• 한국기계가공학회지
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• 제12권6호
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.

• 한국CDE학회논문집
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• 제20권3호
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• pp.291-297
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• 2015

A water jet cleaning robot system for micro drill bits is to refurbish micro drill bits used for the PCB manufacturing process. It can refurbish drill bits with the minimum diameter of ${\phi}0.15{\sim}0.075mm$ of which the total quantity have been discarded before. Micro drill bits with the minimum diameter of ${\phi}0.075mm$ can be cleaned by applying the water jet cleaning robot system out of the manual ultrasonic cleaning in the past for the cleaning equipment as the initial process in refurbishing. This study analyzed problems, while applying the apparatus mechanism for the workability such as the robot traces of Transfer Robot I and II, drill bit loading and unloading, and cleaning tasks in the water jet cleaning robot system in an effort to carry out simulations. In addition, the cleaning work process was optimized as the work process was verified in advance and the production quantity was analyzed through simulations.

• 대한기계학회논문집A
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• 제21권8호
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• pp.1339-1347
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• 1997

The automation of final inspection and tuning process in the manufacturing of electric products is hot issue now, because it is the only part that has not been wholey automized yet, mainly due to the difficulties to handle so small size of VR which is the final tuning point in the most of electric products. For the automation of this process, at first the accurate measurement of position and orientation of SMD VR on PCB in real time is strongly needed. In this paper, a new image processing algorithm to detect the center position and orientation of target VR by using machine vision is proposed for automatic final tuning of the 8mm camcoder's performance. In the method, the outline feature of object is used actively. The usefulness of the proposed methods were tested by several experiments, and the results showed enough accuracy for both of position and orientation. Additatively, we discussed about the total visual system construction and preprocessing of image.

• 한국정밀공학회지
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• 제16권2호통권95호
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• pp.39-49
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• 1999

This paper describes the development of a vision-aided position and orientation recognition system for automatically adjusting electronic tuners which control the waveform by rotating variable resisters. The position and orientation recognition system estimates the center and the angle of the tuner grooves so that the main controller may correct the difference from the ideal position and thereby manipulate the variable resisters automatically. In this paper a robust algorithm is suggested which estimates the center and the angle of the tuner grooves fast and precisly from the source image with lighting variance and video noise. In the algorithm morphological filtering, 8-chain coding, and invariant moments are sequentially used to figure out image segments concerned. The performance of the proposed system was evaluated using a set of real specimens. The results indicate the system works well enough to be used practically in real manufacturing lines. If the system adopts a high speed frame grabber which enables real time image processing, it can also be applied to positioning of robot manipulators as well as automated PCB adjusters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.202-202
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• 2008

The world gross market of many kinds of electronics, such as TV and mobile phone has been increasing rapidly these days. It is mainly caused by the amazing developments of IT technology during past decade and the changes of individual life style for the better. Thanks to the increases of electronics manufactured in quantity, much more electronic components such as MLCC (multi layer ceramic capacitor) and PCB (printed circuit board), which are our main products, have been needed as a consequence. Though it was reported that total market of electronic components exceeds several hundreds of billion dollars, there are many manufactures struggling for survival in the competition of electronics components. Then the recognition of quality as a key technology has spread and the efforts for high-yield production lines have been kept in many companies. In this paper, our efforts to eliminate the contamination of particles and the diffusion of some volatile organic compounds which is very harmful to workers at production line have been introduced.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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• pp.505-508
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• 2006

An electrostatic ink jet head can be used for manufacturing processes of large display systems and printed circuit boards (PCB) as well as inkjet printers because an electrostatic field provides an external force which can be manipulated to control sizes of droplets. The existing printing methods such as thermal bubble and piezo inkjet heads have shown difficulties to control the ejection of the droplets for printing applications. Thus, the new inkjet head using the electrostatic force has been proposed in this study. In order to prove the theory of the developed electrostatic ink jet head, the applicable and basic theory has been studied using distilled water and water with sodium dodecyl surfate (SDS). Also, a numerical analysis has been performed to calculate the intensity of the electrostatic field using the Maxwell's equation. Furthermore, experiments have been carried out using a downward glass capillary with outside diameter of $500{\mu}m$. The gravity, surface tension, and electrostatic force have been analyzed with high voltages of 0 to 5kV. It has been observed that the droplet size decreases and the frequency of the droplet formation and the velocity of the droplet ejection increase with increasing the intensity of the electrostatic field. The results of the experiments have shown good agreement with those of numerical analysis.

• 한국가시화정보학회:학술대회논문집
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• 한국가시화정보학회 2007년도 추계학술대회
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• pp.128-133
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• 2007

An electrostatic inkjet head can be used for manufacturing processes of large display systems and printed circuit boards (PCB) as well as inkjet printers because an electrostatic field provides an external force which can be manipulated to control sizes of droplets. The existing printing methods such as thermal bubble and piezo inkjet heads have shown difficulties to control the ejection of the droplets for printing applications. Thus, the new inkjet head has been proposed using the electrostatic force. A numerical analysis has been performed to calculate the intensity of the electrostatic field using the Maxwell's equation. Also, experiments have been carried out to investigate the droplet movement using a downward capillary with outside diameter of $500{\mu}m$. Gravity, surface tension, and electrostatic force have been analyzed with high voltages for a drop-on-demand ejection. It has been observed that the droplet size decreases and the frequency of the droplet formation and the velocity of the droplet ejection increase with increasing the intensity of the electrostatic field using high-speed camera.

• 한국정밀공학회지
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• 제27권3호
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• pp.9-17
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• 2010

The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.

• 한국응용과학기술학회지
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• 제28권2호
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• pp.146-151
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• 2011

In this study, by using oleic acid and polypropylene glycol, good natured antifoaming agent for suitable electronics process under the alkaline conditions were synthesized. For the synthesized mono and diesters, acid value, hydroxyl value was measured, and identified by FT-IR and $^1H-NMR$ spectroscopy. Surface properties such as surface tension, critical micelle concentration(cmc) for diluted aqueous solution was measured, and tested the antifoaming properties according to the difference of alkyl chain length, various concentration, temperature and pH. The surface tension of synthesized antifoaming agent, PPMO(Polypropylene glycol monooleate) was 24.3 dyne/cm, PPDO(Polypropylene glycol dioleate) was 23.7 dyne/cm. By increasing of the alkyl chain length, surface tension was decreased slightly, and showed good antifoaming properties at 0.06 wt% concentration and $50^{\circ}C$, pH 11. These synthesized compounds are expected to apply as a suitable antifoaming agents in the semiconductor and the PCB(Printed Circuit Board) manufacturing process.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.