• Progress in Superconductivity
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• v.3 no.1
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• pp.49-55
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• 2001

Josephson junction arrays were fabricated by DC magnetron sputtering, self-aligning and reactive ion etching technique. The Al native oxide, formed by thermal oxidation, was used as the tunneling barrier of Nb/$Al-A1_2$$O_3$Nb trilayer. The arrays have 2,000 Josephson junctions with the area of $14\mu\textrm{m}$ $\times$ $46\mu\textrm{m}$. The gap voltages were in the range of 2.5 ~2.6 mV and the spread of critical current was $\pm$11~14%. When operated at 70~94 ㎓, the arrays generated zero-crossing steps up to 2.1~2.4 V. To improve transmission of microwave power and prevent diffusion of oxygen into Nb ground-plane while depositing $SiO_2$dielectric, we applied a plasma nitridation process to the Nb ground-plane. The microwave power was well propagated in Josephson junction arrays with nitridation. The difference in microwave transmission 7an be interpreted by the surface impedance change depending on nitridation.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.168-168
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• 2011

정보화 사회가 도래함으로 개인별 정보 이용량이 급격히 증가하였고 스마트폰과 같은 모바일 기기의 개발로 정보 이용량이 최고치를 갱신 중이다. 이러한 흐름 속에 사람들은 빠른 처리 속도와 고도의 저장 능력을 요구하게 되고 이에 따라 새로운 Random Access Memory에 대한 연구가 활발히 진행되고 있다. 현재 Dynamic Random Access Memory (DRAM)가 눈부신 발전과 성과를 이룩하고 있지만 전원 공급이 중단 될 경우 저장된 내용들이 지워진다는 단점을 가지고 있다. DRAM의 장점에 이러한 단점을 보완할 수 있는 차세대 반도체 소자로 주목 받고 있는 것이 Magnetic Random Access Memory (MRAM)이다. DRAM에서 Capacitor와 유사한 기능을 하는 MTJ stack은 tunneling magnetoresistance (TMR) 현상을 나타내는 자기저항 박막을 이용하여 MRAM 소자에 집적된다. 본 연구에서는 MRAM의 자성 재료로 구성된 MTJ stack을 효과적으로 식각하고 우수한 식각 profile을 얻는 동시에 재증착의 문제를 해결하는데 목적을 둔다. 본 IrMn 자성 박막의 식각 연구는 유도결합 플라즈마 반응성 이온 식각 (Inductively Coupled Plasma Reactive Ion Etching: ICPRIE)법을 이용하여 진행되었다. 특히 본 연구에서는 종래의 $Cl_2$, $BCl_3$ 그리고 HBr과 같은 부식성 가스가 아닌 부식성이 없는 $CH_4$가스를 선택하여 그 농도를 변화시키면서 식각하였고 더 나아가 $O_2$를 첨가하면서 그 효과를 극대화하려고 시도하였다. IrMn 자성 박막의 식각 속도, TiN 하드 마스크에 대한 식각 선택도 그리고 profile 등이 조사되었고 최종적으로 X-ray photoelectron spectroscopy (XPS)를 이용하여 식각 메카니즘을 이해하려고 하였다.

• Journal of Surface Science and Engineering
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• v.36 no.5
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• pp.418-422
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• 2003

평판형 유도결합 플라즈마 식각장비(inductively coupled plasma etcher)를 이용하여 각종 공정조건들에 따른 GaAs의 식각특성을 연구하였다. 공정변수들은 ICP 소스파워(0-500 W), RIE 척파워(0-150 W), 가스 종류($BCl_3$, $BCl_3$/Ar, $BCl_3$/Ne) 및 가스혼합비였다. $BCl_3$ 가스만을 이용하여 GaAs를 식각한 경우보다 25%의 Ar이나 Ne같은 불활성 기체를 혼합한 $15BCl_3$/5Ar, $15BCl_3$/5Ne 가스를 이용한 경우의 식각률이 더 우수한 것을 확인하였다. 그리고 50% 이하의 Ar이 혼합된 $BCl_3$/Ar의 경우는 높은 식각률 (＞4,000 $\AA$/min)과 평탄한 표면(RMS roughness : ＜2 nm)을 얻을 수 있었지만 지나친 양(＞50%)의 Ar의 혼합은 오히려 표면을 거칠게 하거나 식각률을 떨어뜨리는 결과를 가져왔다. 그리고 20 sccm $BCl_3$, 100 W RIE 척파워, 300 W ICP 소스파워, 공정압력이 7.5 mTorr인 조건에서의 GaAs의 식각결과는 아주 우수한 특성(식각률: ∼ 4,000, $\AA$/min, 우수한 수직측벽도: ＞$87^{\circ}$, 평탄한 표면: RMS roughness : ∼0.6 nm)을 나타내었다.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.85-87
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• 2000

In this study, high-density plasma etching characteristics of ITO(indium tin oxide) films used for transparent electrodes in display devices have been investigated. The etch characteristics of ITO as a function of $Ar/CH_4$ gas mixtures were analyzed using QMS(quadrupole mass spectrometry), OES(optical emission spectroscopy), and ESP(electrostatic probe). ITO etch rates were increased with the addition of moderate amount of $CH_4$ to Ar due to the increased chemical reaction between $CH_3$ or H and ITO in addition to the physical sputtering of ITO by Ar ion bombardment. However, the addition of excess amount of $CH_4$ decreased the ITO etch rates possibly due to the increased polymer formation on the ITO surface. Also, the measurement data obtained by QMS and OES suggested that $CH_3$ radicals are more activity involved in the etching of ITO compared to H radicals.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.12
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• pp.1016-1020
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• 2002

Ru thin films were etched using CF/$_4$O$_2$ plasma in an ICP (inductively coupled plasma etching) system. The maximum etch rate of Ru thin films was 168 nm/min at a CF$_4$/O$_2$ gas mixing ratio of 10 %. The selectivity of SiO$_2$ over Ru was 1.3. From the OES (optical emission spectroscopy) analysis, the optical emission intensity of the O radical had a maximum value at 10% CF$_4$ gas concentration and drcrease with further addition of CF4 gas, but etch slope was enhanced. From XPS (x-ray photoelectron spectroscopy) analysis, the surface of the etched Ru thin film in CF$_4$/O$_2$ chemistry shows Ru-F bonds by the chemical reaction of Ru and F. RuF$_{x}$ compounds were suggested as a surface passivation layer that reduces the chemical reactions between Ru and O radicals. From a FE-SEM (field emission scanning electron microscope) micrograph, we had an almost perpendicular taper angle of 89$^{\circ}$.>.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.8
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• pp.634-639
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• 2001

We investigated the etching characteristics of chromium films by using Cl$_2$/O$_2$ gas mixtures with electron cyclotron resonance plasma. In order to examine the chemical etch characteristics of Cr films by using Cl$_2$/O$_2$ gas plasma, we obtained the etch rate with various gas mixing ratios. By X-ray photoelectron spectroscopy, the surface reaction on the chromium films during the etch was examined. From narrow scan analyses of Cr, Cl, and O, it was confirmed that a chromium oxychlorie (CrCl$_{x}$O$_{y}$) layer was formed on the surface by the etch using Cl$_2$/O$_2$ gas mixtures. We observed a new characteristic emission line during the etch of chromium films using Cl$_2$/O$_2$ gas mixtures by an optical emission spectroscopy. It was found that the peak intensity of this emission line had a tendency compatible with the etch rate. The origin of this emission line was discussed in detail. At the same time, the etched profile was also examined by scanning electron microscope.e.e.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1268-1270
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• 1994

Fine lithographic technology in a submicron design regime is necessary for the fabrication of VLSI circuits. In such lithography, fine pattern delineation is performed by electron beam, ion beam and X-ray lithography instead of photolithography. Therefore, the new resist materials and development method have been required. So, we are investigating another positive E-beam resists which have high sensitivity and dry etching resistance, Plasma co-polymerized resist was prepared using an interelectrode gas-flow-type reacter. Methymethacrylate, tetramethyltin and styrene were chosen as the monomer to be used. The delineated pattern in the resist was developed with gas-flow-type reactor using an argon and 02 as etching gas. We studied about the effects of discharge power and mixing rate of the co-polymerized thin :film. The molecular structure of thin film was investigated by ESCA and IR, and then was discussed in relation to its quality as a resist.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.2
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• pp.93-99
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• 2006

In this paper, we fabricated and evaluated polydimethylsiloxane(PDMS)-based flexible and implantable micro electrodes. The electrode patterning was carried out with the photolithography and chemical etching process after e-beam evaporation of 100 ATi and 1000 A Au. The PDMS substrate was treated by oxygen plasma using reactive ion etching(RIE) system to improve the adhesiveness of PDMS and metal layers. The minimum line width of fabricated micro electrode was 20 $\mu$m. After finished patterning, we did packaging with PDMS and then brought up the electrode's part about 40 $\mu$m with gold electroplating. The Hank's balanced salt solution(HBSS) test was carried out for 6 month for endurance of fabricated micro electrode. We carried out in-vivo test for the evaluation of biocompatibility by implanting electrodes under the ICR mouse skin for 42 days.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.75-80
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• 2013

Cathode is an essential component used in plasma etching process which is to make micro pattern on the silicon wafer. The currently used cathodes produce particles at the high temperature plasma etching process. To overcome this problem, a 'Silicon Only Cathode' was developed. This 'Silicon Only Cathode' requires manufacturing process changes due to the change of shapes, material features, and machining characteristics of work materials. This research investigates the small hole drilling process. The conclusion is that PCD drills with twist angles of $20^{\circ}$ and $25^{\circ}$ were tested for small hole drilling and the experimental results indicate that the drill with $25^{\circ}$ twist angle drill causes less thrust force.

• Journal of Magnetics
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• v.6 no.3
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• pp.90-93
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• 2001

Co/$Al_O_3$/NiFe and CO/$Al_O_3$/Co tunnel junctions were fabricated by a radio frequency magnetron sputtering at room temperature with hard mask on glass and $4^{\circ}$ tilt cut Si (111) substrates. The barrier layer was formed through two steps. After the Al layer was deposited, it was oxidized in the chamber of a reactive ion etching system (RIE) with $O_2$plasma at various conditions. The dependence of the TMR value and junction resistance on the thickness of Al layer (before oxidation) and oxidation parameters were investigated. Magnetoresistance value of 7% at room temperature was obtained by optimizing the Al layer thickness and oxidation conditions. Circular shape junctions on $4^{\circ}$tilt cut Si (111) substrate showed 4% magnetoresistance. Photovoltaic energy conversion effect was observed with the cross-strip geometry junctions on Si substrate.