• 식품보건융합연구
• /
• 제9권3호
• /
• pp.11-17
• /
• 2023

This study aims to investigate the effect of the selection attribute of Newtro (New + Retro) product marketing, which is a recent topic in the food industry, on consumer satisfaction. Newtro marketing, also known as Newtro-style marketing, is a marketing strategy that emerged in South Korea, particularly in the food industry. Newtro marketing aims to appeal to consumers' nostalgia for the past while incorporating contemporary elements. As a research method, a survey was conducted on the importance of selection attributes and repurchase intention of Newtro food for consumer groups of various age groups ranging from teenagers to those in their 40s or older. To analyze the demographic content of the sample, frequency analysis of the SPSS statistical package was performed, and structural equation modeling was performed using the AMOS program for confirmatory factor analysis and discriminant validity analysis. The analysis results are as follows. First, Package Design, Perceived Healthiness, and Emotional Taste, optional attributes of Newtro marketing, significantly affected satisfaction. Second, satisfaction was found to have a statistically significant effect on repurchase intention. However, Functional Flavor did not statistically affect satisfaction. This study empirically analyzed the importance of consumers' selection attributes for the recently popular food Newtro marketing and suggested implications.

• 디지털융복합연구
• /
• 제15권9호
• /
• pp.479-486
• /
• 2017

이 연구는 코즈 브랜딩의 개념이 적용된 화장품의 패키지 디자인을 통해 소비자의 선호도와 가치관을 분석하여 니즈를 파악해 소비자를 만족시킬 수 있는 패키지 디자인을 제안하는 데에 목적을 둔다. 화장품 구매 시 패키지 디자인을 구매요인에서 중요시하는 실험집단을 모집하여 코즈 브랜드 제품과 일반 브랜드 제품을 비교하여 설문과 심층인터뷰를 진행하였다. 1차 실험은 패키지 디자인 선호유형 분석 문항에서 추출하여 인지적, 감성적, 행동적 반응으로 분류한 문항을 통해서 총 31명을 대상으로 설문을 실시하였고, 2차 실험은 Sheth의 소비가치 기준에서 4가지를 발췌하여 만든 질문을 통해 총 6명을 대상으로 심층 인터뷰를 진행하였다. 실험 결과, 소비자들은 제품의 정보를 빠르고 정확하게 파악할 수 있는 디자인을 선호하였다. 특히 코즈 브랜드 제품인지 파악하기가 쉽지 않기 때문에 사회적으로 어떻게 도움이 되는지 패키지에 명시되어야 할 것이다.

• 한국식품영양과학회지
• /
• 제28권2호
• /
• pp.429-437
• /
• 1999

A mathematical model was established for estimating changes in pressure and volume of permeable kimchi packages. The model comprises the CO2 gas production from kimchi and permeation of O2, CO2 and N2 through the permeable film or sheet. Using the developed model, the effects of various packaging variables on the pressure and volume changes were analyzed for rigid and flexible packag es of kimchi(3% salt content) at 15oC, and then effect of storage temperature was also looked into. In case of rigid pack of 400g, using the plastic sheet of high CO2 permeability and initial vacuumizing can help to relieve the problem of pressure build up. The lower fill weight can further reduce the pressure, but will result in higher packaging cost. For the flexible package of 3 kg, highly permeable films such as low density polyethylene(LDPE) and polypropylene can reduce the volume expansion. Higher ratio of CO2 permeability to O2 and N2 permeabilities are effective in reducing the volume expansion. Increased surface area cannot contribute to reduction of volume expansion for highly permeable flexible packages of kimchi. For the impermeable packages, pressure and volume at over ripening stage (acidity 1.0%) increase with decreased temperature, while those at optimum ripening stage(acidity 0.6%) change little with temperature. Pressure of permeable rigid LDPE package increases with tem perature at any ripening stage, and temperature affects the volume of flexible LDPE package very slightly. Experimental verification of the present results and package design with economical consid eration are needed as a next step for practical application.

• 한국식품저장유통학회지
• /
• 제4권3호
• /
• pp.265-270
• /
• 1997

Effect of modified atmosphere packaging conditions on quality changes of dry jujube was investigated. Dry jujubes with moisture content of 26.7% were packaged in PET/Al/PE film pouches with modified atmospheres. The tested packages include those with normal air, vacuum, CO2 flushing, N2 flushing and O2 scavenger. Packages were stored at 25$^{\circ}C$ for 6 months, during which ascorbic acid concentration, browning level, titratable acidity and surface color were measured. Generally modified atmosphere packages could improve quality retention of dry jujubes except that vacuum package resulted in large surface color change. CO2-flushed package showed the best quality retention of high ascorbic acid content and low browning during 112 days, but caused high amounts of ascorbic acid destruction and browning in longer storage. In all the modified atmosphere packages titratable acidity reached a maximum followed by decline and subsequent rise, while it increased linearly with time in normal air package. Considering ascorbic acid retention browning level and surface color changes during 112 days, the packages of CO2 flushing and N2 flushing were better than others.

• 한국식품저장유통학회지
• /
• 제1권2호
• /
• pp.93-98
• /
• 1994

Fresh ginseng was packed by using available commercial plastic films of polyvinyl chloride (PVC), cast polypropylene (CPP) and low density polyethylene (LDPE). PVC was used as a wrapping on polystyrene tray, and CPP and LDPE were applied as pouch packages. Gas composition of the package and keeping quality of ginseng in the packages were evaluated for 20 day storage at 5$^{\circ}C$. LDPE (27$\mu\textrm{m}$ thick) Package modified the Package atmosphere to 11.7% O2 and 2.1% CO2, gave low microbial growth and good sensory score after 20 day storage.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 International Symposium
• /
• pp.165-172
• /
• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• 한국산업융합학회 논문집
• /
• 제26권2_2호
• /
• pp.265-272
• /
• 2023

In this paper, we directly implemented the Line Tracer ROS package that can detect and follow lines drawn on the map on Gazebo, an open-source that is widely used in autonomous driving research. For line detection, the cv_bridge package was used to enable OpenCV's image processing tools, and parameters such as robot speed, line color and ground material could be changed. In addition, proportional (P) and PID controls could be implemented using the color centroid obtained through image processing. Through this approach, the effect of proportional and differential coefficients on the robot's line tracer motion could be analyzed effectively. In addition, by displaying robot simulation results using various tools of ROS, an efficient development for control nodes could be established in ROS.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2004년도 추계학술발표대회 개요집
• /
• pp.58-60
• /
• 2004

In the field of welding the behavior of a welded structure under consideration may be predicted via heat transfer and residual stress analysis. In order to facilitate the industrial applications of welding, numerical modeling of heat transfer and residual stress in weldment has been carried out applying Finite Element Method (FEM) and the analysis with the external load including this residual stress due to welding has been done. The present work includes the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress redistributed along with the external load in the welded structures. A basic interface, which allows models, built in commercial preprocessing package access to the data necessary to build standard input decks for these specialized FEM codes, which are not supported by commercial package. The results from the FEM codes are imported back into commercial package for visualization. In addition the residual stress values are exported to commercial package (such as ANSYS, PATRAN etc.) for further analysis with the external loads, which make the FEM codes fully applicable to the industrial purpose.

• 유통과학연구
• /
• 제12권12호
• /
• pp.27-41
• /
• 2014

Purpose - This study examines various reservation service components that would increase customers' brand attachment and loyalty, while discussing how reservation service components would affect the customer behaviors. Research design, data, and methodology - This study theoretically analyzed the hotel package product reservation system, the customer expectations, the brand attachment, and the brand loyalty, while reviewing previous studies. Results - This study analyzed the distribution channels of the hotel package products from various angles and, as for more extensive research, the study explained the different results caused by each different reservation system type that may be preferred by each individual customer. Conclusions - It was confirmed that, of the hotel reservation service components, the convenience factors, the reliability factors, the information factors, and the other factors other than the human factors, have a significant influence on the customer expectations. Further, the study also revealed that the customer expectation has an important effect on the brand attachment. In addition, the study improved the prevailing understanding on the relation between the brand attachment and the brand loyalty.

• 한국재료학회지
• /
• 제17권2호
• /
• pp.91-95
• /
• 2007

Electromigration characteristics of Sn-3.5Ag flip chip solder bump were analyzed using flip chip packages which consisted of Si chip substrate and electroplated Cu under bump metallurgy. Electromigration test temperatures and current densities peformed were $140{\sim}175^{\circ}C\;and\;6{\sim}9{\times}10^4A/cm^2$ respectively. Mean time to failure of solder bump decreased as the temperature and current density increased. The activation energy and current density exponent were found to be 1.63 eV and 4.6, respectively. The activation energy and current density exponent have very high value because of high Joule heating. Evolution of Cu-Sn intermetallic compound was also investigated with respect to current density conditions.