• 제목/요약/키워드: PCB industry

검색결과 97건 처리시간 0.029초

DBSCAN 기반의 제조 공정 데이터 불량 위치의 검출 (Detection of the Defected Regions in Manufacturing Process Data using DBSCAN)

  • 최은석;김정훈;아지즈 나스리디노프;이상현;강정태;류관희
    • 한국콘텐츠학회논문지
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    • 제17권7호
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    • pp.182-192
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    • 2017
  • 제조 산업은 국가 경제 성장의 원동력으로 그 중요성이 부각되고 있다. 이에 따라 제조 공정상에서 생성되는 제조 데이터 분석의 중요성 또한 조명 받고 있다. 본 논문에서는 PCB(Printed Circuit Board) 제조 공정에서 발생한 로그 데이터를 분석하여 PCB 상에서 빈번하게 발생하는 고장 영역에 대해서 작업자가 고장 영역을 직접 눈으로 볼 수 있도록 시각화하는 방법을 제안한다. 우선 고장 영역을 파악하기 위해서 PCB 공정 데이터 집합에 K-means, DB-SCAN 클러스터링 알고리즘을 적용하여 군집화 하였고, 두 알고리즘 중 더 정확한 고장 영역을 도출하는지 비교하였다. 또한 MVC(Model-View-Controller) 구조 시스템을 개발하여 실제 PCB 이미지 상에 클러스터링 결과를 출력하는 것으로 실제 고장영역을 눈으로 확인할 수 있도록 시각화하였다.

잉크젯 프린팅 기술을 이용한 나노 금속잉크의 인쇄회로기판용 미세배선 형성 (Micro Patterning of Nano Metal Ink for Printed Circuit Board Using Inkjet Printing Technology)

  • 박성준;서상훈;정재우
    • 한국정밀공학회지
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    • 제24권5호
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    • pp.89-96
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    • 2007
  • Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

PCB 산업에서 배출되는 산성 염화동 폐액으로부터 Copper Oxychloride의 제조 및 특성분석 (Preparation and Characterization of Copper Oxychloride from Acidic Copper Chloride Etchant)

  • 김영희;김수룡;정상진;이윤주;어영선
    • 자원리싸이클링
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    • 제12권2호
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    • pp.3-10
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    • 2003
  • PCB (Printed Circuit Board) 산업에서 배출되는 산성 염화동 폐액으로부터 농약원제로 사용이 가능한 고순도의 copper oxycloride를 제조하였다. PCB제조 산업은 구리 소재를 이용한 전자 부품 가공 산업으로서 제조 공정인 부식 과정에서 다량의 구리가 함유된 에칭 폐액이 발생한다. 환경과 경제적인 측면에서 폐액으로부터 구리성분을 재회수하는 기술의 개발은 매우 중요하다. 본 연구에서는 가성소다로 폐액을 중화하여 copper oxychloride를 회수하는 공정의 반응 조건을 확립하였다. 반응 온도 2$0^{\circ}C$-4$0^{\circ}C$, pH 5-7 사이에서 순수한 copper oxychloride제조가 가능하였고 이때 수득율은 95% 이상이었다. 생성물의 물리적 특성을 SEM, XRD, TGA, ICP 그리고 원자 흡수 분광기를 사용하여 분석하였다.

초임계법을 이용한 난분해성 유해물질인 폴리염화비폐닐(PCB)의 무해화 처리에 관한 총설(1) (Letters on Innoxious Treatment of Recalcitrant Nobiodegrable PCB Using Supercritical Method(1))

  • 김정성;박윤열;김성윤
    • 한국환경과학회지
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    • 제9권6호
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    • pp.523-529
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    • 2000
  • Attempts have been made to use Supercritical fluids for industrial purpose in a variety of fields and some of them, are already in practice. However, basic chemical properties of supercritical fluids have not been understood well. The present pater presents the results of physicochemical studies on Supercritical fluids as well as the application of supercritical fluids to industry. The detail is as follows PCB and organic compounds.

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PCB 생산에서 생산성 향상을 위한 최적화 문제들 (Optimization Problems for improving Productivity in Printed Circuit Board Manufacturing)

  • 임석철;김내헌;김형석
    • 산업경영시스템학회지
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    • 제16권28호
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    • pp.1-8
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    • 1993
  • Electrical or electronic products have been becoming smaller and high integrated recently, with printed circuit boards(PCB's) being the key components for these products. The introduction of new technology of surface mounted devices(SMD) opens new ways towards high integration on the PCB. Many plants in eletronical industry which produce high variety of PCB's to meet the demands of customer orders require flexibility in PCB's production lines. This survey paper describes the related optimization problems and solution methods to the automated surface mount technology(SMT) assembly lines, and provides with the research direction for improving flexibility.

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Enhancement of Life Time for PCB (Printed Circuit Board) Drill Bit by Nitrogen Ion Implantation

  • Lee, Chan-Young;Lee, Jae-Sang;Kim, Bum-Suk
    • Transactions on Electrical and Electronic Materials
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    • 제9권5호
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    • pp.206-208
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    • 2008
  • Implantation of metals and ceramics with ions of nitrogen and other species has improved surface properties such as friction, wear and corrosion in numerous industrial applications. In recent years, PCB drills tend to be more minimized increasingly as the electronics components have been more highly accumulated and minimized. Therefore nitrogen ion implantation was performed onto PCB drill (0.15 & 0.3 mm in diameter), in order to investigate mechanical properties of WC-Co cermets surface through Nano-indentation tests. PCB drill was implanted at energy of 70 keV, 90 keV, 120 keV and with the dose range of $1{\times}10^{17}$ and $5{\times}10^{17}\;ions/cm^{2}$. After ion implantation, WC-Co PCB drill bits was tested in actual operating situation to apply cutting tools industry and is concluded that the life time of nitrogen ion implanted PCB drills is one and a half times longer than the unimplanted.

PCB 비파괴 검사에 있어서 단일 에너지 소스와 이중 에너지 소스의 영상비교를 위한 엑스선 스펙트럼 분석 (Energy Spectrum Analysis between Single and Dual Energy Source X-ray Imaging for PCB Non-destructive Test)

  • 김명수;김기윤;이민주;강동욱;이대희;박경진;김예원;김찬규;김형택;조규성
    • 방사선산업학회지
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    • 제9권3호
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    • pp.153-159
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    • 2015
  • Reliability of printed circuit board (PCB), which is based on high integrated circuit technology, is having been important because of development of electric and self-driving car. In order to answer these demand, automated X-ray inspection (AXI) is best solution for PCB non-destructive test. PCB is consist of plastic, copper, and, lead, which have low to high Z-number materials. By using dual energy X-ray imaging, these materials can be inspected accurately and efficiently. Dual energy X-ray imaging, that have the advantage of separating materials, however, need some solution such as energy separation method and enhancing efficiency because PCB has materials that has wide range of Z-number. In this work, we found out several things by analysis of X-ray energy spectrum. Separating between lead and combination of plastic and copper is only possible with energy range not dose. On the other hand, separating between plastic and copper is only with dose not energy range. Moreover the copper filter of high energy part of dual X-ray imaging and 50 kVp of low energy part of dual X-ray imaging is best for efficiency.

데이터마이닝 기법을 이용한 PCB 제조라인의 불량 혐의 공정 및 설비 분석 (Fault-Causing Process and Equipment Analysis of PCB Manufacturing Lines Using Data Mining Techniques)

  • 심현식;김창욱
    • 정보처리학회논문지:소프트웨어 및 데이터공학
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    • 제4권2호
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    • pp.65-70
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    • 2015
  • PCB(Printed Circuit Board) 제조공정에서의 수율은 제품의 원가와 품질을 결정하는 중요한 관리 요인이다. PCB 제조공정은 일반적으로 많은 단계의 미세공정을 거쳐서 제품인 칩(Chip)이 생산되기 때문에 높은 수율을 보장하기가 현실적으로 어렵다. 제품의 수율을 향상시키기 위해서는 저수율의 원인이 되는 불량요인을 분석하고, 불량요인에 영향을 미치는 중요공정 및 설비를 찾아서 관리해야 한다. 본 연구는 로지스틱 회귀분석 및 변수선택법을 이용하여 혐의공정 및 설비를 찾는 방법을 제안하였다. 데이터는 실제 현장의 로트 데이터를 사용하였고, 각 로트는 진행한 설비 및 불량유형별 불량수를 갖고 있다. 또한 분석 결과는 실제 현장 확인을 통하여 수율에 미치는 영향을 확인하였다.

PCB 제조공정을 위한 화학약품 용액의 실시간 모니터링 시스템 (Real-time Chemical Monitoring System using RGB Sensor toward PCB Manufacturing)

  • 안종환;이석준;김이철;홍상진
    • 한국전기전자재료학회논문지
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    • 제21권5호
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    • pp.397-401
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    • 2008
  • Most of the topic in PCB industry was about increasing the volume of product for the development of electronics in numerous industrial application area. However, it has been emerged that yield improvement quality manufacturing via detecting any suspicious process in order to minimize the scrapped product and material waste. In addition, recently, restriction of hazardous substances (RoHS) claims that electronic manufacturing environment should reduce the harmful chemicals usage, thus the importance of monitoring copper etchant and detecting any mis-processing is crucial for electronics manufacturing. In this paper, we have developed real-time chemical monitoring system using RGB sensor, which is simpler but more accurate method than commercially utilized oxidation reduction potential (ORP) technique. The developed Cu etchant monitoring system can further be utilized for copper interconnect process in future nano-semiconductor process.