• 전력전자학회:학술대회논문집
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• 전력전자학회 2000년도 전력전자학술대회 논문집
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• pp.505-508
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• 2000

A coreless printed circuit board(PCB) transformer is employed in a contactless energy transfer circuit that achieves an efficient power conversion at the presence of a considerable airgap between the source and the load side. A half-bridge series resonant converter is selected as the contactless energy transfer circuit in order to minimize the detrimental effects of large leakage inductance small magnetizing inductance and poor coupling coefficient of the coreless PCB transformer. The operation and performance of the proposed contactless power converter are verified on a 7 W experimental circuit that provides an 18V/0.4A output from a 210-370 V input source.

• 한국경영과학회지
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• 제22권1호
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• pp.25-49
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• 1997

Printed circuit board (PCB) assembly line configuration is characterized by very long set-up times and high work in process (WIP) inventory level. The scheduling method can significantly reduce the set-up times and WIP inventory level. Greedy sequence dependent scheduling (GSDS) method is proposed based on the current methods. The proposed method is compared with the current method in terms of three performance measures: line throughput, average WIP inventory level, and implementation complexity.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.281-281
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• 2015

PCB(printed circuit board) 제조 공정이 복잡해지고 부품의 고집적화로 Chip, ICD 등 부품 및 가공 크기가 작아져 Open Fail, short 등 다양한 불량이 나타난다. 본 연구에서는 이러한 불량의 원인을 규명하고 해결하기 위하여, 전자현미경을 이용하여 불량 PCB 분석을 진행 하였다.

• 한국시뮬레이션학회:학술대회논문집
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• 한국시뮬레이션학회 1999년도 춘계학술대회 논문집
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• pp.122-126
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• 1999

시스템 레벨 PCB(Printed Circuit Board) 디자인은 최종적인 시스템 특성에 정확한 정보를 갖지 못하는 디자인 결정을 하기 위해 여러 가지 정보가 필요하다. 또한 분할 할 때 분할 시간과 방법은 매우 중요하고 합성 결과의 특성은 교환(tradeoffs)과 디자인 결정에 매우 민감하다. 그러므로 만일 디자인이 합성되고 단일 보드로 디자인된다 할지라도 후에 다중 보드로 분할 될 수 있다. 따라서 본 논문에서는 PCB회로 디자인의 제약구동 방법중 off-critical-path 분할기법을 사용한 휴리스틱(heuristic) 방법을 제안했고 교환 그래프 착색 알고리즘을 제안했다.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.73-77
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• 1999

Revolutionary changes on multimedia, network and PDA(Personal digital assistants) causes PCB(Printed circuit beard) manufacturers to change their attitudes to product. Traditional idea for current market such as price, market, and service has collapsed down and new digitalization urges PCB manufacturers to deal with new technologies, shorter lead time with reasonable price, high qualities. Therefore PCB manufacturers have an effort to develop new marketing, products, processes for low cost to keep up pace with assembly makers.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.288-289
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• 2012

이동통신, 전자부품의 고속송신에 따라 핵심으로 사용되는 인쇄회로기판(PCB, Printed Circuit Board)의 신뢰성을 향상시키기 위한 주석도금기술과 품질 향상이 요구되고 있다. 오랜 역사를 갖고 있는 습식전자부품 주석도금기술은 과거의 현장에서 기본원리, 도금액분석 등을 이수하는 정도였다. 최근 도금뿌리산업육성과 함께 PCB주석도금 신기술정보를 입수하여 현장품질기술지원이 필요하다. 이에 수시로 업그레이드되고 변화하고 있는 해외신기술동향과 특허정보를 지원하였다.

• 산업기술연구
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• 제21권B호
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• pp.67-74
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• 2001

According as the patterns of PCB (Printed Circuit Board) become denser and complicated, quality and accuracy of PCB influence the performance of final product. It's attempted to obtain trust of 100% about all of parts. Because human inspection in mass-production manufacturing facilities are both time-consuming and very expensive, the automation of visual inspection has been attempted for many years. Thus, automatic visual inspection of PCB is required. In this paper, we used an algorithm which compares the reference PCB patterns and the input PCB patterns are separated an object and a scene by filtering and edge detection. And than compare two image using pattern matching algorithm. We suggest an defect inspection algorithm in PCB pattern, to be satisfied low cost, high speed, high performance and flexibility on the basis of $640{\times}480$ binary pattern.

• 한국산학기술학회논문지
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• 제6권5호
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• pp.412-417
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• 2005

본 논문에서는 PCB의 제작 공정에 있어 기준구멍을 가공하기 위한 다축드릴머신의 PCB와 드릴날 간의 충돌시 힘을 구하여 설계에 반영한다 이는 PCB 가공을 대량생산에 적합하고 정확성을 높이기 위해 PCB용 다축드릴머신을 설계함에 있어 해석결과를 이용하여 안전성확보와 제작단가를 절감할 수 있다.

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.