• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.4
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• pp.871-876
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• 2005

Theme park automation system is developed by using the RFID sensor reader, IIS web server, ASP.NET and MSSQL database in this paper. Its operation is that park entrance people checked automatically when he who possessed the ta8 passed the reader acquisition bound and its tag information is sent to the host computer through the RS-232 data acquisition system. Tag information and time data will be stored in the RFID database tables and reused to extract and distribute the entrance people for the purpose of each arrangement of each entertainment devices. First of all, we developed interface program between host and reader and then, programmed the related web site and database connection function using ASP.NET with $C\#$ and MSSQ. We also design and make an production of external Ant. to extend the acquisition range up to $30\~40$ cm using copper PCB plate. We confirmed the performance through the RFID test bed site.

• Journal of Korean Society for Atmospheric Environment
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• v.22 no.E1
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• pp.35-43
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• 2006

Ambient particle size distributions of PCBs and their dry deposition fluxes were measured at a site in Seoul to quantify dry deposition fluxes of PCBs and size characteristics of PCBs in the air, and to estimate ambient concentrations of gaseous PCBs and dry deposition fluxes. The dry deposition plate was used to measure dry deposition fluxes of particulate mass and PCBs and a cascade impactor and rotary impactor were used to measure ambient particle size distributions for small ($D_p<9{\mu}m$) and large ($D_p>9{\mu}m$) particles, respectively. Six sample sets were collected from April to July 1999. The fluxes of particulate total PCBs (the sum of 43 congeners) ranged from 160 to $607ng\;m^{-2}day^{-1}$. The size distribution of total PCBs was bimodal with two peaks in small particle size ($D_p{\sim}0.6\;and\;6{\mu}m$, respectively) and, thus, mass concentration being dominant in small particles. The mean particulate PCBs concentration was $6.9{\mu}g$ PCBs/g. The concentrations of PCB homologues in the gas phase were estimated based on the particle/gas partition coefficient ($K_p$) with the measured values of particulate PCBs in this study and they were comparable to those observed in other previous studies. Dry deposition fluxes were estimated by calculating dry deposition velocities.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.2
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• pp.143-149
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• 2022

PCS needs to freely switch AC and DC to connect the battery, external AC loads and renewable energy in both directions for energy efficiency. Whenever converting happens, power loss inevitably occurs. Minimization of the power loss to save electricity and convert it for usage is a very critical function in PCS. PCS plays an important role in the ESS(Energy Storage System) but the importance of stabilizing semiconductors on PCB(Printed Circuit Board) should be empathized with a risk of failure such as a fire explosion. In this study, the temperature variation inside PCS was reviewed by cooling fan on top of PCS, and the vibration characteristics of PCS were analyzed during truck transportation for reliability of the product. In most cases, a cooling fan is mounted to control the inner temperature at the upper part of the PCS and components generating the heat placed on the internal aluminum cooling plate to apply the primary cooling and the secondary cooling system with inlet fans for the external air. Results of CFD showed slightly lack of circulating capacity but simulated temperatures were durable for components. The resonance points of PCS were various due to the complexity of components. Although they were less than 40 Hz which mostly occurs breakage, it was analyzed that the vibration displacement in the resonance frequency band was very insufficient. As a result of random-vibration simulation, the lower part was analyzed as the stress-concentrated point but no breakage was shown. The steel sheet could be stable for now, but for long-term domestic transportation, structural coupling may occur due to accumulation of fatigue strength. After the test completed, output voltage of the product had lost so that extra packaging such as bubble wrap should be considered.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.6
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• pp.13-19
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• 1995

A dual purpose robot automation system is developed for both arc welding and spot welding by one robot within a cell. The need for automation of both arc welding and spot welding processes is urgent while the production volume is not so big as to accommodate separate stations for the two processes. Also, space is too narrow for separate stations to be settled down in the factory. A spot welding robot is chosen and the functions for arc welding are implemented in-house at cost of advanced functions. For the spot welding, a single pole type gun is used and the robot has to push down the plate to be wolded, which causes the robot positioning error. Therefore, position error compensation algorithm is developed. The basic functions for the arc welding processes are implemented using the digital I/O board of robot controller, PLC, and A/D conversion PCB. The weaving pattern is taught in meticulously by manual teach. A fixture unit is also developed for dual purpose. The main aspects of the system is presented in this paper especially in the design and implementation procedure. The signal diagrams and sequence logic diagrams are also included. The outcome of the dual purpose welding cell is the increased productivity and good production stability which is indispensable for production volume prediction. Also, it leads to reduction of manufacturing lead time.

• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.154-154
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• 2006

Samsung Electro Mechanics ink jet has developed ultra high resolution alignment system. The alignment system has been developed for repeatable printing of conductive ink. The resolution of alignment system is 0.5um and the velocity of printing working plate is 1.5m/s. So far repeated printing results included sintering process have over 30um of drop mislocation data. In order to improve line thickness and conductivity of metal line, we need to develop the higher mechanical accurate align system. On the demand, this developed align system has under $1{\sim}2{\mu}m$ mispositioning performance and can measure of mechanical accuracy of inkjet printer, as well as the straightness of jetted drop from inkjet head. There is no kinds limit of substrate and ink to use SEM alignment system. By using this alignment system, we progress two experiment of reiterate printing drop and making conductive line on the glass and photo paper. Optical microscope and 3D profiler has been used for measurement of printed ink.