• 한국안전학회지
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• 제34권4호
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• pp.32-40
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• 2019

During the manufacturing process of a printed circuit board(PCB), fumes and mists are generated as the ink dries on the PCB surface. The generated fumes and mists are deposited in the dryer wall and the exhaust duct. Deposited fumes and mists may present a fire hazard if the dryer temperature control system fails. In this study, the thermal stability of the fumes and mists deposited in the dryer and ducts has been analyzed by experimental methods such as thermo gravimetric analysis (TGA), differential scanning calorimetry (DSC), auto ignition temperature (AIT), and multiple mode calorimetry(MMC). According to the experimental analyses, experimental samples are likely to generate gas at the temperature ($180{\sim}240^{\circ}C$) that deviates from the normal operating temperature ($150{\sim}156^{\circ}C$). It has been shown that the thermal stability is degraded when the temperature is deviated from the normal operating temperature. In the end, engineering and management safety measures of accidental prevention have been suggested.

• 자원리싸이클링
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• 제28권2호
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• pp.31-39
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• 2019

인쇄회로기판(PCB) 제조 공정 중 발생된 슬러지로부터 구리성분을 건식제련방법으로 회수하기 위해서 슬러지를 원료로 한 펠렛화 연구를 진행하였다. 슬러지 펠렛화를 위해 건조, 해쇄, 입도분급의 전처리 실시하였고, 혼합 및 압축장치를 포함한 펠렛화 기기를 개발하였다. 제조된 펠렛의 물리적 특성평가는, 슬러지 입도, 펠렛화 압축 횟수를 변화시키면서 비파괴 낙하횟수, 압축강도를 측정하였다. #140 mesh over의 입자를 제거한 경우, 펠렛의 특성은 0.6 MPa, 9.3회로 향상되었으며, 여기에 #325 under 입자를 한번 더 제거한 경우 0.82 MPa, 19.0회로 더욱 더 향상되었다. 이는 조립자의 경우, 충진밀도를 감소시키고, 미립자의 경우 성형에 요구되는 점결제의 투입량을 증가시키기 때문에 나타난 결과로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.421-421
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• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.