• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.323-325
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• 1997

Conventionally it is asummed that the microstrip line conductor has a rectangular cross-section. but the additive and substactive processes used to create conductors for PCBs produce a conductor of approximately Trapezoidal cross-section. For wide Strip line, the thickness and edge effect will be small since most of capacitance is parallel plate rather than fringing and we can ignore the cross-section. For narrow strip lines, the edge effect become immportant. So in this paper, we measure the chracteristic impedance of microstripline by Vector Analyzer and simulate the electromagnetic field of microstripline using finite element method with edge angle.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.272-277
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• 2003

This paper reports the fluid flow and heat transfer around a module cooled by forced air flow generated by a piezoelectric(PZT) cooling fan. A flexible PZT fan with distortion in a fluid transport system of comparatively simple structure which was mounted on a PCB in a parallel-plate channel($450{\times}80{\times}700mm^3$) accelerates surrounding fluid locally. Input voltages of 20-100V and a resonance frequency of 23Hz were used to vibrate the cooling fan. Input power to the module was 4W. The cooling effect using a PZT fan was larger than that of free convection. Fluid flow around the module were visualized by using PIV system. The temperature distribution around heated module were visualized by using liquid crystal film(LCF). We found that the flow type was y-shaped and the cooling effect was increased by the wake generated by a piezoelectric cooling fan.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.4
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• pp.473-480
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• 2020

In this paper, we proposed a high frequency equivalent circuit considering parasitic impedance components for differential noise analysis on the input stage during DC-DC buck converter switching operation. Based on the proposed equivalent circuit model, we presented a method to measure parasitic impedance parameters included in DC bus plate, IGBT, and PCB track using the gain phase method of a network analyzer. In order to verify the validity of this model, a DC-DC prototype consisting of a buck converter, a signal analyzer, and a LISN device, and then resonance frequency was measured in the frequency range between 150 kHz and 30 MHz. The validity of the parasitic impedance measurement method and the proposed equivalent model is verified by deriving that the measured resonance frequency and the resonance frequency of the proposed high frequency equivalent model are the same.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.7
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• pp.63-71
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• 2018

A flower support was developed for real flower decoration automation production system using an ultrasonic wave sealer to automatically produce a system. Because a flower support for real flower decoration that was produced manually could not meet the needs of the consumers, this study developed an automated manufacturing system to increase productivity. A flower support for real flower decoration was constructed using a cap consisting of plastic and plate made from non-woven fabric. The guide was designed to transport the cap to the ultrasonic wave sealer and optimal guide was developed from the test according to the material and shape. To produce the entire system, the guides and accessories were weighed and appropriate motors and pulleys were calculated. Control of the automation production system was based on a PCB board, which increased the reliability and security, and a remote controller with manual and automatic modes was prepared. After development, tests of the transfer precision and repetition accuracy revealed an X-axis of 2.7mm, a Y-axis of 1 mm, and a repetition of 0 mm. The productivity was also checked. The automated machine worked 8 hours/day to make 35 supports and 70 Therefore, the automatic system produces 200% more output than manual work

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.20.2-20.2
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• 2010

Recently inkjet printing technology has been developed in the areas of low cost fabrication in environmentally friendly manufacturing processes. Although inkjet printing requires the interdisciplinary researches including development of materials, manufacturing processes and printing equipment and peripherals, manufacturing a printhead is still core of inkjet technology. In this study, a piezoelectric driven DOD (drop on demand) inkjet printhead has been fabricated on three layers of the silicon wafer in MEMS Technology because of its chemical resistance to industrial inks, strong mechanical properties and dimensional accuracy to meet the drop volume uniformity in printed electronics and display industries. The flow passage, filter and nozzles are precisely etched on the layers of the silicon wafers and assembled through silicon fusion bonding without additional adhesives. The piezoelectric is screen-printed on the top the pressure chamber and the nozzle plate surface is treated with non-wetting coating for jetting fluids. Printheads with nozzle number of 16 to 256 have been developed to get the drop volume range from 5 pL to 80 pL in various industrial applications. Currently our printheads are successfully utilized to fabricating color-filters and PI alignment layers in LCD Flat Panel Display and legend marking for PCB in Samsung Electronics.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.7
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• pp.780-788
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• 2004

This paper reports the fluid flow and heat transfer around a module cooled by forced air flow generated by a piezoelectric(PZT) cooling fan. The fluids are locally accelerated by a flexible PZT fan which deflects inside a fluid transport system of comparatively simple structure mounted on a PCB in a parallel-plate channel(450${\times}$80${\times}$700㎣). Input voltages of 20-100V and a resonance frequency of 23㎐ were used to vibrate the cooling fan. Input power to the module was 4W. The fluid flow around the module was visualized by using PIV system. The temperature distributions around a heated module were visualized by using liquid crystal film(LCF). The cooling effect using a PZT fan was independent of the vent area ratios at the channel inlet and was similar to the forced convection cooling. We found that the flow type was Y-shape and the cooling effect was increased by the wake generated by a piezoelectric cooling fan.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.30-36
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• 2013

An FFD(flexible fine die) is an embossed mold that consists of a thin plate ranging from 0.6 to 3 mm in thickness. FFDs are primarily used for cutting LCD films and F-PCB sheets. In the high-speed micro-milling process of flexible fine dies, the lubrication and cooling of the cutting edges is very important from the aspect of eco machining and cutting performance. In this paper, a comparative study of tool wear and surface roughness between cutting fluid and hybrid lubrication for eco-machining of FFD was conducted for processes of high-speed machining of highly hardened material (STC5, HRC52). Especially, the incorporated fluid method for eco machining, in which the cutting performances can be simultaneously measured, was introduced. The machining results show that hybrid lubrication, instead of conventional cutting fluid, leads to excellent tool wear and surface roughness and represents the proper conditions for eco micro-machining of flexible fine dies.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.4
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• pp.73-80
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• 2004

A dual purpose robot automation system is developed for both arc welding and spot welding by one robot within a cell. The need for automation of both arc welding and spot welding processes is urgent while the production volume is not so big as to accommodate separate station for the two processes. Also, space is too narrow for separate station to be settled down in the factory. A spot welding robot is chosen and the function for arc welding are implemented in-house at cost of advanced functions. For the spot welding, a single pole type gun is used and the robot has to push down the plate to be welded, which causes the robot positioning error. Therefore, position error compensation algorithm is developed. The basic functions for the arc welding processes are implemented using the digital I/O board of robot controller, PLC, and A/D conversion PCB. The weaving pattern is taught in meticulously by manual teach. A fixture unit is also developed for dual purpose. The main aspects of the system is presented in this paper especially in the design and implementation procedure. The signal diagrams and sequence logic diagrams are also included. The outcome of the dual purpose welding cell is the increased productivity and good production stability which is indispensable for production volume prediction. Also, it leads to reduction of manufacturing lead time.