• Title/Summary/Keyword: PF-5060

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Study on the cooling performance of discrete heat sources using coolants (냉각제들에 따른 불연속 발열체의 냉각성능 연구)

  • 최민구;조금남
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.11 no.2
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    • pp.224-235
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    • 1999
  • The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

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Characteristics of Cooling for the Adjacent Double Micro-Porous Coated Surfaces in PE5060 (마이크로다공성 코팅된 인접 복수 발열체에 대한 PF5060의 냉각 특성)

  • Kim Tae-Gyun;Kim Yoon-Ho;Lee Kyu-Jung
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.7 s.250
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    • pp.646-655
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    • 2006
  • The present research is an experimental study on characteristics of cooling behavior for the adjacent copper blocks with surface roughness or micro-porous coated surface. The experiments were carried out at saturation state or within subcooled states of PF5060. The effects of heater orientation and the intervals between heating surfaces or substrates were investigated under various heat flux conditions. The boiling performance of copper block with micro-porous coated surface was better than that of copper block with surface roughness. It is understood that the bubble sweeping enhances boiling performance for the heaters with inclinations of $\theta=45^{\circ}\;and\;\theta=90^{\circ}$, where as the bubble flattening decreases boiling performance for the heaters with inclinations of $\theta=135^{\circ}\;and\;\theta=180^{\circ}$. In comparison to upper heater and below heater with orientation, the upper heater has lower superheat temperature than the below heater due to the bubble sweeping. It is also found that boiling performance decreases in the case of adjacent double heaters with only 0.2cm substrate interval.

An Experimental Study on Boiling Heat Transfer of PF5060 on the Shape and Orientation of Micro-Fin Surfaces (마이크로휜 표면과 발열체 기울기에 따른 PE5060의 비등 열전달에 관한 실험적 연구)

  • Kim Yoon-Ho;Kim Choong;Lee Kyu-Jung;Kim Youngchan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.1 s.244
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    • pp.74-81
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    • 2006
  • Experiments to measure the pool boiling heat transfer on the micro-fin surfaces were performed with PF5060. The effects of various orientation and subcooling of heat surface on pool boiling performance were investigated under various heat-flux conditions for plain and micro-fin surfaces. The comparison between the results of this study and those of previous work shows a similar trend at the same conditions. From the results, it is proved that nucleate boiling performance is strongly dependent on the orientation, the micro-fin structure and the subcooling of heat surface. The heat flux on the surface with orientation angles of $45^{\circ}$ and $90^{\circ}$ was larger than that on horizontal surface(${\theta}=0^{\circ}$) at same wall superheat because of the effect of bubble sweeping. The nucleate boiling performance of micro-fin surfaces is enhanced by decreasing the fin size(WxL) and the pitch, respectively. The subcooling makes nucleate boiling performance lower for both micro-fin and plain surfaces.

Influence of an Aspect Ratio of Rectangular Channel on the Cooling Performance of a Multichip Module

  • Choi, Min-Goo;Cho, Keum-Nam
    • Journal of Mechanical Science and Technology
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    • v.14 no.3
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    • pp.350-357
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    • 2000
  • Experiments were performed by using PF-5060 and water to investigate the influence of an aspect ratio of a horizontal rectangular channel on the cooling characteristics from an in-line $6{\times}1$ array of discrete heat sources which were flush mounted on the top wall of the channel. The experimental parameters were aspect ratio of rectangular channel, heat flux of simulated VLSI chip, and channel Reynolds number. The chip surface temperatures decreased with the aspect ratio at the first and sixth rows, and decreased more rapidly at a high heat flux than at a low heat flux. The measured friction factors at each aspect ratio for both water and PF-5060 gave a good agreement with the values predicted by the modified Blasius equation within ${\pm}7%$. The Nusselt number increased as the aspect ratio decreased, but the increasing rate of Nusselt number reduced as the aspect ratio decreased. A 5:1 rectangular channel yields the most efficient cooling performance when the heat transfer and pressure drop in the test section were considered simultaneously.

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An Experimental Study on Direct Cooling Performance using Pool Boiling from Micro-Porous Coated Surface (마이크로다공성 코팅된 발열체에서의 풀비등 직접냉각 성능에 관한 실험적 연구)

  • Kim, Tae-Gyun;Lee, Kyu-Jung;Kim, Yong-Chan;Park, Chan-Sung
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1353-1358
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    • 2004
  • An experimental study of pool boiling behavior on micro-porous enhanced square heater surfaces immersed in PF5060 is performed. The effects of heater orientation, Subcooling and substrate distance on the pool boiling heat transfer performance for the double heaters were investigated under increasing heat-flux conditions. The boiling performance of micro-porous coated surface was better than that of plain surface. The double heaters with upper substrate of 0.2cm substrate interval have lower boiling performances compared with the results for the double heaters with that of 0.5cm and 1.0cm substrate interval and without the substrate. In comparison to upper heater and below heater with orientation, the upper heater has lower superheat temperature than the below heater due to the bubble sweeping.

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A Study on the Condenser Temperature Characteristics of a Disk Type Heat Pipe (원판형 히트파이프의 응축부 온도 특성에 관한 실험적 연구)

  • Boo, Joon-Hong;Chung, Won-Bok;Kim, Tae-Gyu
    • Proceedings of the KSME Conference
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    • 2000.04b
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    • pp.148-153
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    • 2000
  • An experimental study was conducted to investigate an isothermal characteristics of the condenser surface of disk type heat pipe using PF 5060 and FC 40 as working fluids. Desired temperature range at the condenser surface was $90^{\circ}C{\sim}130^{\circ}C$, which was cooled by natural convection. The operating temperature, the height of vapor space, the wall thickness of condenser, and the existence of a wick structure were considered as experimental factors. The temperature difference and the temperature fluctuation at the condenser surface were analysed to describe the performance of the heat pipe.

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Thermal Performance of Cooling System for a Laptop Computer Using a Boiling Enhancement Microstructure (비등 촉진 마이크로 구조물을 이용한 휴대용 컴퓨터 냉각시스템의 열성능에 관한 연구)

  • Cho, N.H.;Jeong, W.Y.;Park, S.H.
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2043-2052
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    • 2008
  • The increasing heat generation rates in CPU of notebook computers motivate a research on cooling technologies with low thermal resistance. This paper develops a closed-loop two-phase cooling system using a micropump to circulate a dielectric liquid(PF5060). The cooling system consists of an evaporator containing a boiling enhancement microstructure connected to a condenser with mini fans providing external forced convection. The cooling system is characterized by a parametric study which determines the effects of volume fill ratio of coolant, existence of a boiling enhancement microstructure and pump flow rates on thermal performance of the closed loop. Experimental data shows the optimal parametric values which can dissipate 33.9W with a film heater maintained at $95^{\circ}C$.

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Thermal Characteristics of Discrete Heat Sources Using Coolants

  • Choi, Min-Goo;Cho, Keum-Nam
    • International Journal of Air-Conditioning and Refrigeration
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    • v.9 no.1
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    • pp.1-10
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    • 2001
  • The present study investigated the effects of experimental parameters on the thermal characteristics of an in-line 6x1 array of discrete heat sources for a test multichip module using water, PF-5060 and paraffin slurry. The parameters were heat flux of 10-40W/$cm^2$. Reynolds number of 3,000~20,000 and mass fraction up to 10% for paraffin slurry The size of paraffin slurry was within 10~40$\mu$m before and after experiments. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row (five or seven times of the chip length) and the paraffin slurry showed effective cooling performance at the high heat flux The paraffin slurry with the mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section are considered simultaneously. The experimental data at the fourth and sixth rows are best agreed with the values predicted by the Malina and Sparrow`s correlation among other correlations, and the empirical correlations for water and 5% paraffin slurry were obtained at the first and sixth rows when the channel Reynolds number is over 3,000.

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