• Macromolecular Research
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• v.8 no.5
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• pp.215-223
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• 2000

A novel diamine monomer, containing fluorine and phosphine oxide, bis(3-aminophenyl) 3,5-bis(trifluoromethyl)phenyl phosphine oxide (mDA6FPPO), was prepared via Grignard reaction, and utilized to prepare polyimides with dianhydrides such as PMDA, 6FDA, BTDA or ODPA, by the conventional two-step route; preparation of poly(amic acid), followed by solution imidization. The polyimides were characterized by FT-IR, NMR, and DSC with intrinsic viscosity and refractive index also being evaluated. A phosphine oxide containing monomer, bis(3-aminophenyl)phenyl phosphine oxide (mDAPPO) and a commercial 3,3-diaminodiphenyl sulfone (mDDS) were also used for comparison. The polyimides derived from mDA6FPPO exhibited high T$\sub$g/, excellent solubility and low birefringence.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.1
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• pp.51-54
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• 2002

Polymer EL devices of glass/ITO/PI/MEH-PPV/Al structure were fabricated using spin coating and the Ionized Cluster Beam deposition technique. PMDA-ODA type thin polyimide films which can be used as a impurity blocking layer of EL device were deposited by ICB. According to our previous results, the packing densities of polyimide films were subject to change and depend on their deposition condition. By inserting a Pl layer with various thickness and packing density, I-V characteristics and life time of the devices were investigated to determine the role of a interlayer. The blocking of impurity diffusion from ITO to luminescent layer were confirmed by XPS.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05a
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• pp.6-6
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• 1992

Ionized cluster beam deposition (ICBD) technique has been employed to fabricate high-purity crystalline polyimide (PI) film. The pyromellitic dianhydride (PMDA) and oxydianiline (ODA) were deposited using dual ICB sources, Fourier trans forminfraredspectroscopy (FT-IR), X-ray photoemission spectroscopy (XPS), and Transmission electron microscopy (TEM)study show that the bulk and surface chemical properties and the crystalline structure are very sensitive to the ICBD conditions such as cluster ion acceleration voltage and ionization voltage, At optimum ICBD conditions, the PI films have a maximum imidization, negligible impurities(∼1% isoimide), and a good crystalline structure probably due to the high surface migration energy and surface cleaning effect. These characteristics are superior to those of films deposited by other techniques such as colvent cast, vapowr deposition, or sputtering techniques.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.12
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• pp.2624-2630
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• 2002

Organic/inorganic hybrid materials have rapidly become a fascinating research field. In this study, $polyimide/TiO_2$ composites were synthesized from nano-sized anatase $TiO_2$ and two types of polyimide, that is, BPDA-PPD and PMDA-ODA. Nano-sized $TiO_2$ particles were prepared from $TiOEt_4$ solution by the sol-gel method. The synthesized PI/$TiO_2$ composites were characterized by using XRD, TGA, FT-IR, TEM, and Atomic Force Microscope(AFM). $TiO_2$ particles were dispersed well in polyimides and the mechanical and thermal stability of polyimide was improved with $TiO_2$ nano particles.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1639-1641
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• 1996

Polyirnide thin films were fabricated an using vapor deposition polymerization apparatus, and their FT-IR and TGA characteristics were investigated. The peaks of $720cm^{-1}$ and $1380cm^{-1}$ show C=O stretch mode and C-N stretch mode, and that of the cured polyimide at $300^{\circ}C$ were saturated. TGI(Thormogravi metric index) was showed at $459^{\circ}C$ from reaserch of thermal resistivity characteristics by TGA.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.191-192
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• 2000

New copolyimides containing nitrile side group were synthesized from copolymerization of pyromellitic dianhydride, m-phenylene diamine and 3,5-diaminobenzonitrile and subsequent thermal imidization of the resulting poly(amic acid). Crystallinity, glass transition temperature and initial decomposition temperature of copolyimides were almost identical to those of homo polyimide prepared from PMDA and m-PDA. Change of pretilt angle induced by the orientation layer of resulting copolyimide was investigated by using a nitrile-containg nematic liquid crystal cell after rubbing. As the content of polar nitrile group was increased in the copolymer, pretilt angle was increased from $3.65^{\circ}$ to $6.49^{\circ}$. The mechanism of this was speculated as the dipolar interaction between the liquid crystal and nitrile groups in copolyimide.

• Elastomers and Composites
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• v.51 no.2
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• pp.138-146
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• 2016

It is an inconvenience for silica nano-particles to dry again when using it in that they cohere each other through moisture in the air. Acrylamide groups were introduced to improve such inconvenience and copolymerized with silica nano-particles and then we copolymerized again with polyamic acid in order to increase thermal characteristic. Amide block copolymers were prepared using silica and (3-mercaptopropyl) trimethoxysilane (MPTMS) with a siloxane group, using 2,6-Lutidine as a catalyst. Amide block polymers and copolymers were synthesized via ATRP after brominating pyromellitic dianhydride (PMDA) and polyamic acid of methylene diphenyl diamine (MDA), using ${\alpha}$-bromo isobutyryl bromide. Characteristic peaks of copolymer with amide and imide groups and patterns of amorphous polymers were researched by FT-IR and XRD analyses and the analysis of surface characteristic groups was conducted via XPS. A change in thermal properties was examined through DSC and TGA and solubility for solvents was also researched.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.45 no.3
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• pp.380-385
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• 1996

Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c $m_{-1}$. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.

• Proceedings of the KAIS Fall Conference
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• 2006.11a
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• pp.269-271
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• 2006

Pyromellitic anhydride(PMDA)와 4,4-Oxydianiline(ODA)로부터 Polyimide의 전구체인 Poly(amic acid)(PAA)를 합성하고, 이를 열을 가하여 Polyimide되는 반응을 적외선 분광법을 이용하여 추적하였다. 이미드화 반응은 $175^{\circ}C$에서 1시간, $185^{\circ}C$에서 1시간, $195^{\circ}C$에서 1시간, $215^{\circ}C$에서 1시간, $235^{\circ}C$에서 1시간 경화시킴으로 완결됨을 확인하였다.

• Polymer(Korea)
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• v.36 no.3
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• pp.275-280
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• 2012

Poly(amic acid)s were successfully synthesized from 1,4-bis(4-aminophenoxy)benzene (1,4-APB) or 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) with pyromellitic dianhydride (PMDA), 3,3'-4,4'-benzopenonetetracarboxylic dianhydride (BPDA) and $p$-phenylenediamine ($p$-PDA) and then they were effectively converted into polyimide films by thermal imidization. The chemical structure and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FTIR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer, dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The moisture absorption, thermal and mechanical properties of polyimide films decreased with increasing the amount of 1,4-APB and HFBAPP. The polyimide films using HFBAPP showed lower properties than that of 1,4-APB at the same ratio, but it displayed better thermal properties and lower moisture absorption at the similar coefficient of thermal expansion (CTE) with a copper. On the basis of our finding, it is concluded that 4-component polyimide films could be utilized for base films for flexible copper clad laminates (FCCL) of flexible printed circuit boards.