem of mold contamination and growth for soy paste after 120 days. There were no difference in microbial flora between the packages after about 70 day storage.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• International Journal of Quality Innovation
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• v.8 no.3
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• pp.81-112
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• 2007

In the competitive global market, firms have to keep profit from innovation activities. A firm makes profits by offering products or services at a lower cost than its competitors or by offering differentiated products at premium prices that more than compensate for the extra cost of differentiation. The IC Package and Testing technology industries were the first high technological industry to build in Taiwan. The Package and Testing industries in Taiwan adopted competitive innovation activities to become stronger. In our study, we want to know how innovation activities influence a firm operating in the IC Package and Testing industries. Our study used a questionnaire and Likert five-point scale to survey the innovation activities, customer and feedback in innovation performance in the IC Package and Testing industry. The wafer level chip size packing technology in our study indicates the innovation activities. Because we need to compare the difference between the wafer level chip size packing technology and wire bonding technology to recognize innovation and how the innovator and customer were influenced. Our conclusions are described below: (1) When the innovator adopts innovation activities that can be maintained using experiments and knowledge, using machine and decision variables more quickly will produce success; (2) Innovators should adopt innovation activities that focus on customers that use knowledge and experimentation, training time and cost. If an innovation forces customers to spend much time and cost to learn new technology or applications, the innovation will not be adopted; (3) Innovators that create innovation performance higher than his customers must also consider the impact upon their customers. We have to remind innovator to focus on why their customers have a different level of evolution in the same innovation activities.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.18 no.1_2
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• pp.33-38
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• 2012

Modified atmosphere packaging (MAP) was applied to steamed bread added with black rice in 10%. In terms of storage stability, the steamed bread was found to be susceptible to microbial spoilage and could be helped in its preservation and shelf life extension by MAP. According to microbial and sensory quality criteria, the product shelf life was determined as < 5 days for air package, 5 days for 100% $N_2$ package, 8 days for package of 60% $CO_2$/40% $N_2$, and 15 days for 100% $CO_2$ package. Even though MAP condition with $CO_2$ inclusion was effective in extending the shelf life based on microbial quality, it did not affect the staling of the bread.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.